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Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding PDF Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636

Book Description

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding PDF Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636

Book Description

Proceedings of the ... International Symposium on Semiconductor Wafer Bonding

Proceedings of the ... International Symposium on Semiconductor Wafer Bonding PDF Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524

Book Description

Semiconductor Wafer Bonding : Science, Technology, and Applications V

Semiconductor Wafer Bonding : Science, Technology, and Applications V PDF Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498

Book Description

Proceedings of the Fourth International Symposium on High Purity Silicon

Proceedings of the Fourth International Symposium on High Purity Silicon PDF Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566771566
Category : Science
Languages : en
Pages : 606

Book Description

Proceedings of the Fourth International Symposium of Process Physics and Modeling in Semiconductor Technology

Proceedings of the Fourth International Symposium of Process Physics and Modeling in Semiconductor Technology PDF Author: G. R. Srinivasan
Publisher: The Electrochemical Society
ISBN: 9781566771542
Category : Science
Languages : en
Pages : 546

Book Description

Semiconductor Wafer Bonding VII : Science, Technology, and Applications

Semiconductor Wafer Bonding VII : Science, Technology, and Applications PDF Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 408

Book Description

Semiconductor Wafer Bonding

Semiconductor Wafer Bonding PDF Author: H. Baumgart
Publisher: The Electrochemical Society
ISBN: 9781566773607
Category : Technology & Engineering
Languages : en
Pages : 310

Book Description

Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing

Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing PDF Author: Richard E. Novak
Publisher: The Electrochemical Society
ISBN: 9781566771153
Category : Technology & Engineering
Languages : en
Pages : 642

Book Description

Proceedings of the Second International Symposium on Process Control, Diagnostics, and Modeling in Semiconductor Manufacturing

Proceedings of the Second International Symposium on Process Control, Diagnostics, and Modeling in Semiconductor Manufacturing PDF Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566771368
Category : Technology & Engineering
Languages : en
Pages : 366

Book Description

Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies PDF Author: Markku Tilli
Publisher: William Andrew
ISBN: 0323312233
Category : Technology & Engineering
Languages : en
Pages : 827

Book Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
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