Author: Publisher:
ISBN:
Category : Electric connectors
Languages : en
Pages : 448
Book Description
Annual Connectors and Interconnection Technology Symposium Proceedings
Author: Annual Connector & Interconnection Technology Symposium
Author: Proceedings
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1220
Book Description
Influence of Temperature on Microelectronics and System Reliability
Author: Pradeep LallPublisher: CRC Press
ISBN: 0429605595
Category : Technology & Engineering
Languages : en
Pages : 332
Book Description
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Electrical & Electronics Abstracts
Author: Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
Electrical Contacts
Author: Paul G. SladePublisher: CRC Press
ISBN: 9780824719340
Category : Technology & Engineering
Languages : en
Pages : 1116
Book Description
Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.
Synthetics, Mineral Oils, and Bio-Based Lubricants
Author: Leslie R. RudnickPublisher: CRC Press
ISBN: 1439855382
Category : Science
Languages : en
Pages : 1019
Book Description
Highlighting the major economic and industrial changes in the lubrication industry since the first edition, Synthetics, Mineral Oils, and Bio-Based Lubricants, Second Edition outlines the state of the art in each major lubricant application area. Chapters cover trends in the major industries, such as the use of lubricant fluids, growth or decl
NIST Monograph
Author: Handbook of Electronic Package Design
Author: Michael PechtPublisher: CRC Press
ISBN: 1351838415
Category : Technology & Engineering
Languages : en
Pages : 904
Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
EDA for IC Implementation, Circuit Design, and Process Technology
Author: Luciano LavagnoPublisher: CRC Press
ISBN: 1420007955
Category : Technology & Engineering
Languages : en
Pages : 608
Book Description
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.