Author: Raj Nair Publisher: ISBN: Category : Languages : en Pages : 433
Book Description
This is the eBook version of the printed book. If the print book includes a CD-ROM, this content is not included within the eBook version. New Techniques and Tools for Ensuring On-Chip Power Integrity-Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on.
Author: Raj Nair Publisher: Prentice Hall ISBN: 9780134185958 Category : Integrated circuits Languages : en Pages : 432
Book Description
New Techniques and Tools for Ensuring On-Chip Power Integrity--Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free atanasim.com/category/software. The authors Systematically explore power integrity implications, analysis, and management for integrated circuits Present practical examples and industry best practices for a broad spectrum of chip design applications Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation Power Integrity Analysis and Management for Integrated Circuits ' coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design--especially those working at the nanoscale level.
Author: Eric Bogatin Publisher: Pearson Education ISBN: 0132349795 Category : Technology & Engineering Languages : en Pages : 793
Book Description
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
Author: Masanori Hashimoto Publisher: McGraw Hill Professional ISBN: 0071787771 Category : Technology & Engineering Languages : en Pages : 417
Book Description
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Author: Madhavan Swaminathan Publisher: Pearson Education ISBN: 0132797178 Category : Technology & Engineering Languages : en Pages : 597
Book Description
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Author: Inna P. Vaisband Publisher: Springer ISBN: 3319293958 Category : Technology & Engineering Languages : en Pages : 750
Book Description
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author: Mona M. Hella Publisher: CRC Press ISBN: 1315355981 Category : Technology & Engineering Languages : en Pages : 376
Book Description
Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.
Author: Er-Ping Li Publisher: John Wiley & Sons ISBN: 0470623462 Category : Technology & Engineering Languages : en Pages : 394
Book Description
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Author: Wing-Hung Ki Publisher: Wiley-IEEE Press ISBN: 9780470827772 Category : Technology & Engineering Languages : en Pages : 0
Book Description
A timely one-stop pioneering book presenting all four major power management integrated circuits Existing analog IC books usually focus on amplifier and comparator designs, with some extend to switched capacitor filter designs and analog-to-digital and digital-to-analog converters design. There is no book yet on power management integrated circuits. Ki’s book fills the void. This self-contained book discusses all fundamental concepts in switching converters, low dropout regulators, charge pumps and voltage references systematically, and in the context of analog integrated circuit design. Furthermore, concepts are discussed in both qualitative and quantitative aspects. Qualitative understanding is important in getting the essential operation of a circuit, but quantitative analysis supplies the solid foundation on which qualitative discussion is based. First book covering all four major power management circuits All concepts discussed in both qualitative and quantitative aspects Written as a self-contained text – well-organized and systematic Authored by a pioneering scientist in the field Supplementary instructional materials available for lecturers MATLAB simulation code for readers to download and practice on their own
Author: Sung Kyu Lim Publisher: Springer Science & Business Media ISBN: 1441995420 Category : Technology & Engineering Languages : en Pages : 573
Book Description
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Author: Raj Nair
Author: Raj Nair
Author: Eric Bogatin
Author: Masanori Hashimoto
Author: Madhavan Swaminathan
Author: Inna P. Vaisband
Author: Mona M. Hella
Author: Er-Ping Li
Author: Wing-Hung Ki
Author: Sung Kyu Lim