Multilayered Low Temperature Cofired Ceramics (LTCC) Technology PDF Download
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Author: Yoshihiko Imanaka Publisher: Springer Science & Business Media ISBN: 0387233148 Category : Technology & Engineering Languages : en Pages : 252
Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: Yoshihiko Imanaka Publisher: Springer Science & Business Media ISBN: 0387233148 Category : Technology & Engineering Languages : en Pages : 252
Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: Duixian Liu Publisher: John Wiley & Sons ISBN: 1119556635 Category : Technology & Engineering Languages : en Pages : 416
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Mailadil T. Sebastian Publisher: John Wiley & Sons ISBN: 1119208564 Category : Technology & Engineering Languages : de Pages : 997
Book Description
Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
Author: Narottam P. Bansal Publisher: John Wiley & Sons ISBN: 0470553448 Category : Technology & Engineering Languages : en Pages : 598
Book Description
Examines the latest processing and fabrication methods There is increasing interest in the application of advanced ceramic materials in diverse areas such as transportation, energy, environmental protection and remediation, communications, health, and aerospace. This book guides readers through a broad selection of key processing techniques for ceramics and their composites, enabling them to manufacture ceramic products and components with the properties needed for various industrial applications. With chapters contributed by internationally recognized experts in the field of ceramics, the book includes traditional fabrication routes as well as new and emerging approaches in order to meet the increasing demand for more reliable ceramic materials. Ceramics and Composites Processing Methods is divided into three sections: * Densification, covering the fundamentals and practice of sintering, pulsed electric current sintering, and viscous phase silicate processing * Chemical Methods, examining colloidal methods, sol-gel, gel casting, polymer processing, chemical vapor deposition, chemical vapor infiltration, reactive melt infiltration, and combustion synthesis * Physical Methods, including directional solidification, solid free-form fabrication, microwave processing, electrophoretic deposition, and plasma spraying Each chapter focuses on a particular processing method or approach. Collectively, these chapters offer readers comprehensive, state-of-the-science information on the many approaches, techniques, and methods for the processing and fabrication of advanced ceramics and ceramic composites. With its coverage of the latest processing methods, Ceramics and Composites Processing Methods is recommended for researchers and students in ceramics, materials science, structural materials, biomedical engineering, and nanotechnology.
Author: I M Low Publisher: Woodhead Publishing ISBN: 0081021674 Category : Technology & Engineering Languages : en Pages : 844
Book Description
Advances in Ceramic Matrix Composites, Second Edition, delivers an innovative approach to ceramic matrix composites, focusing on the latest advances and materials developments. As advanced ceramics and composite materials are increasingly utilized as components in batteries, fuel cells, sensors, high-temperature electronics, membranes and high-end biomedical devices, and in seals, valves, implants, and high-temperature and wear components, this book explores the substantial progress in new applications. Users will gain knowledge of the latest advances in CMCs, with an update on the role of ceramics in the fabrication of Solid Oxide Fuel Cells for energy generation, and on natural fiber-reinforced eco-friendly geopolymer and cement composites. The specialized information contained in this book will be highly valuable to researchers and graduate students in ceramic science, engineering and ceramic composites technology, and engineers and scientists in the aerospace, energy, building and construction, biomedical and automotive industries. - Provides detailed coverage of parts and processing, properties and applications - Includes new developments in the field, such as natural fiber-reinforced composites and the use of CMCs in Solid Oxide Fuel Cells (SOFCs) - Presents state-of-the-art research, enabling the reader to understand the latest applications for CMCs
Author: Ralf Riedel Publisher: John Wiley & Sons ISBN: 3527631968 Category : Technology & Engineering Languages : en Pages : 554
Book Description
Although ceramics have been known to mankind literally for millennia, research has never ceased. Apart from the classic uses as a bulk material in pottery, construction, and decoration, the latter half of the twentieth century saw an explosive growth of application fields, such as electrical and thermal insulators, wear-resistant bearings, surface coatings, lightweight armour, or aerospace materials. In addition to plain, hard solids, modern ceramics come in many new guises such as fabrics, ultrathin films, microstructures and hybrid composites. Built on the solid foundations laid down by the 20-volume series Materials Science and Technology, Ceramics Science and Technology picks out this exciting material class and illuminates it from all sides. Materials scientists, engineers, chemists, biochemists, physicists and medical researchers alike will find this work a treasure trove for a wide range of ceramics knowledge from theory and fundamentals to practical approaches and problem solutions.
Author: Fred D. Barlow, III Publisher: CRC Press ISBN: 9780849335570 Category : Technology & Engineering Languages : en Pages : 472
Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author: Fred D. Barlow, III Publisher: CRC Press ISBN: 1420018965 Category : Technology & Engineering Languages : en Pages : 456
Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author: The Ceramic Society of Japan Publisher: Springer Science & Business Media ISBN: 443154108X Category : Technology & Engineering Languages : en Pages : 507
Book Description
Since the last century, ceramics have become essential to modern society and our daily lives. They have become an indispensable product to many industries, especially within the fields of electronics, automobiles, medicine, and leisure. Japanese ceramic technologies and products are highly sophisticated and world renown, and ceramic products have long contributed to Japanese society. The true significance of ceramics to modern society however, is not well understood. This book describes in detail the background to and objective of the development, materials, manufacturing processes, functions and future prospects of a number of ceramic products. Not merely about the science and technology of ceramic manufacturing, the book is about the products themselves, as it tries to clarify how ceramics continue to contribute to our lives. It is the first such work to show advanced ceramic products in detail, from the technologies used to their application, and can be seen as a kind of illustrated reference book for modern advanced ceramic products as it is filled with easy-to-understand illustrations and photos. By including past and current product technologies, the editors hope the book will serve to guide engineers and the manufacturing sector toward a bright future of innovations for the benefit of us all.
Author: Yoshihiko Imanaka
Author: Yoshihiko Imanaka
Author: Duixian Liu
Author: Mailadil T. Sebastian
Author: Narottam P. Bansal
Author: Bhutani, Akanksha
Author: I M Low
Author: Ralf Riedel
Author: Fred D. Barlow, III
Author: Fred D. Barlow, III
Author: The Ceramic Society of Japan