Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Proceedings of the 14th International Conference on Soft Computing and Pattern Recognition (SoCPaR 2022)
Author: Ajith Abraham
Publisher: Springer Nature
ISBN: 3031275241
Category : Technology & Engineering
Languages : en
Pages : 931
Book Description
This book highlights the recent research on soft computing, pattern recognition, nature-inspired computing, and their various practical applications. It presents 69 selected papers from the 14th International Conference on Soft Computing and Pattern Recognition (SoCPaR 2022) and 19 papers from the 14th World Congress on Nature and Biologically Inspired Computing (NaBIC 2022), which was held online, from December 14 to 16, 2022. A premier conference in the field of soft computing, artificial intelligence, and machine learning applications, SoCPaR-NaBIC 2022 brought together researchers, engineers, and practitioners whose work involves intelligent systems, network security, and their applications in industry. Including contributions by authors from over 25 countries, the book offers a valuable reference guide for all researchers, students, and practitioners in the fields of computer science and engineering.
Publisher: Springer Nature
ISBN: 3031275241
Category : Technology & Engineering
Languages : en
Pages : 931
Book Description
This book highlights the recent research on soft computing, pattern recognition, nature-inspired computing, and their various practical applications. It presents 69 selected papers from the 14th International Conference on Soft Computing and Pattern Recognition (SoCPaR 2022) and 19 papers from the 14th World Congress on Nature and Biologically Inspired Computing (NaBIC 2022), which was held online, from December 14 to 16, 2022. A premier conference in the field of soft computing, artificial intelligence, and machine learning applications, SoCPaR-NaBIC 2022 brought together researchers, engineers, and practitioners whose work involves intelligent systems, network security, and their applications in industry. Including contributions by authors from over 25 countries, the book offers a valuable reference guide for all researchers, students, and practitioners in the fields of computer science and engineering.
ISTFA 2010
Author:
Publisher: ASM International
ISBN: 1615037276
Category : Technology & Engineering
Languages : en
Pages : 487
Book Description
Publisher: ASM International
ISBN: 1615037276
Category : Technology & Engineering
Languages : en
Pages : 487
Book Description
ISTFA 2014
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Failure Analysis of Integrated Circuits
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
ISTFA 2009
Author:
Publisher: ASM International
ISBN: 1615030921
Category : Technology & Engineering
Languages : en
Pages : 371
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Publisher: ASM International
ISBN: 1615030921
Category : Technology & Engineering
Languages : en
Pages : 371
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
ISTFA 2012
Author: ASM International
Publisher: ASM International
ISBN: 1615039953
Category : Technology & Engineering
Languages : en
Pages : 643
Book Description
Publisher: ASM International
ISBN: 1615039953
Category : Technology & Engineering
Languages : en
Pages : 643
Book Description
Proceedings of the 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 306
Book Description
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 306
Book Description