Author: Publisher:
ISBN: 9780912053042
Category : Fracture mechanics
Languages : en
Pages : 931
Book Description
Proceedings of the 1985 SEM Spring Conference on Experimental Mechanics
Author: Publisher:
ISBN: 9780912053042
Category : Fracture mechanics
Languages : en
Pages : 931
Book Description
Proceedings of the 1994 SEM Spring Conference on Experimental Mechanics
Author: Spring Conference on Experimental MechanicsPublisher:
ISBN: 9780912053462
Category : Composite materials
Languages : en
Pages : 954
Book Description
Recent Advances in Experimental Mechanics
Author: E.E. GdoutosPublisher: Springer Science & Business Media
ISBN: 0306484102
Category : Science
Languages : en
Pages : 834
Book Description
This book contains 71 papers presented at the symposium on “Recent Advances in Experimental Mechanics” which was organized in honor of Professor Isaac M. Daniel. The symposium took place at Virginia Polytechnic Institute and State University on th June 23-28, 2002, in conjunction with the 14 US National Congress of Applied Mechanics. The book is a tribute to Isaac Daniel, a pioneer of experimental mechanics and composite materials, in recognition of his continuous, original, diversified and outstanding contributions for half a century. The book consists of invited papers written by leading experts in the field. It contains original contributions concerning the latest developments in experimental mechanics. It covers a wide range of subjects, including optical methods of stress analysis (photoelasticity, moiré, etc.), composite materials, sandwich construction, fracture mechanics, fatigue and damage, nondestructive evaluation, dynamic problems, fiber optic sensors, speckle metrology, digital image processing, nanotechnology, neutron diffraction and synchrotron radiation methods. The papers are arranged in the following nine sections: Mechanical characterization of material behavior, composite materials, fracture and fatigue, optical methods, n- destructive evaluation, neutron diffraction and synchrotron radiation methods, hybrid methods, composite structures, and structural testing and analysis.
Proceedings of the Society for Experimental Mechanics
Author: Society for Experimental Mechanics (U.S.)Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 408
Book Description
Experimental Stress Analysis
Author: H. WieringaPublisher: Springer Science & Business Media
ISBN: 9400944160
Category : Technology & Engineering
Languages : en
Pages : 624
Book Description
Designing and manufacturing structures of all kinds in an economic and a safe way is not possible without doing experimental stress analysis. The modernity of structures, with their higher reliability demands, as well as today's more stringent safety rules and extreme environmental conditions necessitate the improvement of the measuring technique and the introduction of new ones. Although theoretical/mathematical analysis is improving enormously, an example of which is the finite element model, it cannot replace experimental analysis and vice versa. Moreover, the mathematical analysis needs more and more accurate parameter data which in turn need improved experimental investigations. No one can do all those investigations on his own. Exchange of knowledge and experience in experimental stress analysis is a necessity, a thing acknowledged by every research worker. Therefore, the objective of the Permanent Committee for Stress Analysis (PC SA) is to promote the organization of conferences with the purpose disseminating new research and new measuring techniques as well as improvements in existing techniques, and furthermore, to promote the exchange of experiences of practical applications with techniques. rhis Vlllth International Conference on Experimental Stress Analysis on behalf of the PC SA is one in a series which started in 1959 at Delft (NL), and was followed by conferences at Paris (F), Berlin-W, Cambridge (~K), Udine (I), Munich (FRG) and Haifa (Isr.). Such a Conference will be held in Europe every fourth year, half-way bewteen the IUTAM Congresses.
Semiconductors and Semimetals
Author: Publisher: Academic Press
ISBN: 0080864341
Category : Technology & Engineering
Languages : en
Pages : 401
Book Description
Semiconductors and Semimetals
Applied Stress Analysis
Author: T.H. HydePublisher: Springer Science & Business Media
ISBN: 9400907796
Category : Technology & Engineering
Languages : en
Pages : 744
Book Description
This volume records the proceedings of an international conference organised as a tribute to the contribution made by Professor H. Fessler over the whole of his pro fessionallife, in the field of applied stress analysis. The conference, held at the Univer sity of Nottingham on 30 and 31 August 1990, was timed to coincide with the date of his formal retirement from the post of Professor of Experimental Stress Analysis in the University. The idea grew from discussions between some of Professor Fessler's academic associates from Nottingham and elsewhere. An organising committee was set up, and it was decided to invite contributions to the conference in the form of review papers and original research papers in the field of experimental, theoretical and computational stress analysis. The size of the response, both in papers submitted and in attendance at the conference, indicates that the idea proved attractive to many of his peers, former associates and research students. A bound copy of the volume is to be presented to Professor Fessler at the conference dinner on 30 August 1990.
Experimental and Applied Mechanics, Volume 6
Author: Tom ProulxPublisher: Springer Science & Business Media
ISBN: 144199792X
Category : Technology & Engineering
Languages : en
Pages : 859
Book Description
This the sixth volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 128 chapters on Experimental and Applied Mechanics. It presents early findings from experimental and computational investigations including High Accuracy Optical Measurements of Surface Topography, Elastic Properties of Living Cells, Standards for Validating Stress Analyses by Integrating Simulation and Experimentation, Efficiency Enhancement of Dye-sensitized Solar Cell, and Blast Performance of Sandwich Composites With Functionally Graded Core.
Modeling of Adhesively Bonded Joints
Author: Lucas F. M. da SilvaPublisher: Springer Science & Business Media
ISBN: 354079056X
Category : Science
Languages : en
Pages : 335
Book Description
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.
Author: