Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 622

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Book Description

Author: Andrey A. Radionov
Publisher: Springer Nature
ISBN: 3030548171
Category : Technology & Engineering
Languages : en
Pages : 1416

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Book Description
This book highlights recent findings in industrial, manufacturing and mechanical engineering, and provides an overview of the state of the art in these fields, mainly in Russia and Eastern Europe. A broad range of topics and issues in modern engineering are discussed, including the dynamics of machines and working processes, friction, wear and lubrication in machines, surface transport and technological machines, manufacturing engineering of industrial facilities, materials engineering, metallurgy, control systems and their industrial applications, industrial mechatronics, automation and robotics. The book gathers selected papers presented at the 6th International Conference on Industrial Engineering (ICIE), held in Sochi, Russia in May 2020. The authors are experts in various fields of engineering, and all papers have been carefully reviewed. Given its scope, the book will be of interest to a wide readership, including mechanical and production engineers, lecturers in engineering disciplines, and engineering graduates.

Author: Thomas Kang
Publisher: Springer Nature
ISBN: 9819753112
Category :
Languages : en
Pages : 451

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Book Description

Author: Pinakpani Pal
Publisher: World Scientific
ISBN: 9814475963
Category : Computers
Languages : en
Pages : 444

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Book Description
This volume contains the latest in the series of ICAPR proceedings on the state-of-the-art of different facets of pattern recognition. These conferences have already carved out a unique position among events attended by the pattern recognition community. The contributions tackle open problems in the classic fields of image and video processing, document analysis and multimedia object retrieval as well as more advanced topics in biometrics speech and signal analysis. Many of the papers focus both on theory and application driven basic research pattern recognition.

Author: Rajendra Prasad Mahapatra
Publisher: Springer Nature
ISBN: 9813345012
Category : Technology & Engineering
Languages : en
Pages : 834

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Book Description
This book is a collection of high-quality peer-reviewed research papers presented at Sixth International Conference on Recent Trends in Computing (ICRTC 2020) held at SRM Institute of Science and Technology, Ghaziabad, Delhi, India, during 3 – 4 July 2020. The book discusses a wide variety of industrial, engineering and scientific applications of the emerging techniques. The book presents original works from researchers from academic and industry in the field of networking, security, big data and the Internet of things.

Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 506

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Book Description

Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 0387473262
Category : Technology & Engineering
Languages : en
Pages : 553

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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 642

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Book Description

Author: Vijay Nath
Publisher: Springer Nature
ISBN: 981155546X
Category : Technology & Engineering
Languages : en
Pages : 1078

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Book Description
This book presents high-quality papers from the Fourth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2019). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.

Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250

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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.