Author: NAVAL RESEARCH LAB WASHINGTON D C.Publisher:
ISBN:
Category :
Languages : en
Pages : 111
Book Description
Contents: Module design; Connectors; Racks; Cabinets; Interconnections; Heat exchanger; and Future development.
NRL MODULAR ELECTRONIC PACKAGING.
Author: NAVAL RESEARCH LAB WASHINGTON D C.Publisher:
ISBN:
Category :
Languages : en
Pages : 111
Book Description
Contents: Module design; Connectors; Racks; Cabinets; Interconnections; Heat exchanger; and Future development.
Report of NRL Progress
Author: Naval Research Laboratory (U.S.)Publisher:
ISBN:
Category : Naval research
Languages : en
Pages : 374
Book Description
Handbook of Electronic Packaging
Author: Charles A. HarperPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1210
Book Description
Navy Systems Design Guidelines Manual
Author: Trident Laboratories (Washington, D.C.)Publisher:
ISBN:
Category :
Languages : en
Pages : 310
Book Description
Electronic Packaging
Author: J. W. KlaphekePublisher:
ISBN:
Category : Packaging
Languages : en
Pages : 104
Book Description
This annotated bibliography of selected reports, journal articles, and manufacturers' literature on electronic packaging provides a literature basis for electronic packaging engineers to design moer reliable, maintainable, and adaptable electronic equipment for aerospace application. Subject indexing is provided by properties and environmental effects on packaging materials, discrete parts to module packaging, module packing to assembly, housing and mounting, packaging products, and interconnection techniques. Author and corporate author indexes are included. (Author, modified) INCLUDED. (Author, modified-PL).
Electronic Drafting and Design
Author: Nicholas M. RaskhodoffPublisher: Prentice Hall
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 696
Book Description
Electronic Packaging
Author: John H. LauPublisher: McGraw-Hill Professional Publishing
ISBN: 9780070371354
Category : Electronic packaging
Languages : en
Pages : 0
Book Description
Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Author: Hengyun ZhangPublisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436
Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Scientific and Technical Aerospace Reports
Author: Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 602
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Evolution of Naval Radio-electronics and Contributions of the Naval Research Laboratory
Author: Louis A. GebhardPublisher:
ISBN:
Category : Electronics in military engineering
Languages : en
Pages : 472
Book Description