Author:
Publisher:
ISBN:
Category : Plasma engineering
Languages : en
Pages : 680
Book Description
Proceedings of the ... Symposium on Plasma Processing
Proceedings of the Tenth Symposium on Plasma Processing
Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher: The Electrochemical Society
ISBN: 9781566770774
Category : Science
Languages : en
Pages : 622
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566770774
Category : Science
Languages : en
Pages : 622
Book Description
Proceedings of the Eleventh International Symposium on Plasma Processing
Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher: The Electrochemical Society
ISBN: 9781566771641
Category : Plasma etching
Languages : en
Pages : 740
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771641
Category : Plasma etching
Languages : en
Pages : 740
Book Description
Proceedings of the Symposium on Plasma Processing
Author: International Symposium on Plasma Processing
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Plasma Processing XII
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566771986
Category : Science
Languages : en
Pages : 308
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771986
Category : Science
Languages : en
Pages : 308
Book Description
Proceedings of the 5th International Symposium on Plasma and Energy Conversion
Author: Zhi Fang
Publisher: Springer Nature
ISBN: 9819722454
Category :
Languages : en
Pages : 725
Book Description
Publisher: Springer Nature
ISBN: 9819722454
Category :
Languages : en
Pages : 725
Book Description
Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
Author: Seiji Samukawa
Publisher: Springer Science & Business Media
ISBN: 4431547959
Category : Technology & Engineering
Languages : en
Pages : 46
Book Description
This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.
Publisher: Springer Science & Business Media
ISBN: 4431547959
Category : Technology & Engineering
Languages : en
Pages : 46
Book Description
This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.
Handbook of Advanced Plasma Processing Techniques
Author: R.J. Shul
Publisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Publisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Proceedings of the Symposium on Plasma Processing
Author: International Symposium on Plasma Processing
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Chemical Abstracts Service Source Index
Author: American Chemical Society. Chemical Abstracts Service
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2064
Book Description
A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2064
Book Description
A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.