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Author: W. W. Staley Publisher: ISBN: Category : Languages : en Pages : 101
Book Description
The objective of this study is to investigate the feasibility, practicality, and implementation of standard electronic modules (SEM) for avionics. Tradeoff studies are used to provide quantitative SEM format(s). The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in four tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technological trends for determination of the standard avionics module(s), Task III is a compilation of industry and DOD data concerning standard module information and concepts, and Task IV is the detailed development and evaluation of the proposed 'Westinghouse SEM' including the construction of demonstration hardware. The efforts of Tasks I, II, and III are described in the previous issued interim Report AFAL-TR-76-61, Volume 1. This Final Report describes the details of the study performed on Task IV with the conclusions made and recommendations for future work. (Author).
Author: W. W. Staley Publisher: ISBN: Category : Languages : en Pages : 101
Book Description
The objective of this study is to investigate the feasibility, practicality, and implementation of standard electronic modules (SEM) for avionics. Tradeoff studies are used to provide quantitative SEM format(s). The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in four tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technological trends for determination of the standard avionics module(s), Task III is a compilation of industry and DOD data concerning standard module information and concepts, and Task IV is the detailed development and evaluation of the proposed 'Westinghouse SEM' including the construction of demonstration hardware. The efforts of Tasks I, II, and III are described in the previous issued interim Report AFAL-TR-76-61, Volume 1. This Final Report describes the details of the study performed on Task IV with the conclusions made and recommendations for future work. (Author).
Author: Publisher: ISBN: Category : Languages : en Pages : 124
Book Description
The objective of this study is to investigate the feasibility, practicality, and implementation of standard electronic modules (SEM) for avionics. Tradeoff studies are used to provide quantitative SEM format(s). The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in four tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technological trends for determination of the standard avionics module(s), Task III is a compilation of industry and DOD data concerning standard module information and concepts, and Task IV is the detailed development and evaluation of the proposed 'Westinghouse SEM' including the construction of demonstration hardware. The efforts of Tasks I, II, and III are described in the previous issued interim Report AFAL-TR-76-61, Volume 1. This Final Report describes the details of the study performed on Task IV with the conclusions made and recommendations for future work. (Author).
Author: International Labour Office Publisher: International Labour Organization ISBN: 9789221108382 Category : Business & Economics Languages : en Pages : 500
Author: William A. Stein Publisher: American Mathematical Soc. ISBN: 0821839608 Category : Mathematics Languages : en Pages : 290
Book Description
This marvellous and highly original book fills a significant gap in the extensive literature on classical modular forms. This is not just yet another introductory text to this theory, though it could certainly be used as such in conjunction with more traditional treatments. Its novelty lies in its computational emphasis throughout: Stein not only defines what modular forms are, but shows in illuminating detail how one can compute everything about them in practice. This is illustrated throughout the book with examples from his own (entirely free) software package SAGE, which really bring the subject to life while not detracting in any way from its theoretical beauty. The author is the leading expert in computations with modular forms, and what he says on this subject is all tried and tested and based on his extensive experience. As well as being an invaluable companion to those learning the theory in a more traditional way, this book will be a great help to those who wish to use modular forms in applications, such as in the explicit solution of Diophantine equations. There is also a useful Appendix by Gunnells on extensions to more general modular forms, which has enough in it to inspire many PhD theses for years to come. While the book's main readership will be graduate students in number theory, it will also be accessible to advanced undergraduates and useful to both specialists and non-specialists in number theory. --John E. Cremona, University of Nottingham William Stein is an associate professor of mathematics at the University of Washington at Seattle. He earned a PhD in mathematics from UC Berkeley and has held positions at Harvard University and UC San Diego. His current research interests lie in modular forms, elliptic curves, and computational mathematics.
Author: Peter A. Sandborn Publisher: Springer Science & Business Media ISBN: 1475748418 Category : Technology & Engineering Languages : en Pages : 270
Book Description
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Author: Jing Li Publisher: Springer Nature ISBN: 9819936268 Category : Business & Economics Languages : en Pages : 1833
Book Description
This book presents the proceedings of CRIOCM 2022 (27th International Conference on Advancement of Construction Management and Real Estate), sharing the latest developments in real estate and construction management around the globe. The conference was organized by the Chinese Research Institute of Construction Management (CRIOCM) working in close collaboration with The Chinese University of Hong Kong. Written by international academics and professionals, the book discusses the latest achievements, research findings, and advances in frontier disciplines in the field of construction management and real estate. Covering a wide range of topics, including spatial planning and land use innovation, integration and application of BIM and GIS, low-carbon built environment, post-pandemic resilient cities development, housing and social governance, real estate market and urban policy, real estate finance and economics, intelligent construction and smart city, built environment for healthy living, and construction management in the post-COVID-19 era, the discussions provide valuable insights into the implementation of advanced construction project management and real estate market in China and abroad. The book offers an outstanding resource for academics and professionals
Author: John R. Kidwell Publisher: ISBN: Category : Languages : en Pages : 183
Book Description
This report provides information related to a modular avionic packaging (MAP) concept presented to industry on 9 May 1978 at the Naval Avionics Center, Indianapolis, Indiana. In attendance at this meeting were 78 representatives of different divisions of 33 companies. As major suppliers of avionics to the Navy, comments provided by these companies were anticipated to be very useful in the further development of packaging approaches for future avionics. This report contains the responses provided by industry. Although the companies responding are identified by name for reference, a reasonable attempt has been made to render the comments anonymous by removing company names and product references. The comments have been grouped into categories and summarized; however, no attempt has been made in this report to resolve areas of conflicting opinion given by different companies. It is not intended to imply that the Navy or this Center endorses, agrees, or disagrees in any manner with the comments provided by industry. (Author).
Author: Osamu Wada Publisher: Springer Science & Business Media ISBN: 1461526868 Category : Technology & Engineering Languages : en Pages : 464
Book Description
As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.
Author: W. W. Staley
Author: W. W. Staley
Author: 
Author: International Labour Office
Author: William A. Stein
Author: Peter A. Sandborn
Author: Jing Li
Author: 
Author: 
Author: John R. Kidwell
Author: Osamu Wada