Author: Marco HaverlagPublisher:
ISBN:
Category :
Languages : en
Pages : 133
Book Description
Plasma Chemistry of Fluorocarbon RF Discharges Used for Dry Etching
Author: Marco HaverlagScientific and Technical Aerospace Reports
Author: Dry Etching for VLSI
Author: A.J. van RoosmalenPublisher: Springer Science & Business Media
ISBN: 148992566X
Category : Science
Languages : en
Pages : 247
Book Description
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Plasma Etching and Reactive Ion Etching
Author: J. W. CoburnPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 104
Book Description
Plasma Etching
Author: M. SugawaraPublisher: OUP Oxford
ISBN: 0191590290
Category : Technology & Engineering
Languages : en
Pages : 362
Book Description
The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.
Handbook of Advanced Plasma Processing Techniques
Author: R.J. ShulPublisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Plasma Processing
Author: R. G. FrieserPublisher:
ISBN:
Category : Plasma engineering
Languages : en
Pages : 380
Book Description
Plasma Etching of Dielectirc [dielectric] Materials Using Inductively and Capacitively Coupled Fluorocarbon Discharges: Mechanistic Studies of the Surface Chemistry
![Plasma Etching of Dielectirc [dielectric] Materials Using Inductively and Capacitively Coupled Fluorocarbon Discharges: Mechanistic Studies of the Surface Chemistry PDF](https://books.google.com/books/content/images/frontcover/DOckvgAACAAJ?fife=w80-h100)
Author: Dusty Plasmas
Author: André BouchoulePublisher: John Wiley & Sons
ISBN:
Category : Science
Languages : en
Pages : 430
Book Description
Dusty Plasmas Physics, Chemistry and Technological Impacts in Plasma Processing Edited by André Bouchoule Université d'Orléans, France Dusty Plasmas gives the reader a thorough overview of current knowledge on many aspects of the subject, from the basic science to technological implications. The basic physics and chemistry of dusty plasmas developed in the first two chapters are complemented by the more practical considerations of diagnostics and technological implications in the two final chapters. The book will be of interest to those already involved in or just discovering dusty plasmas in their research and/or industrial activity. * Physics and Modelling of Dusty Plasmas * Sources and Growth of Particles * Diagnostics of a Dusty Plasma * Technological Impacts of Dusty Plasmas
Author: