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Author: Ali Jamnia Publisher: CRC Press ISBN: 1420065408 Category : Technology & Engineering Languages : en Pages : 332
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia Publisher: CRC Press ISBN: 1420065408 Category : Technology & Engineering Languages : en Pages : 332
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia Publisher: CRC Press ISBN: 1439870926 Category : Technology & Engineering Languages : en Pages : 336
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia Publisher: CRC Press ISBN: 9780824708658 Category : Technology & Engineering Languages : en Pages : 226
Book Description
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Author: Kuppan Thulukkanam Publisher: CRC Press ISBN: 1439842124 Category : Technology & Engineering Languages : en Pages : 1275
Book Description
Completely revised and updated to reflect current advances in heat exchanger technology, Heat Exchanger Design Handbook, Second Edition includes enhanced figures and thermal effectiveness charts, tables, new chapter, and additional topics––all while keeping the qualities that made the first edition a centerpiece of information for practicing engineers, research, engineers, academicians, designers, and manufacturers involved in heat exchange between two or more fluids. See What’s New in the Second Edition: Updated information on pressure vessel codes, manufacturer’s association standards A new chapter on heat exchanger installation, operation, and maintenance practices Classification chapter now includes coverage of scrapped surface-, graphite-, coil wound-, microscale-, and printed circuit heat exchangers Thorough revision of fabrication of shell and tube heat exchangers, heat transfer augmentation methods, fouling control concepts and inclusion of recent advances in PHEs New topics like EMbaffle®, Helixchanger®, and Twistedtube® heat exchanger, feedwater heater, steam surface condenser, rotary regenerators for HVAC applications, CAB brazing and cupro-braze radiators Without proper heat exchanger design, efficiency of cooling/heating system of plants and machineries, industrial processes and energy system can be compromised, and energy wasted. This thoroughly revised handbook offers comprehensive coverage of single-phase heat exchangers—selection, thermal design, mechanical design, corrosion and fouling, FIV, material selection and their fabrication issues, fabrication of heat exchangers, operation, and maintenance of heat exchangers —all in one volume.
Author: Ronald Huston Publisher: CRC Press ISBN: 1420017829 Category : Science Languages : en Pages : 664
Book Description
Updated and revised, this book presents the application of engineering design and analysis based on the approach of understanding the physical characteristics of a given problem and then modeling the important aspects of the physical system. This third edition provides coverage of new topics including contact stress analysis, singularity functions,
Author: Bryan R. Fischer Publisher: CRC Press ISBN: 1439863253 Category : Technology & Engineering Languages : en Pages : 510
Book Description
Use Tolerance Analysis Techniques to Avoid Design, Quality, and Manufacturing Problems Before They Happen Often overlooked and misunderstood, tolerance analysis is a critical part of improving products and their design processes. Because all manufactured products are subject to variation, it is crucial that designers predict and understand how these changes can affect form, fit, and function of parts and assemblies—and then communicate their findings effectively. Written by one of the developers of ASME Y14.5 and other geometric dimension and tolerancing (GD&T) standards, Mechanical Tolerance Stackup and Analysis, Second Edition offers an overview of techniques used to assess and convey the cumulative effects of variation on the geometric relationship between part and assembly features. The book focuses on some key components: it explains often misunderstood sources of variation and how they contribute to this deviation in assembled products, as well as how to model that variation in a useful manner. New to the Second Edition: Explores ISO and ASME GD&T standards—including their similarities and differences Covers new concepts and content found in ASME Y14.5-2009 standard Introduces six-sigma quality and tolerance analysis concepts Revamps figures throughout The book includes step-by-step procedures for solving tolerance analysis problems on products defined with traditional plus/minus tolerancing and GD&T. This helps readers understand potential variations, set up the problem, achieve the desired solution, and clearly communicate the results. With added application examples and features, this comprehensive volume will help design engineers enhance product development and safety, ensuring that parts and assemblies carry out their intended functions. It will also help manufacturing, inspection, assembly, and service personnel troubleshoot designs, verify that in-process steps meet objectives, and find ways to improve performance and reduce costs.
Author: Ronald F. Gibson Publisher: CRC Press ISBN: 1439850054 Category : Technology & Engineering Languages : en Pages : 686
Book Description
Principles of Composite Material Mechanics, Third Edition presents a unique blend of classical and contemporary mechanics of composites technologies. While continuing to cover classical methods, this edition also includes frequent references to current state-of-the-art composites technology and research findings. New to the Third Edition Many new worked-out example problems, homework problems, figures, and references An appendix on matrix concepts and operations Coverage of particle composites, nanocomposites, nanoenhancement of conventional fiber composites, and hybrid multiscale composites Expanded coverage of finite element modeling and test methods Easily accessible to students, this popular bestseller incorporates the most worked-out example problems and exercises of any available textbook on mechanics of composite materials. It offers a rich, comprehensive, and up-to-date foundation for students to begin their work in composite materials science and engineering. A solutions manual and PowerPoint presentations are available for qualifying instructors.
Author: Bryan R. Fischer Publisher: CRC Press ISBN: 1439815739 Category : Technology & Engineering Languages : en Pages : 504
Book Description
Use Tolerance Analysis Techniques to Avoid Design, Quality, and Manufacturing Problems Before They Happen Often overlooked and misunderstood, tolerance analysis is a critical part of improving products and their design processes. Because all manufactured products are subject to variation, it is crucial that designers predict and understand how thes
Author: V. Ganapathy Publisher: CRC Press ISBN: 1482247127 Category : Science Languages : en Pages : 544
Book Description
Incorporates Worked-Out Real-World Problems Steam Generators and Waste Heat Boilers: For Process and Plant Engineers focuses on the thermal design and performance aspects of steam generators, HRSGs and fire tube, water tube waste heat boilers including air heaters, and condensing economizers. Over 120 real-life problems are fully worked out which will help plant engineers in evaluating new boilers or making modifications to existing boiler components without assistance from boiler suppliers. The book examines recent trends and developments in boiler design and technology and presents novel ideas for improving boiler efficiency and lowering gas pressure drop. It helps plant engineers understand and evaluate the performance of steam generators and waste heat boilers at any load. Learn How to Independently Evaluate the Thermal Performance of Boilers and Their Components This book begins with basic combustion and boiler efficiency calculations. It then moves on to estimation of furnace exit gas temperature (FEGT), furnace duty, view factors, heat flux, and boiler circulation calculations. It also describes trends in large steam generator designs such as multiple-module; elevated drum design types of boilers such as D, O, and A; and forced circulation steam generators. It illustrates various options to improve boiler efficiency and lower operating costs. The author addresses the importance of flue gas analysis, fire tube versus water tube boilers used in chemical plants, and refineries. In addition, he describes cogeneration systems; heat recovery in sulfur plants, hydrogen plants, and cement plants; and the effect of fouling factor on performance. The book also explains HRSG simulation process and illustrates calculations for complete performance evaluation of boilers and their components. Helps plant engineers make independent evaluations of thermal performance of boilers before purchasing them Provides numerous examples on boiler thermal performance calculations that help plant engineers develop programming codes with ease Follows the metric and SI system, and British units are shown in parentheses wherever possible Includes calculation procedures for the basic sizing and performance evaluation of a complete steam generator or waste heat boiler system and their components with appendices outlining simplified procedures for estimation of heat transfer coefficients Steam Generators and Waste Heat Boilers: For Process and Plant Engineers serves as a source book for plant engineers, consultants, and boiler designers.
Author: Dale Ensminger Publisher: CRC Press ISBN: 100075572X Category : Mathematics Languages : en Pages : 768
Book Description
The book provides a unique and comprehensive treatment of the science, technology, and applications for industrial and medical ultrasonics, including low- and high-power implementations. The discussion of applications is combined with the fundamental physics, the reporting of the sensors/transducers, and systems for the full spectrum of industrial, nondestructive testing, and medical/bio-medical uses. It includes citations of numerous references and covers both mainstream and the more unusual and obscure applications of ultrasound.
Author: Ali Jamnia
Author: Ali Jamnia
Author: Ali Jamnia
Author: Ali Jamnia
Author: Kuppan Thulukkanam
Author: Ronald Huston
Author: Bryan R. Fischer
Author: Ronald F. Gibson
Author: Bryan R. Fischer
Author: V. Ganapathy
Author: Dale Ensminger