Nucleate Pool Boiling Characteristics of Gewa-T Finned Surfaces in Freon-113 PDF Download
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Author: R. J. Pulido Publisher: ISBN: Category : Languages : en Pages : 101
Book Description
Pool boiling heat-transfer measurements were made using seven Gewa-T copper tubes in R-113. The first tube (18-mm OD x 0.75 fins/mm x 0.25 mm gap) was tested under three conditions: (a) plain, (b) with four shrouds and (c) with up to 5 wires (0.13 mm diameter) wrapped in the inter-fin trough area. Verifying prior data, the shroud with longitudinal openings of 60 deg at the top and 8.5 deg at at the bottom gave the best performance among the four shrouds tested. This shroud increased the boiling heat-transfer coefficient by 253 percent (over the smooth tube case) at a heat flux of 10,000 W/sq m while it showed only a 18 percent increase at 100,000 W/sq m. When wire wraps were provided, in all cases, the heat-transfer coefficient was improved at all heat fluxes. The use of three wires gave the best performance with 341-percent increase in heat-transfer coefficient at 10,000 W/sq m and a 130 percent increase at 100,000 W/sq m. The next three Fewa-T tubes had dimensions of 25 mm OD x 0.75 fins/mm with fin-tip gaps of 0.15, 0.25, and 0.35 mm, respectively. The last three Gewa-T tubes had the same dimensions except that the fin density was 1.02 fins/mm. For each of these fin densities, the 0.25 mm fin-tip gap produced the best boiling performance at all heat fluxes. Originator supplied keywords include: Nucleate pool boiling; Gewa-T finned surfaces.
Author: R. J. Pulido Publisher: ISBN: Category : Languages : en Pages : 101
Book Description
Pool boiling heat-transfer measurements were made using seven Gewa-T copper tubes in R-113. The first tube (18-mm OD x 0.75 fins/mm x 0.25 mm gap) was tested under three conditions: (a) plain, (b) with four shrouds and (c) with up to 5 wires (0.13 mm diameter) wrapped in the inter-fin trough area. Verifying prior data, the shroud with longitudinal openings of 60 deg at the top and 8.5 deg at at the bottom gave the best performance among the four shrouds tested. This shroud increased the boiling heat-transfer coefficient by 253 percent (over the smooth tube case) at a heat flux of 10,000 W/sq m while it showed only a 18 percent increase at 100,000 W/sq m. When wire wraps were provided, in all cases, the heat-transfer coefficient was improved at all heat fluxes. The use of three wires gave the best performance with 341-percent increase in heat-transfer coefficient at 10,000 W/sq m and a 130 percent increase at 100,000 W/sq m. The next three Fewa-T tubes had dimensions of 25 mm OD x 0.75 fins/mm with fin-tip gaps of 0.15, 0.25, and 0.35 mm, respectively. The last three Gewa-T tubes had the same dimensions except that the fin density was 1.02 fins/mm. For each of these fin densities, the 0.25 mm fin-tip gap produced the best boiling performance at all heat fluxes. Originator supplied keywords include: Nucleate pool boiling; Gewa-T finned surfaces.
Author: Bonifacio G Hernandez (Jr) Publisher: ISBN: Category : Languages : en Pages : 78
Book Description
A variety of experimental tests were made with a Gewa-T finned surface in Freon-113 to assist in understanding the physical mechanisms which occur during nucleate pool boiling from this type of surface. The influence of the channels between neighboring T-shaped fins was examined with the use of four aluminum shrouds which had top and bottom windows of various apertures, and which were fitted tightly over the Gewa-T surface. The influence of the fins was examined by progressively machining away the fin height to arrive at a smooth cylindrical surface.
Author: Sadik Kakaç Publisher: Springer Science & Business Media ISBN: 9401110905 Category : Technology & Engineering Languages : en Pages : 953
Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: R. J. Pulido
Author: R. J. Pulido
Author: Ricardo J. Pulido O.
Author: Bonifacio G Hernandez (Jr)
Author: Gai-Wai Yang
Author: Sadik Kakaç
Author: American Institute of Chemical Engineers
Author: Thomas Peyton Easterly
Author: N. M. Farukhi
Author: George M. Bertsch
Author: V. K. Dhir