Author: L. B. Rothman
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
Author: L. B. Rothman
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Multilevel Metallization, Interconnection, and Contact Technologies
Multilevel metallization, interconnection and contact technologies
Author: Electrochemical Society. Dielectrics and Insulation and Electronics Division
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies
Author: Harzara S. Rathore
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 516
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 516
Book Description
Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
Handbook of Multilevel Metallization for Integrated Circuits
Author: Syd R. Wilson
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
Book Description
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
Book Description
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Handbook of Semiconductor Interconnection Technology
Author: Geraldine Cogin Shwartz
Publisher: CRC Press
ISBN: 1420017659
Category : Technology & Engineering
Languages : en
Pages : 533
Book Description
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Publisher: CRC Press
ISBN: 1420017659
Category : Technology & Engineering
Languages : en
Pages : 533
Book Description
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Multilevel Interconnect Technology
Author: Gopal K. Rao
Publisher: McGraw-Hill Companies
ISBN:
Category : Computers
Languages : en
Pages : 250
Book Description
The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Publisher: McGraw-Hill Companies
ISBN:
Category : Computers
Languages : en
Pages : 250
Book Description
The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
ULSI Science and Technology/1987
Author: S. Broydo
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 874
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 874
Book Description
Guidebook for Managing Silicon Chip Reliability
Author: Michael Pecht
Publisher: CRC Press
ISBN: 1351443577
Category : Technology & Engineering
Languages : en
Pages : 224
Book Description
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Publisher: CRC Press
ISBN: 1351443577
Category : Technology & Engineering
Languages : en
Pages : 224
Book Description
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.