Author: Harzara S. RathorePublisher: The Electrochemical Society
ISBN: 9781566771849
Category : Computers
Languages : en
Pages : 292
Book Description
Proceedings of the Symposium on Interconnect and Contact Metallization
Author: Harzara S. RathorePublisher: The Electrochemical Society
ISBN: 9781566771849
Category : Computers
Languages : en
Pages : 292
Book Description
Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
Author: L. B. RothmanPublisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials
Author: T. O. HerndonPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Interconnect and Contact Metallization for ULSI
Author: G. S. MathadPublisher: The Electrochemical Society
ISBN: 9781566772549
Category : Science
Languages : en
Pages : 358
Book Description
Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I
Author: Electrochemical Society. Dielectric Science and Technology DivisionPublisher:
ISBN:
Category : Science
Languages : en
Pages : 290
Book Description
Proceedings of the Symposium on Electron and Ion Beam Science and Technology; International Conference
Author: Electromigration in Metals
Author: Paul S. HoPublisher: Cambridge University Press
ISBN: 1107032385
Category : Science
Languages : en
Pages : 433
Book Description
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Advanced Interconnects for ULSI Technology
Author: Mikhail BaklanovPublisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616
Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Noble and Precious Metals
Author: Mohindar SeehraPublisher: BoD – Books on Demand
ISBN: 1789232929
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.
Compound Semiconductors 1995, Proceedings of the Twenty-Second INT Symposium on Compound Semiconductors held in Cheju Island, Korea, 28 August-2 September, 1995
Author: Institute of Physics ConferencePublisher: CRC Press
ISBN: 1000112292
Category : Science
Languages : en
Pages : 1345
Book Description
Compound Semiconductors 1995 focuses on emerging applications for GaAs and other compound semiconductors, such as InP, GaN, GaSb, ZnSe, and SiC, in the electronics and optoelectronics industries. The book presents the research and development work in all aspects of compound semiconductors. It reflects the maturity of GaAs as a semiconductor material and the rapidly increasing pool of research information on many other compound semiconductors. Covering the full breadth of the subject, from growth through processing to devices and integrated circuits, this volume provides researchers in materials science, device physics, condensed matter physics, and electrical and electronic engineering with a comprehensive overview of developments in this well-established research area.