Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :

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Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 430

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Author: John R Thome
Publisher: World Scientific
ISBN: 9813227427
Category : Technology & Engineering
Languages : en
Pages : 1460

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Book Description
Set III of this encyclopedia is a new addition to the previous Sets I and II. It contains 26 invited chapters from international specialists on the topics of numerical modeling of two-phase flows and evaporation, fundamentals of evaporation and condensation in microchannels and macrochannels, development and testing of micro two-phase cooling systems for electronics, and various special topics (surface wetting effects, microfin tubes, two-phase flow vibration across tube bundles). The chapters are written both by renowned university researchers and by well-known engineers from leading corporate research laboratories. Numerous 'must read' chapters cover the fundamentals of research and engineering practice on boiling, condensation and two-phase flows, two-phase heat transfer equipment, electronics cooling systems, case studies and so forth. Set III constitutes a 'must have' reference together with Sets I and II for thermal engineering researchers and practitioners.

Author: Márta Rencz
Publisher: MDPI
ISBN: 3039217364
Category : Technology & Engineering
Languages : en
Pages : 222

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Book Description
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.

Author: Kaveh Azar
Publisher: Advanced Thermal Solutions
ISBN: 0984627928
Category : Science
Languages : en
Pages : 182

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Book Description
The complete editorial contents of Qpedia Thermal 4, Issues 1 - 12 features 48 in-depth articles that discuss critical case studies, calculations and analysis for thermal engineering professionals and academia.

Author: Yasuo Koizumi
Publisher: Elsevier
ISBN: 0081011172
Category : Technology & Engineering
Languages : en
Pages : 849

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Book Description
Boiling: Research and Advances presents the latest developments and improvements in the technologies, instrumentation, and equipment surrounding boiling. Presented by the Japan Society of Mechanical Engineers, the book takes a holistic approach, first providing principles, and then numerous practical applications that consider size scales. Through six chapters, the book covers contributed sections from knowledgeable specialists on various topics, ranging from outlining boiling phenomena and heat transfer characteristics, to the numerical simulation of liquid-gas two phase flow. It summarizes, in a single volume, the state-of-the-art in boiling heat transfer and provides a valuable resource for thermal engineers and practitioners working in the thermal sciences and thermal engineering. - Explores the most recent advancements in boiling research and technology from the last twenty years - Provides section content written by contributing experts in their respective research areas - Shares research being conducted and advancements being made on boiling and heat transfer in Japan, one of the major research hubs in this field

Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953

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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Author:
Publisher: Academic Press
ISBN: 0080575846
Category : Technology & Engineering
Languages : en
Pages : 467

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Book Description
Advances in Heat Transfer

Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 1259861562
Category : Technology & Engineering
Languages : en
Pages : 849

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Book Description
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field

Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562

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Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.