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Author: Bruce M. Clemens Publisher: Cambridge University Press ISBN: 9781107413122 Category : Technology & Engineering Languages : en Pages : 204
Book Description
The unprecedented growth in the semiconductor, electronics, and storage industries is the result of continued miniaturization of circuit devices, increases in chip functionality, and increased storage capacity and performance, along with a decrease in per-function cost. Hardware shrinkage has taken place leading to similar decreases in the dimensions of interconnection wires, contact metallization, and magnetic storage footprints. The important role of surfaces, interfaces, defects, and impurities has raised serious materials questions about how to control the properties of polycrystalline thin films used in applications requiring tight performance tolerances and the understanding of these, during the evolution of various film properties with time and temperature, is critical to the successful design and development of smaller devices. This book, first published in 2001, focuses on the directions taken to understand and control the properties of polycrystalline materials. Topics include: magnetic thin films and structures; polycrystalline metal films - microstructure and grain evolution and stress and mechanical properties of thin films.
Author: Bruce M. Clemens Publisher: Cambridge University Press ISBN: 9781107413122 Category : Technology & Engineering Languages : en Pages : 204
Book Description
The unprecedented growth in the semiconductor, electronics, and storage industries is the result of continued miniaturization of circuit devices, increases in chip functionality, and increased storage capacity and performance, along with a decrease in per-function cost. Hardware shrinkage has taken place leading to similar decreases in the dimensions of interconnection wires, contact metallization, and magnetic storage footprints. The important role of surfaces, interfaces, defects, and impurities has raised serious materials questions about how to control the properties of polycrystalline thin films used in applications requiring tight performance tolerances and the understanding of these, during the evolution of various film properties with time and temperature, is critical to the successful design and development of smaller devices. This book, first published in 2001, focuses on the directions taken to understand and control the properties of polycrystalline materials. Topics include: magnetic thin films and structures; polycrystalline metal films - microstructure and grain evolution and stress and mechanical properties of thin films.
Author: David E. Laughlin Publisher: Cambridge University Press ISBN: 9781558994690 Category : Technology & Engineering Languages : en Pages : 0
Book Description
The unprecedented growth in the semiconductor, electronics and storage industries is the result of continued miniaturization of circuit devices, increases in chip functionality, and increased storage capacity and performance, along with a decrease in per-function cost. Hardware shrinkage has taken place, leading to similar decreases in the dimensions of interconnection wires, contact metallization and magnetic storage footprints. The increasingly important role of surfaces, interfaces, defects and impurities has raised serious materials questions about how to control the properties of polycrystalline thin films used in applications requiring tight performance tolerances. The understanding of polycrystalline film structures during growth, and the evolution of various film properties with time and temperature, is critical to the successful design and development of smaller devices. This book, first published in 1999, highlights the directions taken to understand and control the properties of polycrystalline materials. Topics include: magnetic thin films; microstructure, texture and stress; copper microstructure; nanocrystalline magnetic thin films and thin-film permanent magnets.
Author: Surajit Sen Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 338
Book Description
These 38 papers from the April 2000 symposium study granular structure, granular flows, nonlinear waves in granular media, vibrated and rotated granular media, and stress distributions. Topics include jamming in liquids and granular materials, nuclear magnetic resonance studies of granular flows, the blueprint of a concept for a nozzle- free inkjet printer, mixing and segregation processes in a Turbula blender, persistence of granular structure during die compaction of ceramic powders, and humidity-induced cohesion effects in granular media. c. Book News Inc.
Author: R. J. Shul Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 578
Book Description
Interest in wide-bandgap semiconductors for high-power/high-temperature electronics remains prominent. For such applications, SiC is by far the most mature semiconductor material. GaN and diamond, however, have also become prime candidates. While diamond has several advantages over the other two materials, producing large single crystals, as well as the inability to achieve n-type doping, have limited device fabrication. For GaN, recent advances in crystal growth and processing capabilities, as well as excellent transport properties, have yielded a great deal of device development, yet thermal conduction remains an issue. SiC has excellent thermal conductivity, high-breakdown voltages, and well-developed substrates and processing techniques. This book deals with a wide range of technical activity in the area of wide-bandgap high-power/high-temperature electronic devices and covers topics including the fabrication and performance of GaN-based and SiC-based devices, as well as issues related to growth, characterization, and processing of wide-bandgap materials. Several summaries of the current status of the field are provided.
Author: Bruce M. Clemens
Author: Bruce M. Clemens
Author: Bruce M. Clemens
Author: 
Author: David E. Laughlin
Author: Stephen C. Danforth
Author: Robert W. Collins
Author: Materials Research Society. Fall Meeting
Author: Surajit Sen
Author: Kazumi Wada
Author: R. J. Shul