Author: Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 944
Book Description
Electronic Business
Author: Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 944
Book Description
Proceedings of the Technical Program
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1861
Book Description
Area Array Interconnection Handbook
Author: Karl J. PuttlitzPublisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
NEPCON West '92
Author: Electronic Packaging and Production
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 616
Book Description
Proceedings of the Technical Program
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 792
Book Description
The Mechanics of Solder Alloy Wetting and Spreading
Author: Michael HoskingPublisher: Springer Science & Business Media
ISBN: 1468414402
Category : Technology & Engineering
Languages : en
Pages : 367
Book Description
In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.
Semiconductor International
Author: Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 768
Book Description
Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California
Author: International Society for Hybrid MicroelectronicsPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
Book Description
Metal Finishing
Author: Publisher:
ISBN:
Category : Aluminum
Languages : en
Pages : 1474
Book Description
Issues for Oct. 1939-Dec. 1944 include v. 1-5 of Organic finishing (later issued separately)