Author: Publisher:
ISBN: 9789174736632
Category :
Languages : en
Pages : 68
Book Description
Modular Packaging Development
Author: The Packaging Development Process
Author: Kristine DeMariaPublisher: CRC Press
ISBN: 9781566768016
Category : Technology & Engineering
Languages : en
Pages : 126
Book Description
The Packaging Development Process: A Guide for Engineers and Project Managers presents the techniques necessary for creating, testing, and launching packaging, in one convenient reference book. It does so by explaining each step of how a packaging project evolves from the business plan to product launch, with an emphasis on the financial and human resources necessary to move the project forward. Included are extended case studies and detailed flow charts. The case studies create an interesting, informative and understandable read, while the flow charts explain concepts. The text is intended to give package engineers and managers the tools they need to realize new package ideas and to revamp existing packaging in the framework of business teams.
Principles of Package Development
Author: Roger C. GriffinPublisher: Springer Science & Business Media
ISBN: 9401173826
Category : Science
Languages : en
Pages : 388
Book Description
Since the first edition of "Principles of Packaging Development" was published, the packaging industry has undergone many profound changes. These have included the virtual elimination of cellophane and its replacement with oriented polypropylene as a carton overwrap, fluid milk in blow-molded HDPE bottles, PET beverage bottles, cookie bags and cartons lined with polyolefin coextrusions instead of waxed glassine, and bread in reclosable polyolefin and coextruded film bags. New phrases have also worked their way into the lexicon of the practic ing packaging technologist, such as "child resistance" and "tamper evident. " This most popular text on packaging demanded updating. How these phrases and ideas have affected the industry in the 1980s and how they will probably alter its course in the future are treated. New concepts of packaging system planning and forecasting tech niques are intruding into package management, and new chapters will introduce them to the reader. The years have added a certain degree of maturity to the packaging industry. Not only have the original authors broadened their per spectives and changed professional responsibilities, we have also in cluded a third co-author, Dr. Aaron L. Brody, whose experience in the industry, academic background, and erudite insights into the very na ture of packaging have added an unparalled degree of depth to this book. We would like to thank David L.
Modular Package on Gender, Poverty and Employment
Author: International Labour OfficePublisher: International Labour Organization
ISBN: 9789221108382
Category : Business & Economics
Languages : en
Pages : 500
Book Description
Modular Packaging Approaches
Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 124
Book Description
The objective of this study is to investigate the feasibility, practicality, and implementation of standard electronic modules (SEM) for avionics. Tradeoff studies are used to provide quantitative SEM format(s). The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in four tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technological trends for determination of the standard avionics module(s), Task III is a compilation of industry and DOD data concerning standard module information and concepts, and Task IV is the detailed development and evaluation of the proposed 'Westinghouse SEM' including the construction of demonstration hardware. The efforts of Tasks I, II, and III are described in the previous issued interim Report AFAL-TR-76-61, Volume 1. This Final Report describes the details of the study performed on Task IV with the conclusions made and recommendations for future work. (Author).
Advanced Electronic Packaging
Author: William D. BrownPublisher: Wiley-IEEE Press
ISBN: 9780780347007
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
NRL MODULAR ELECTRONIC PACKAGING.
Author: NAVAL RESEARCH LAB WASHINGTON D C.Publisher:
ISBN:
Category :
Languages : en
Pages : 111
Book Description
Contents: Module design; Connectors; Racks; Cabinets; Interconnections; Heat exchanger; and Future development.
Physical Design for Multichip Modules
Author: Mysore SriramPublisher: Springer Science & Business Media
ISBN: 1461526825
Category : Technology & Engineering
Languages : en
Pages : 205
Book Description
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Introduction to Microsystem Packaging Technology
Author: Yufeng JinPublisher: CRC Press
ISBN: 9781138374256
Category :
Languages : en
Pages : 232
Book Description
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process--including design and manufacturing technologies--is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technologydetails the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author: