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Author: José María Cavanillas Publisher: Springer ISBN: 3319215698 Category : Computers Languages : en Pages : 312
Book Description
In this book readers will find technological discussions on the existing and emerging technologies across the different stages of the big data value chain. They will learn about legal aspects of big data, the social impact, and about education needs and requirements. And they will discover the business perspective and how big data technology can be exploited to deliver value within different sectors of the economy. The book is structured in four parts: Part I “The Big Data Opportunity” explores the value potential of big data with a particular focus on the European context. It also describes the legal, business and social dimensions that need to be addressed, and briefly introduces the European Commission’s BIG project. Part II “The Big Data Value Chain” details the complete big data lifecycle from a technical point of view, ranging from data acquisition, analysis, curation and storage, to data usage and exploitation. Next, Part III “Usage and Exploitation of Big Data” illustrates the value creation possibilities of big data applications in various sectors, including industry, healthcare, finance, energy, media and public services. Finally, Part IV “A Roadmap for Big Data Research” identifies and prioritizes the cross-sectorial requirements for big data research, and outlines the most urgent and challenging technological, economic, political and societal issues for big data in Europe. This compendium summarizes more than two years of work performed by a leading group of major European research centers and industries in the context of the BIG project. It brings together research findings, forecasts and estimates related to this challenging technological context that is becoming the major axis of the new digitally transformed business environment.
Author: José María Cavanillas Publisher: Springer ISBN: 3319215698 Category : Computers Languages : en Pages : 312
Book Description
In this book readers will find technological discussions on the existing and emerging technologies across the different stages of the big data value chain. They will learn about legal aspects of big data, the social impact, and about education needs and requirements. And they will discover the business perspective and how big data technology can be exploited to deliver value within different sectors of the economy. The book is structured in four parts: Part I “The Big Data Opportunity” explores the value potential of big data with a particular focus on the European context. It also describes the legal, business and social dimensions that need to be addressed, and briefly introduces the European Commission’s BIG project. Part II “The Big Data Value Chain” details the complete big data lifecycle from a technical point of view, ranging from data acquisition, analysis, curation and storage, to data usage and exploitation. Next, Part III “Usage and Exploitation of Big Data” illustrates the value creation possibilities of big data applications in various sectors, including industry, healthcare, finance, energy, media and public services. Finally, Part IV “A Roadmap for Big Data Research” identifies and prioritizes the cross-sectorial requirements for big data research, and outlines the most urgent and challenging technological, economic, political and societal issues for big data in Europe. This compendium summarizes more than two years of work performed by a leading group of major European research centers and industries in the context of the BIG project. It brings together research findings, forecasts and estimates related to this challenging technological context that is becoming the major axis of the new digitally transformed business environment.
Author: Geraldine Cogin Shwartz Publisher: CRC Press ISBN: 1420017659 Category : Technology & Engineering Languages : en Pages : 533
Book Description
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Author: Shankara K. Prasad Publisher: Springer Science & Business Media ISBN: 1402077637 Category : Technology & Engineering Languages : en Pages : 694
Book Description
From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included. The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented. The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness. This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)
Author: Norman G. Einspruch Publisher: Academic Press ISBN: 1483217736 Category : Technology & Engineering Languages : en Pages : 614
Book Description
VLSI Electronics: Microstructure Science, Volume 6: Materials and Process Characterization addresses the problem of how to apply a broad range of sophisticated materials characterization tools to materials and processes used for development and production of very large scale integration (VLSI) electronics. This book discusses the various characterization techniques, such as Auger spectroscopy, secondary ion mass spectroscopy, X-ray topography, transmission electron microscopy, and spreading resistance. The systematic approach to the technologies of VLSI electronic materials and device manufacture are also considered. This volume is beneficial to materials scientists, chemists, and engineers who are commissioned with the responsibility of developing and implementing the production of materials and devices to support the VLSI era.
Author: Nikolay N Mirenkov Publisher: World Scientific ISBN: 9814556017 Category : Languages : en Pages : 519
Book Description
The proceedings of this UNESCO-supported conference consist of papers covering new trends and experiences in parallel computing technologies. Emphasis is made on the practical aspects of parallel programming, especially: all aspects of the applications of parallel computing technologies; hardware, languages and software tools for parallel processing; operating systems; general architecture concepts; enabling technologies; performance measurements; and the teaching of parallel processing technology.
Author: José María Cavanillas
Author: José María Cavanillas
Author: Geraldine Cogin Shwartz
Author: S. Broydo
Author: Shankara K. Prasad
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Author: 
Author: Norman G. Einspruch
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Author: Nikolay N Mirenkov
Author: Steven Furnell