Author: Publisher:
ISBN:
Category : Electron beams
Languages : en
Pages : 646
Book Description
Proceedings of the ... Symposium on Electron, Ion and Laser Beam Technology
Author: Semiconductors and Semimetals
Author: Publisher: Academic Press
ISBN: 0080864074
Category : Technology & Engineering
Languages : en
Pages : 471
Book Description
Semiconductors and Semimetals
Proceedings of the Symposium on Thin Film Phenomena--Interfaces and Interactions
Author: John E. E. BaglinPublisher:
ISBN:
Category : Thin films
Languages : en
Pages : 544
Book Description
Extended Abstracts
Author: Electrochemical SocietyPublisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 766
Book Description
Influence of Temperature on Microelectronics and System Reliability
Author: Pradeep LallPublisher: CRC Press
ISBN: 0429605595
Category : Technology & Engineering
Languages : en
Pages : 332
Book Description
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Experimental Innovations in Surface Science
Author: John T. Yates Jr.Publisher: Springer
ISBN: 3319176684
Category : Science
Languages : en
Pages : 637
Book Description
This book is a new edition of a classic text on experimental methods and instruments in surface science. It offers practical insight useful to chemists, physicists, and materials scientists working in experimental surface science. This enlarged second edition contains almost 300 descriptions of experimental methods. The more than 50 active areas with individual scientific and measurement concepts and activities relevant to each area are presented in this book. The key areas covered are: Vacuum System Technology, Mechanical Fabrication Techniques, Measurement Methods, Thermal Control, Delivery of Adsorbates to Surfaces, UHV Windows, Surface Preparation Methods, High Area Solids, Safety. The book is written for researchers and graduate students.
Index of Conference Proceedings Received
Author: British Library. Lending DivisionPublisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 888
Book Description
Index of Conference Proceedings Received
Author: British Library. Document Supply CentrePublisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 792
Book Description
Catalog of Copyright Entries, Fourth Series
Author: Library of Congress. Copyright OfficePublisher:
ISBN:
Category : Copyright
Languages : en
Pages : 2158
Book Description
Electronics Packaging Forum
Author: James E. MorrisPublisher: Springer Science & Business Media
ISBN: 9400904398
Category : Technology & Engineering
Languages : en
Pages : 459
Book Description
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.