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Author: Cho Yen Ho Publisher: ASM International ISBN: 9781615032150 Category : Science Languages : en Pages : 330
Book Description
Provides a detailed examination of theory and techniques in thermal expansion of solids. Subjects include a generalized theory, estimation techniques and selected effects, temperature measurements in solids, thermal expansion by X-ray diffraction, high sensitivity expansivity measurement techniques,
Author: Cho Yen Ho Publisher: ASM International ISBN: 9781615032150 Category : Science Languages : en Pages : 330
Book Description
Provides a detailed examination of theory and techniques in thermal expansion of solids. Subjects include a generalized theory, estimation techniques and selected effects, temperature measurements in solids, thermal expansion by X-ray diffraction, high sensitivity expansivity measurement techniques,
Author: Publisher: ASM International ISBN: 9780871702852 Category : Technology & Engineering Languages : en Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Dorothea M. Johnson Publisher: ISBN: Category : Low temperatures Languages : en Pages : 182
Book Description
This report is a bibliography of the work reported in the literature on the effects of low temperature on the properties of structural materials. Some of the newer areas of cryogenic technology such as superconducting machinery involve environments which may subject the components to temperature as low as 4 K. Exposure of structural materials to such low temperatures affects their properties. This bibliography contains 963 references published between 1950-1976, arranged in chronological/alphabetical order. Combined material/property indexes are provided. (Author).
Author: Cho Yen Ho
Author: Cho Yen Ho
Author: David C. Larsen
Author: 国立国会図書館 (Japan)
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Author: U. Stimming
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Author: Dorothea M. Johnson
Author: Scripps Institution of Oceanography. Library