Thermal and Power Management of Integrated Circuits PDF Download

Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188

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Book Description
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author: Jose L. Ayala
Publisher: Springer
ISBN: 3642241549
Category : Computers
Languages : en
Pages : 362

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Book Description
This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.

Author: Yue Fu
Publisher: CRC Press
ISBN: 1351831712
Category : Technology & Engineering
Languages : en
Pages : 366

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Book Description
From power electronics to power integrated circuits (PICs), smart power technologies, devices, and beyond, Integrated Power Devices and TCAD Simulation provides a complete picture of the power management and semiconductor industry. An essential reference for power device engineering students and professionals, the book not only describes the physics inside integrated power semiconductor devices such lateral double-diffused metal oxide semiconductor field-effect transistors (LDMOSFETs), lateral insulated-gate bipolar transistors (LIGBTs), and super junction LDMOSFETs but also delivers a simple introduction to power management systems. Instead of abstract theoretical treatments and daunting equations, the text uses technology computer-aided design (TCAD) simulation examples to explain the design of integrated power semiconductor devices. It also explores next generation power devices such as gallium nitride power high electron mobility transistors (GaN power HEMTs). Including a virtual process flow for smart PIC technology as well as a hard-to-find technology development organization chart, Integrated Power Devices and TCAD Simulation gives students and junior engineers a head start in the field of power semiconductor devices while helping to fill the gap between power device engineering and power management systems.

Author: José Monteiro
Publisher: Springer Science & Business Media
ISBN: 3642118011
Category : Computers
Languages : en
Pages : 380

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Book Description
This book constitutes the thoroughly refereed post-conference proceedings of 19th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2009, featuring Integrated Circuit and System Design, held in Delft, The Netherlands during September 9-11, 2009. The 26 revised full papers and 10 revised poster papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on variability & statistical timing, circuit level techniques, power management, low power circuits & technology, system level techniques, power & timing optimization techniques, self-timed circuits, low power circuit analysis & optimization, and low power design studies.

Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Author: Rohit Sharma
Publisher: CRC Press
ISBN: 1351831593
Category : Technology & Engineering
Languages : en
Pages : 328

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Book Description
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author: Samee U. Khan
Publisher: Springer
ISBN: 1493920928
Category : Computers
Languages : en
Pages : 1309

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Book Description
This handbook offers a comprehensive review of the state-of-the-art research achievements in the field of data centers. Contributions from international, leading researchers and scholars offer topics in cloud computing, virtualization in data centers, energy efficient data centers, and next generation data center architecture. It also comprises current research trends in emerging areas, such as data security, data protection management, and network resource management in data centers. Specific attention is devoted to industry needs associated with the challenges faced by data centers, such as various power, cooling, floor space, and associated environmental health and safety issues, while still working to support growth without disrupting quality of service. The contributions cut across various IT data technology domains as a single source to discuss the interdependencies that need to be supported to enable a virtualized, next-generation, energy efficient, economical, and environmentally friendly data center. This book appeals to a broad spectrum of readers, including server, storage, networking, database, and applications analysts, administrators, and architects. It is intended for those seeking to gain a stronger grasp on data center networks: the fundamental protocol used by the applications and the network, the typical network technologies, and their design aspects. The Handbook of Data Centers is a leading reference on design and implementation for planning, implementing, and operating data center networks.

Author: Jorge Juan Chico
Publisher: Springer Science & Business Media
ISBN: 3540200746
Category : Computers
Languages : en
Pages : 647

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Book Description
This book constitutes the refereed proceedings of the 13th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2003, held in Torino, Italy in September 2003. The 43 revised full papers and 18 revised poster papers presented together with three keynote contributions were carefully reviewed and selected from 85 submissions. The papers are organized in topical sections on gate-level modeling and characterization, interconnect modeling and optimization, asynchronous techniques, RTL power modeling and memory optimization, high-level modeling, power-efficient technologies and designs, communication modeling and design, and low-power issues in processors and multimedia.

Author: Lars Svensson
Publisher: Springer
ISBN: 3540959483
Category : Computers
Languages : en
Pages : 474

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Book Description
Welcome to the proceedings of PATMOS 2008, the 18th in a series of int- national workshops. PATMOS 2008 was organized by INESC-ID / IST - TU Lisbon, Portugal, with sponsorship by Cadence, IBM, Chipidea, and Tecmic, and technical co-sponsorship by the IEEE. Over the years, PATMOS has evolved into an important European event, where researchers from both industry and academia discuss and investigate the emerging challenges in future and contemporary applications, design meth- ologies, and tools required for the development of the upcoming generations of integrated circuits and systems. The technical program of PATMOS 2008 c- tained state-of-the-art technical contributions, three invited talks, and a special session on recon?gurable architectures. The technical program focused on t- ing, performance and power consumption, as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and op- mization in the nanometer era. The Technical Program Committee, with the assistance of additional expert reviewers, selected the 41 papers presented at PATMOS. The papers were - ganized into 7 oral sessions (with a total of 31 papers) and 2 poster sessions (with a total of 10 papers). As is customary for the PATMOS workshops, full papers were required for review, and a minimum of three reviews were received per manuscript.

Author: Itamar Levi
Publisher: Springer Nature
ISBN: 3030407861
Category : Technology & Engineering
Languages : en
Pages : 191

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Book Description
This book presents Dual Mode Logic (DML), a new design paradigm for digital integrated circuits. DML logic gates can operate in two modes, each optimized for a different metric. Its on-the-fly switching between these operational modes at the gate, block and system levels provide maximal E-D optimization flexibility. Each highly detailed chapter has multiple illustrations showing how the DML paradigm seamlessly implements digital circuits that dissipate less energy while simultaneously improving performance and reducing area without a significant compromise in reliability. All the facets of the DML methodology are covered, starting from basic concepts, through single gate optimization, general module optimization, design trade-offs and new ways DML can be integrated into standard design flows using standard EDA tools. DML logic is compatible with numerous applications but is particularly advantageous for ultra-low power, reliable high performance systems, and advanced scaled technologies Written in language accessible to students and design engineers, each topic is oriented toward immediate application by all those interested in an alternative to CMOS logic. Describes a novel, promising alternative to conventional CMOS logic, known as Dual Mode Logic (DML), with which a single gate can be operated selectively in two modes, each optimized for a different metric (e.g., energy consumption, performance, size); Demonstrates several techniques at the architectural level, which can result in high energy savings and improved system performance; Focuses on the tradeoffs between power, area and speed including optimizations at the transistor and gate level, including alternatives to DML basic cells; Illustrates DML efficiency for a variety of VLSI applications.