Author: Henry G. HughesPublisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 230
Book Description
Proceedings of the Symposium on Etching for Pattern Definition
Author: Henry G. HughesPublisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 230
Book Description
Proceedings of the Symposium on Electrochemical Technology in Electronics
Author: Lubomyr Taras RomankiwPublisher:
ISBN:
Category : Electrochemistry, Industrial
Languages : en
Pages : 832
Book Description
Proceedings of the ... International Symposium on Semiconductor Wafer Bonding
Author: Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524
Book Description
Proceedings of the Symposium on Nanostructured Materials in Electrochemistry
Author: Peter C. SearsonPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 294
Book Description
Microelectronic Packaging
Author: M. DattaPublisher: CRC Press
ISBN: 020347368X
Category : Technology & Engineering
Languages : en
Pages : 564
Book Description
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Proceedings of the Fourth International Symposium on Magnetic Materials, Processes, and Devices
Author: Lubomyr Taras RomankiwPublisher: The Electrochemical Society
ISBN: 9781566771139
Category : Computers
Languages : en
Pages : 820
Book Description
Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
Author: L. B. RothmanPublisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Proceedings of the Symposium on Inorganic Resist Systems
Author: Daryl Ann DoanePublisher:
ISBN:
Category : Photolithography
Languages : en
Pages : 328
Book Description
Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology: Applications in Electronics
Author: Madhav DattaPublisher: The Electrochemical Society
ISBN: 9781566771719
Category : Science
Languages : en
Pages : 312
Book Description
Proceedings of the Annual Symposium on Frequency Control
Author: Publisher:
ISBN:
Category : Oscillators, Crystal
Languages : en
Pages : 464
Book Description