Author: T. O. HerndonPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials
Author: T. O. HerndonPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
Cleaning Technology in Semiconductor Device Manufacturing
Author: Publisher: The Electrochemical Society
ISBN: 9781566772594
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Handbook for Cleaning for Semiconductor Manufacturing
Author: Karen A. ReinhardtPublisher: John Wiley & Sons
ISBN: 1118099516
Category : Technology & Engineering
Languages : en
Pages : 596
Book Description
Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Cleaning Technology in Semiconductor Device Manufacturing ...
Author: Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 636
Book Description
Optical Characterization Techniques for High-performance Microelectronic Device Manufacturing
Author: Index of Conference Proceedings
Author: Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 976
Book Description
Handbook of Thin Film Deposition
Author: Krishna SeshanPublisher: William Andrew
ISBN: 0815517785
Category : Technology & Engineering
Languages : en
Pages : 659
Book Description
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon
Author: Krishna SeshanPublisher: CRC Press
ISBN: 1482269686
Category : Science
Languages : en
Pages : 658
Book Description
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
Development of Conventional and Time-of-flight Neutron Depth Profiling at Cornell
Author: Zhiqiang LiProceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging
Author: James R. LloydPublisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
Book Description