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Author: ASM International Publisher: ASM International ISBN: 1627082735 Category : Technology & Engineering Languages : en Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: ASM International Publisher: ASM International ISBN: 1627082735 Category : Technology & Engineering Languages : en Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: Marius Bazu Publisher: John Wiley & Sons ISBN: 1119990009 Category : Technology & Engineering Languages : en Pages : 372
Book Description
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author: ASM International Publisher: ASM International ISBN: 1627080996 Category : Technology & Engineering Languages : en Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author: International Symposium on the Physical & Failure Analysis of Integrated Circuits Publisher: ISBN: 9780780377226 Category : Integrated circuits Languages : en Pages :
Author: Cornelius T. Leondes Publisher: Springer Science & Business Media ISBN: 0387257861 Category : Technology & Engineering Languages : en Pages : 2142
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Author: Miodrag Bolic Publisher: John Wiley & Sons ISBN: 0470975660 Category : Technology & Engineering Languages : en Pages : 549
Book Description
This book provides an insight into the 'hot' field of Radio Frequency Identification (RFID) Systems In this book, the authors provide an insight into the field of RFID systems with an emphasis on networking aspects and research challenges related to passive Ultra High Frequency (UHF) RFID systems. The book reviews various algorithms, protocols and design solutions that have been developed within the area, including most recent advances. In addition, authors cover a wide range of recognized problems in RFID industry, striking a balance between theoretical and practical coverage. Limitations of the technology and state-of-the-art solutions are identified and new research opportunities are addressed. Finally, the book is authored by experts and respected researchers in the field and every chapter is peer reviewed. Key Features: Provides the most comprehensive analysis of networking aspects of RFID systems, including tag identification protocols and reader anti-collision algorithms Covers in detail major research problems of passive UHF systems such as improving reading accuracy, reading range and throughput Analyzes other "hot topics" including localization of passive RFID tags, energy harvesting, simulator and emulator design, security and privacy Discusses design of tag antennas, tag and reader circuits for passive UHF RFID systems Presents EPCGlobal architecture framework, middleware and protocols Includes an accompanying website with PowerPoint slides and solutions to the problems http://www.site.uottawa.ca/~mbolic/RFIDBook/ This book will be an invaluable guide for researchers and graduate students in electrical engineering and computer science, and researchers and developers in telecommunication industry.
Author: ASM International
Author: ASM International
Author: 
Author: ASM International
Author: Marius Bazu
Author: ASM International
Author: International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: EDFAS Desk Reference Committee
Author: Cornelius T. Leondes
Author: Miodrag Bolic
Author: British Library. Document Supply Centre