Author:
Publisher: Allied Publishers
ISBN: 9788177647686
Category : Antennas (Electronics)
Languages : en
Pages : 726
Book Description
Proceedings of International conference on Antenna Technologies
Author:
Publisher: Allied Publishers
ISBN: 9788177647686
Category : Antennas (Electronics)
Languages : en
Pages : 726
Book Description
Publisher: Allied Publishers
ISBN: 9788177647686
Category : Antennas (Electronics)
Languages : en
Pages : 726
Book Description
Proceedings of First International Conference on Information and Communication Technology for Intelligent Systems: Volume 1
Author: Suresh Chandra Satapathy
Publisher: Springer
ISBN: 3319309331
Category : Technology & Engineering
Languages : en
Pages : 578
Book Description
This volume contains 59 papers presented at ICTIS 2015: International Conference on Information and Communication Technology for Intelligent Systems. The conference was held during 28th and 29th November, 2015, Ahmedabad, India and organized communally by Venus International College of Technology, Association of Computer Machinery, Ahmedabad Chapter and Supported by Computer Society of India Division IV – Communication and Division V – Education and Research. This volume contains papers mainly focused on ICT for Computation, Algorithms and Data Analytics etc.
Publisher: Springer
ISBN: 3319309331
Category : Technology & Engineering
Languages : en
Pages : 578
Book Description
This volume contains 59 papers presented at ICTIS 2015: International Conference on Information and Communication Technology for Intelligent Systems. The conference was held during 28th and 29th November, 2015, Ahmedabad, India and organized communally by Venus International College of Technology, Association of Computer Machinery, Ahmedabad Chapter and Supported by Computer Society of India Division IV – Communication and Division V – Education and Research. This volume contains papers mainly focused on ICT for Computation, Algorithms and Data Analytics etc.
Proceedings of Second International Conference on Computing, Communications, and Cyber-Security
Author: Pradeep Kumar Singh
Publisher: Springer Nature
ISBN: 9811607338
Category : Technology & Engineering
Languages : en
Pages : 1027
Book Description
This book features selected research papers presented at the Second International Conference on Computing, Communications, and Cyber-Security (IC4S 2020), organized in Krishna Engineering College (KEC), Ghaziabad, India, along with Academic Associates; Southern Federal University, Russia; IAC Educational, India; and ITS Mohan Nagar, Ghaziabad, India during 3–4 October 2020. It includes innovative work from researchers, leading innovators, and professionals in the area of communication and network technologies, advanced computing technologies, data analytics and intelligent learning, the latest electrical and electronics trends, and security and privacy issues.
Publisher: Springer Nature
ISBN: 9811607338
Category : Technology & Engineering
Languages : en
Pages : 1027
Book Description
This book features selected research papers presented at the Second International Conference on Computing, Communications, and Cyber-Security (IC4S 2020), organized in Krishna Engineering College (KEC), Ghaziabad, India, along with Academic Associates; Southern Federal University, Russia; IAC Educational, India; and ITS Mohan Nagar, Ghaziabad, India during 3–4 October 2020. It includes innovative work from researchers, leading innovators, and professionals in the area of communication and network technologies, advanced computing technologies, data analytics and intelligent learning, the latest electrical and electronics trends, and security and privacy issues.
PROCEEDINGS The 4th International Conference on Basic Sciences 2018
Author: Faculty of Mathematics and Natural Sciences (FMIPA) Pattimura University Ambon, Maluku, Indonesia
Publisher: Faculty of Mathematics and Natural Sciences Universitas Pattimura Ambon
ISBN: 6026164413
Category : Education
Languages : en
Pages : 146
Book Description
Welcome Message from the Chairman of ICBS 2018 On behalf of the organizing committee, it is a great pleasure to welcome all the participants and keynote speakers to the 4th International Conference Basic Science (ICBS) 2018 at the Pattimura University Ambon, Indonesia with theme "The Development of Science and Technology in Improving Natural and Cultural Resources". This theme aims to discuss the role of science and technology in increasing the use of natural resources and cultural development in the Maluku islands. This international forum also provides a platform where national and international academia or researchers, policy makers, and other stakeholders to translate technology, exchange ideas, and help stimulate multidisciplinary international collaborations in a convergent-manner for shaping a worldwide sustainable development. It is worth noting that, the 4thICBS event genuinely highlights the important of convergence of basic science research to address world’s sustainability challenges. The conference was attended by invited speakers from Hochschule Nordhausen University Germany; Kumamoto University, Japan; Indonesian Parrot Project; Institut Teknologi Sepuluh Nopember, Indonesia. There are250 participants, with poster participants 19 articles, oral presentations 51 articles and 185 non-presenter participants.This proceedings only contain 15 articles because the others has been selected to publish in international journal. We would like to acknowledge the terrific support of proceedings editorial team and reviewers in managing this proceedings book. We also would like to thank all participants who present their academic works in the 4th ICBS 2018, and especially to our distinguished invited speakers for their collaboration and contribution for the success of the 4thICBS 2018. Sincerely, Diana Julaidy Patty, S.Si., M.Sc Chairman of the committee Welcome Message from the Dean of the Faculty of Mathematics and Natural Sciences Assalamu’alaikum Warahmatullahi Wabarakatuh. Salam Sejahtera bagi kita semua. Om Swastiastu. Namo Buddhaya. On behalf of the Dean of Faculty of Mathematics and Natural Sciences, Universitas Pattimura, I would like to extend my warmest welcome to all delegates from all over the world. Welcome to Ambon–the city of music –in Indonesia. Ambon, surrounds by a hundred islands has many tourist destinations, highlands, mountains, and some natural beaches. We are very pleased to welcome you in the proceedings book of the 4th International Conference Basic Sciences2018. This proceedings is one of the continuations for the conference. Based on these papers, hopefully, more collaborations can be initiated or should be followed up between us. I would like to express my gratitude to all of the participants, keynote and invited speakers as well. Many thanks go to the reviewers and the editorial team for their big effort in supporting this book. My appreciation to the steering and organizing committees for realizing this book. Thank you Wassalamu ‘alaikum wr wb. Prof. Dr. Pieter Kakisina, S.Pd.,M.Si Dean Faculty of Mathematics and Natural Sciences
Publisher: Faculty of Mathematics and Natural Sciences Universitas Pattimura Ambon
ISBN: 6026164413
Category : Education
Languages : en
Pages : 146
Book Description
Welcome Message from the Chairman of ICBS 2018 On behalf of the organizing committee, it is a great pleasure to welcome all the participants and keynote speakers to the 4th International Conference Basic Science (ICBS) 2018 at the Pattimura University Ambon, Indonesia with theme "The Development of Science and Technology in Improving Natural and Cultural Resources". This theme aims to discuss the role of science and technology in increasing the use of natural resources and cultural development in the Maluku islands. This international forum also provides a platform where national and international academia or researchers, policy makers, and other stakeholders to translate technology, exchange ideas, and help stimulate multidisciplinary international collaborations in a convergent-manner for shaping a worldwide sustainable development. It is worth noting that, the 4thICBS event genuinely highlights the important of convergence of basic science research to address world’s sustainability challenges. The conference was attended by invited speakers from Hochschule Nordhausen University Germany; Kumamoto University, Japan; Indonesian Parrot Project; Institut Teknologi Sepuluh Nopember, Indonesia. There are250 participants, with poster participants 19 articles, oral presentations 51 articles and 185 non-presenter participants.This proceedings only contain 15 articles because the others has been selected to publish in international journal. We would like to acknowledge the terrific support of proceedings editorial team and reviewers in managing this proceedings book. We also would like to thank all participants who present their academic works in the 4th ICBS 2018, and especially to our distinguished invited speakers for their collaboration and contribution for the success of the 4thICBS 2018. Sincerely, Diana Julaidy Patty, S.Si., M.Sc Chairman of the committee Welcome Message from the Dean of the Faculty of Mathematics and Natural Sciences Assalamu’alaikum Warahmatullahi Wabarakatuh. Salam Sejahtera bagi kita semua. Om Swastiastu. Namo Buddhaya. On behalf of the Dean of Faculty of Mathematics and Natural Sciences, Universitas Pattimura, I would like to extend my warmest welcome to all delegates from all over the world. Welcome to Ambon–the city of music –in Indonesia. Ambon, surrounds by a hundred islands has many tourist destinations, highlands, mountains, and some natural beaches. We are very pleased to welcome you in the proceedings book of the 4th International Conference Basic Sciences2018. This proceedings is one of the continuations for the conference. Based on these papers, hopefully, more collaborations can be initiated or should be followed up between us. I would like to express my gratitude to all of the participants, keynote and invited speakers as well. Many thanks go to the reviewers and the editorial team for their big effort in supporting this book. My appreciation to the steering and organizing committees for realizing this book. Thank you Wassalamu ‘alaikum wr wb. Prof. Dr. Pieter Kakisina, S.Pd.,M.Si Dean Faculty of Mathematics and Natural Sciences
INTER-ENG 2020
Author: Liviu Moldovan
Publisher: MDPI
ISBN: 3036507167
Category : Technology & Engineering
Languages : en
Pages : 688
Book Description
These proceedings contain research papers that were accepted for presentation at the 14th International Conference Inter-Eng 2020 ,Interdisciplinarity in Engineering, which was held on 8–9 October 2020, in Târgu Mureș, Romania. It is a leading international professional and scientific forum for engineers and scientists to present research works, contributions, and recent developments, as well as current practices in engineering, which is falling into a tradition of important scientific events occurring at Faculty of Engineering and Information Technology in the George Emil Palade University of Medicine, Pharmacy Science, and Technology of Târgu Mures, Romania. The Inter-Eng conference started from the observation that in the 21st century, the era of high technology, without new approaches in research, we cannot speak of a harmonious society. The theme of the conference, proposing a new approach related to Industry 4.0, was the development of a new generation of smart factories based on the manufacturing and assembly process digitalization, related to advanced manufacturing technology, lean manufacturing, sustainable manufacturing, additive manufacturing, and manufacturing tools and equipment. The conference slogan was “Europe’s future is digital: a broad vision of the Industry 4.0 concept beyond direct manufacturing in the company”.
Publisher: MDPI
ISBN: 3036507167
Category : Technology & Engineering
Languages : en
Pages : 688
Book Description
These proceedings contain research papers that were accepted for presentation at the 14th International Conference Inter-Eng 2020 ,Interdisciplinarity in Engineering, which was held on 8–9 October 2020, in Târgu Mureș, Romania. It is a leading international professional and scientific forum for engineers and scientists to present research works, contributions, and recent developments, as well as current practices in engineering, which is falling into a tradition of important scientific events occurring at Faculty of Engineering and Information Technology in the George Emil Palade University of Medicine, Pharmacy Science, and Technology of Târgu Mures, Romania. The Inter-Eng conference started from the observation that in the 21st century, the era of high technology, without new approaches in research, we cannot speak of a harmonious society. The theme of the conference, proposing a new approach related to Industry 4.0, was the development of a new generation of smart factories based on the manufacturing and assembly process digitalization, related to advanced manufacturing technology, lean manufacturing, sustainable manufacturing, additive manufacturing, and manufacturing tools and equipment. The conference slogan was “Europe’s future is digital: a broad vision of the Industry 4.0 concept beyond direct manufacturing in the company”.
Modern Antenna Handbook
Author: Constantine A. Balanis
Publisher: John Wiley & Sons
ISBN: 1118209753
Category : Technology & Engineering
Languages : en
Pages : 1617
Book Description
The most up-to-date, comprehensive treatment of classical and modern antennas and their related technologies Modern Antenna Handbook represents the most current and complete thinking in the field of antennas. The handbook is edited by one of the most recognizable, prominent, and prolific authors, educators, and researchers on antennas and electromagnetics. Each chapter is authored by one or more leading international experts and includes cover-age of current and future antenna-related technology. The information is of a practical nature and is intended to be useful for researchers as well as practicing engineers. From the fundamental parameters of antennas to antennas for mobile wireless communications and medical applications, Modern Antenna Handbook covers everything professional engineers, consultants, researchers, and students need to know about the recent developments and the future direction of this fast-paced field. In addition to antenna topics, the handbook also covers modern technologies such as metamaterials, microelectromechanical systems (MEMS), frequency selective surfaces (FSS), and radar cross sections (RCS) and their applications to antennas, while five chapters are devoted to advanced numerical/computational methods targeted primarily for the analysis and design of antennas.
Publisher: John Wiley & Sons
ISBN: 1118209753
Category : Technology & Engineering
Languages : en
Pages : 1617
Book Description
The most up-to-date, comprehensive treatment of classical and modern antennas and their related technologies Modern Antenna Handbook represents the most current and complete thinking in the field of antennas. The handbook is edited by one of the most recognizable, prominent, and prolific authors, educators, and researchers on antennas and electromagnetics. Each chapter is authored by one or more leading international experts and includes cover-age of current and future antenna-related technology. The information is of a practical nature and is intended to be useful for researchers as well as practicing engineers. From the fundamental parameters of antennas to antennas for mobile wireless communications and medical applications, Modern Antenna Handbook covers everything professional engineers, consultants, researchers, and students need to know about the recent developments and the future direction of this fast-paced field. In addition to antenna topics, the handbook also covers modern technologies such as metamaterials, microelectromechanical systems (MEMS), frequency selective surfaces (FSS), and radar cross sections (RCS) and their applications to antennas, while five chapters are devoted to advanced numerical/computational methods targeted primarily for the analysis and design of antennas.
Proceedings of the 2nd International Conference on Signal and Data Processing
Author: K. P. Ray
Publisher: Springer Nature
ISBN: 9819914108
Category : Technology & Engineering
Languages : en
Pages : 597
Book Description
This volume comprises the select proceedings of the 2nd International Conference on Signal & Data Processing (ICSDP) 2022. The contents focus on the latest research and developments in the field of artificial intelligence & machine learning, Internet of things (IoT), cybernetics, advanced communication systems, VLSI embedded systems, power electronics and automation, MEMS/ nanotechnology, renewable energy, bioinformatics, data acquisition and mining, antenna & RF systems, power systems, biomedical engineering, aerospace & navigation. This volume will prove to be a valuable resource for those in academia and industry.
Publisher: Springer Nature
ISBN: 9819914108
Category : Technology & Engineering
Languages : en
Pages : 597
Book Description
This volume comprises the select proceedings of the 2nd International Conference on Signal & Data Processing (ICSDP) 2022. The contents focus on the latest research and developments in the field of artificial intelligence & machine learning, Internet of things (IoT), cybernetics, advanced communication systems, VLSI embedded systems, power electronics and automation, MEMS/ nanotechnology, renewable energy, bioinformatics, data acquisition and mining, antenna & RF systems, power systems, biomedical engineering, aerospace & navigation. This volume will prove to be a valuable resource for those in academia and industry.
Terahertz Antenna Technology for Imaging and Sensing Applications
Author: Isha Malhotra
Publisher: Springer Nature
ISBN: 3030689603
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
This book covers terahertz antenna technology for imaging and sensing, along with its various applications. The authors discuss the use of terahertz frequency and photoconductive antenna technology for imaging applications, such as biological and bio-medical applications, non-destructive inspection of fabrics and plastics, analysis of hydration levels or detecting the presence of metallic components in samples, and detecting a variety of materials with unique spectral fingerprints in the terahertz frequency range, such as different types of explosives or several compounds used in the fabrication of medicines. Provides a comprehensive review of terahertz source and detector for imaging and sensing; Discusses photoconductive antenna technology for imaging and sensing; Presents modalities for improving the photoconductive dipole antenna performance for imaging and sensing; Explores applications in tomographic imaging, art conservation and the pharmaceutical and aerospace industries.
Publisher: Springer Nature
ISBN: 3030689603
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
This book covers terahertz antenna technology for imaging and sensing, along with its various applications. The authors discuss the use of terahertz frequency and photoconductive antenna technology for imaging applications, such as biological and bio-medical applications, non-destructive inspection of fabrics and plastics, analysis of hydration levels or detecting the presence of metallic components in samples, and detecting a variety of materials with unique spectral fingerprints in the terahertz frequency range, such as different types of explosives or several compounds used in the fabrication of medicines. Provides a comprehensive review of terahertz source and detector for imaging and sensing; Discusses photoconductive antenna technology for imaging and sensing; Presents modalities for improving the photoconductive dipole antenna performance for imaging and sensing; Explores applications in tomographic imaging, art conservation and the pharmaceutical and aerospace industries.
Antenna-in-Package Technology and Applications
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556651
Category : Technology & Engineering
Languages : en
Pages : 492
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Publisher: John Wiley & Sons
ISBN: 1119556651
Category : Technology & Engineering
Languages : en
Pages : 492
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications
Author: Suresh Chandra Satapathy
Publisher: Springer
ISBN: 9811042802
Category : Technology & Engineering
Languages : en
Pages : 674
Book Description
The book is a collection of best papers presented in the Second International Conference on Microelectronics Electromagnetics and Telecommunication (ICMEET 2016), an international colloquium, which aims to bring together academic scientists, researchers and research scholars to discuss the recent developments and future trends in the fields of microelectronics, electromagnetics and telecommunication. Microelectronics research investigates semiconductor materials and device physics for developing electronic devices and integrated circuits with data/energy efficient performance in terms of speed, power consumption, and functionality. The book discusses various topics like analog, digital and mixed signal circuits, bio-medical circuits and systems, RF circuit design, microwave and millimeter wave circuits, green circuits and systems, analog and digital signal processing, nano electronics and giga scale systems, VLSI circuits and systems, SoC and NoC, MEMS and NEMS, VLSI digital signal processing, wireless communications, cognitive radio, and data communication.
Publisher: Springer
ISBN: 9811042802
Category : Technology & Engineering
Languages : en
Pages : 674
Book Description
The book is a collection of best papers presented in the Second International Conference on Microelectronics Electromagnetics and Telecommunication (ICMEET 2016), an international colloquium, which aims to bring together academic scientists, researchers and research scholars to discuss the recent developments and future trends in the fields of microelectronics, electromagnetics and telecommunication. Microelectronics research investigates semiconductor materials and device physics for developing electronic devices and integrated circuits with data/energy efficient performance in terms of speed, power consumption, and functionality. The book discusses various topics like analog, digital and mixed signal circuits, bio-medical circuits and systems, RF circuit design, microwave and millimeter wave circuits, green circuits and systems, analog and digital signal processing, nano electronics and giga scale systems, VLSI circuits and systems, SoC and NoC, MEMS and NEMS, VLSI digital signal processing, wireless communications, cognitive radio, and data communication.