Author: Allen M. Earman
Publisher: Society of Photo Optical
ISBN: 9780819465917
Category : Technology & Engineering
Languages : en
Pages : 274
Book Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Photonics Packaging, Integration, and Interconnects VII
Author: Allen M. Earman
Publisher: Society of Photo Optical
ISBN: 9780819465917
Category : Technology & Engineering
Languages : en
Pages : 274
Book Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Publisher: Society of Photo Optical
ISBN: 9780819465917
Category : Technology & Engineering
Languages : en
Pages : 274
Book Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Photonics Packaging, Integration, and Interconnects
Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 286
Book Description
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 286
Book Description
Optoelectronic Interconnects VII ; Photonics Packaging and Integration II
Author: Michael R. Feldman
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
Photonics Packaging, Integration, and Interconnects IX
Photonics Packaging, Integration, and Interconnects IX
Author: Alexei L. Glebov
Publisher: Society of Photo Optical
ISBN: 9780819474674
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
Includes Proceedings Vol. 7821
Publisher: Society of Photo Optical
ISBN: 9780819474674
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
Includes Proceedings Vol. 7821
Photonics Packaging and Integration
Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 272
Book Description
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 272
Book Description
Photonics Packaging, Integration, and Interconnects VIII
Author: Alexei L. Glebov
Publisher: Society of Photo Optical
ISBN: 9780819470744
Category : Technology & Engineering
Languages : en
Pages : 364
Book Description
Includes Proceedings Vol. 7821
Publisher: Society of Photo Optical
ISBN: 9780819470744
Category : Technology & Engineering
Languages : en
Pages : 364
Book Description
Includes Proceedings Vol. 7821
High-Speed Photonics Interconnects
Author: Lukas Chrostowski
Publisher: CRC Press
ISBN: 1466516046
Category : Computers
Languages : en
Pages : 223
Book Description
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Publisher: CRC Press
ISBN: 1466516046
Category : Computers
Languages : en
Pages : 223
Book Description
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Optical Fiber Telecommunications Volume VIA
Author: Ivan Kaminow
Publisher: Academic Press
ISBN: 0123972353
Category : Technology & Engineering
Languages : en
Pages : 795
Book Description
Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Publisher: Academic Press
ISBN: 0123972353
Category : Technology & Engineering
Languages : en
Pages : 795
Book Description
Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Optical Fiber Telecommunications VIA
Author: Nikos Bamiedakis
Publisher: Elsevier Inc. Chapters
ISBN: 0128060654
Category : Technology & Engineering
Languages : en
Pages : 65
Book Description
Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost. Projected performance requirements are leading to formidable cost and energy efficiency challenges. Hybrid and integrated photonic technologies are currently being developed to reduce assembly complexity and to reduce the numbers of individually packaged parts. This chapter provides an overview of the important challenges that photonics currently face, identifies the various optical technologies that are being considered for use at the different interconnection levels, and presents examples of demonstrated state-of-the-art optical interconnection systems. Finally, the prospects and potential of these technologies in the near future are discussed.
Publisher: Elsevier Inc. Chapters
ISBN: 0128060654
Category : Technology & Engineering
Languages : en
Pages : 65
Book Description
Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost. Projected performance requirements are leading to formidable cost and energy efficiency challenges. Hybrid and integrated photonic technologies are currently being developed to reduce assembly complexity and to reduce the numbers of individually packaged parts. This chapter provides an overview of the important challenges that photonics currently face, identifies the various optical technologies that are being considered for use at the different interconnection levels, and presents examples of demonstrated state-of-the-art optical interconnection systems. Finally, the prospects and potential of these technologies in the near future are discussed.