Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 2022
Book Description
Proceedings of the Technical Program
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 2022
Book Description
NEPCON West '93
Author: Electronic Business
Author: Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 938
Book Description
NEPCON West 93
Author: EDN
Author: Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1226
Book Description
Wsc '93
Author: Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Computers
Languages : en
Pages : 1468
Book Description
NEPCON West'93
Author: The New World of Electronics ManufacturingPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Chip On Board
Author: John H. LauPublisher: Springer Science & Business Media
ISBN: 9780442014414
Category : Computers
Languages : en
Pages : 584
Book Description
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Electronic Packaging and Production
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 686
Book Description
Evaluation Engineering
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 806
Book Description