Author: Electrochemical Society. Dielectric Science and Technology DivisionPublisher: The Electrochemical Society
ISBN: 9781566770774
Category : Science
Languages : en
Pages : 622
Book Description
Proceedings of the Tenth Symposium on Plasma Processing
Author: Electrochemical Society. Dielectric Science and Technology DivisionPublisher: The Electrochemical Society
ISBN: 9781566770774
Category : Science
Languages : en
Pages : 622
Book Description
Proceedings of the Eleventh International Symposium on Plasma Processing
Author: Electrochemical Society. Dielectric Science and Technology DivisionPublisher: The Electrochemical Society
ISBN: 9781566771641
Category : Plasma etching
Languages : en
Pages : 740
Book Description
Handbook of Advanced Plasma Processing Techniques
Author: R.J. ShulPublisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Thermal Spray 2007: Global Coating Solutions: Proceedings of the 2007 International Thermal Spray Conference
Author: Edited by Basil R. Marple, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, Ghislain MontavonPublisher: ASM International
ISBN: 1615031278
Category :
Languages : en
Pages : 1246
Book Description
Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
Author: Seiji SamukawaPublisher: Springer Science & Business Media
ISBN: 4431547959
Category : Technology & Engineering
Languages : en
Pages : 46
Book Description
This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.
Proceedings of the Tenth European Conference on Chemical Vapour Deposition, Venice, Italy, September 10-15, 1995
Author: Giovanni A BattisonPublisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 702
Book Description
IBM Journal of Research and Development
Author: Energy Research Abstracts
Author: Acid Precipitation
Author: Plasma and High Frequency Processes for Obtaining and Processing Materials in the Nuclear Fuel Cycle
Author: I. N. ToumanovPublisher: Nova Publishers
ISBN: 9781590330098
Category : Business & Economics
Languages : en
Pages : 628
Book Description
Plasma & High Frequency Processes for Obtaining & Processing Materials in the Nuclear Fuel Cycle