Energy Efficient Thermal Management of Data Centers PDF Download

Author: Yogendra Joshi
Publisher: Springer Science & Business Media
ISBN: 1441971246
Category : Science
Languages : en
Pages : 635

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Book Description
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.

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Publisher: World Scientific
ISBN: 9814520241
Category : Technology & Engineering
Languages : en
Pages : 1397

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Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Author: Ephraim M. Sparrow
Publisher: Academic Press
ISBN: 0128155264
Category : Technology & Engineering
Languages : en
Pages : 396

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Book Description
Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry

Author: Xiaobing Luo
Publisher: John Wiley & Sons
ISBN: 1119179297
Category : Technology & Engineering
Languages : en
Pages : 373

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Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Author: Maria Carla Calzarossa
Publisher: Springer
ISBN: 3540457984
Category : Computers
Languages : en
Pages : 509

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Book Description
This book presents the tutorial lectures given by leading experts in the area at the IFIP WG 7.3 International Symposium on Computer Modeling, Measurement and Evaluation, Performance 2002, held in Rome, Italy in September 2002.The survey papers presented are devoted to theoretical and methodological advances in performance and reliability evaluation as well as new perspectives in the major application fields. Modeling and verification issues, solution methods, workload characterization, and benchmarking are addressed from the methodological point of view. Among the applications dealt with are hardware and software architectures, wired and wireless networks, grid environments, Web services, and real-time voice and video processing.This book is intended to serve as a state-of-the-art survey and reference for students, scientists, and engineers active in the area of performance and reliability evaluation.

Author: Rajeev Tiwari
Publisher: Springer Nature
ISBN: 9811634483
Category : Technology & Engineering
Languages : en
Pages : 314

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Book Description
This book focuses on energy efficiency concerns in fog–edge computing and the requirements related to Industry 4.0 and next-generation networks like 5G and 6G. This book guides the research community about practical approaches, methodological, and moral questions in any nations’ journey to conserve energy in fog–edge computing environments. It discusses a detailed approach required to conserve energy and comparative case studies with respect to various performance evaluation metrics, such as energy conservation, resource allocation strategies, task allocation strategies, VM migration, and load-sharing strategies with state-of-the-art approaches, with fog and edge networks.

Author: Zhaojun Wang
Publisher: Springer Nature
ISBN: 9811395284
Category : Technology & Engineering
Languages : en
Pages : 1492

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Book Description
This book presents selected papers from the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019), with a focus on HVAC techniques for improving indoor environment quality and the energy efficiency of heating and cooling systems. Presenting inspiration for implementing more efficient and safer HVAC systems, the book is a valuable resource for academic researchers, engineers in industry, and government regulators.

Author: Hengyun Zhang
Publisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436

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Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

Author: Albert Y. Zomaya
Publisher: John Wiley & Sons
ISBN: 1118342003
Category : Computers
Languages : en
Pages : 605

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Book Description
The energy consumption issue in distributed computing systems raises various monetary, environmental and system performance concerns. Electricity consumption in the US doubled from 2000 to 2005. From a financial and environmental standpoint, reducing the consumption of electricity is important, yet these reforms must not lead to performance degradation of the computing systems. These contradicting constraints create a suite of complex problems that need to be resolved in order to lead to 'greener' distributed computing systems. This book brings together a group of outstanding researchers that investigate the different facets of green and energy efficient distributed computing. Key features: One of the first books of its kind Features latest research findings on emerging topics by well-known scientists Valuable research for grad students, postdocs, and researchers Research will greatly feed into other technologies and application domains

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Publisher: Elsevier
ISBN: 0443295395
Category : Science
Languages : en
Pages : 314

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Book Description
Advances in Heat Transfer, Volume 58 presents the latest in a serial that highlights new advances in the field, with this updated volume presenting interesting chapters written by an international board of authors. Sample chapters in this new release include Nanoscale Thin Film Evaporation and Ice thermal energy storage modeling: A review. - Provides the authority and expertise of leading contributors from an international board of authors - Presents the latest release in Advances in Heat Transfer serials