Author: U. GöselePublisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
Author: U. GöselePublisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Proceedings of the ... International Symposium on Semiconductor Wafer Bonding
Author: Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524
Book Description
Proceedings of the Third International Symposium on Defects in Silicon
Author: Takao AbePublisher: The Electrochemical Society
ISBN: 9781566772235
Category : Science
Languages : en
Pages : 548
Book Description
Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices
Author: Robert B. ComizzoliPublisher: The Electrochemical Society
ISBN: 9781566770880
Category : Science
Languages : en
Pages : 436
Book Description
Proceedings of the Seventh International Symposium on Silicon-on-Insulator Technology and Devices
Author: Peter L. F. HemmentPublisher: The Electrochemical Society
ISBN: 9781566771535
Category : Science
Languages : en
Pages : 458
Book Description
Silicon-on-Insulator Technology and Devices X
Author: Electrochemical Society. Electronics DivisionPublisher: The Electrochemical Society
ISBN: 9781566773096
Category : Technology & Engineering
Languages : en
Pages : 482
Book Description
Handbook of Wafer Bonding
Author: Peter RammPublisher: John Wiley & Sons
ISBN: 3527326464
Category : Technology & Engineering
Languages : en
Pages : 435
Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author: Charles E. HuntPublisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 496
Book Description
Proceedings of the Third International Symposium on Diamond Materials
Author: John P. DismukesPublisher: The Electrochemical Society
ISBN: 9781566770606
Category : Nature
Languages : en
Pages : 1126
Book Description
Author: Donald E. Booth