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Modification of Carbon Nanotubes Surface for Silicon Thermal Interface Material Preparation

Modification of Carbon Nanotubes Surface for Silicon Thermal Interface Material Preparation PDF Author: Junidah Abdul Shukor
Publisher:
ISBN:
Category :
Languages : en
Pages : 270

Book Description


Modification of Carbon Nanotubes Surface for Silicon Thermal Interface Material Preparation

Modification of Carbon Nanotubes Surface for Silicon Thermal Interface Material Preparation PDF Author: Junidah Abdul Shukor
Publisher:
ISBN:
Category :
Languages : en
Pages : 270

Book Description


Carbon Nanotubes for Thermal Interface Materials in Microelectronic Packaging

Carbon Nanotubes for Thermal Interface Materials in Microelectronic Packaging PDF Author: Wei Lin
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages :

Book Description
As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials.\r : The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials.\r : The major achievements are summarized.\r : 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon.\r : 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ~35% and ~65%, respectively, in tensile strength (~0.8 GPa) and modulus (~90 GPa) during tensile testing; an ~20% improvement in electrical conductivity (~80000 S m−1) was also reported. The mechanism of the microwave response of CNTs was discussed. Such an microwave annealing process has been extended to the preparation of reduced graphene oxide.\r : 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding.\r : 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ~30 mm2 s−1 along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ~27 and ~540 W m−1 K−1, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ~1×10−7 m2 K W−1. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging.\r : 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.

Modification of Carbon Nanotubes for Thermal Interface Material Application

Modification of Carbon Nanotubes for Thermal Interface Material Application PDF Author: Rahayu Saniman Mohd Zin
Publisher:
ISBN:
Category :
Languages : en
Pages : 190

Book Description


Thermal Diffusivity Measurements on Metals and Ceramics at High Temperatures

Thermal Diffusivity Measurements on Metals and Ceramics at High Temperatures PDF Author: R. L. Rudkin
Publisher:
ISBN:
Category : Metals
Languages : en
Pages : 28

Book Description


Carbon Nanotube-Polymer Composites

Carbon Nanotube-Polymer Composites PDF Author: Dimitrios Tasis
Publisher: Royal Society of Chemistry
ISBN: 1782625828
Category : Technology & Engineering
Languages : en
Pages : 293

Book Description
Chemically-modified carbon nanotubes (CNTs) exhibit a wide range of physical and chemical properties which makes them an attractive starting material for the preparation of super-strong and highly-conductive fibres and films. Much information is available across the primary literature, making it difficult to obtain an overall picture of the state-of-the-art. This volume brings together some of the leading researchers in the field from across the globe to present the potential these materials have, not only in developing and characterising novel materials but also the devices which can be fabricated from them. Topics featured in the book include Raman characterisation, industrial polymer materials, actuators and sensors and polymer reinforcement, with chapters prepared by highly-cited authors from across the globe. A valuable handbook for any academic or industrial laboratory, this book will appeal to newcomers to the field and established researchers alike.

The Cane Ridge Preservation Project

The Cane Ridge Preservation Project PDF Author:
Publisher:
ISBN:
Category : Bourbon County (Ky.)
Languages : en
Pages : 2

Book Description


Chemically Modified Carbon Nanotubes for Commercial Applications

Chemically Modified Carbon Nanotubes for Commercial Applications PDF Author: Jeenat Aslam
Publisher: John Wiley & Sons
ISBN: 3527350721
Category : Technology & Engineering
Languages : en
Pages : 549

Book Description
Discover the go-to handbook for developers and application-oriented researchers who use carbon nanotubes in real products Carbon nanotubes have held much interest for researchers since their discovery in 1991. Due to their low mass density, large aspect ratio, and unique physical, chemical, and electronic properties, they provide a fertile ground for innovation in nanoscale applications. The development of chemical modifications that can enhance the poor dispersion of carbon nanotubes in solvents and improve interactions with other materials have enabled extensive industrial applications in a variety of fields. As the chemistry of carbon nanotubes and their functionalization becomes better understood, Chemically Modified Carbon Nanotubes for Commercial Applications presents the most recent developments of chemically modified carbon nanotubes and emphasizes the broad appeal for commercial purposes along many avenues of interest. The book reviews their already realized and prospective applications in fields such as electronics, photonics, separation science, food packaging, environmental monitoring and protecting, sensing technology, and biomedicine. By focusing on their commercialization prospects, this resource offers a unique approach to a significant and cutting-edge discipline. Chemically Modified Carbon Nanotubes for Commercial Applications readers will also find: Case studies that emphasize the information presented in each chapter Each chapter includes important websites and suggested reading materials Discussion of current applications of the relevant methodologies in every chapter A look at future perspectives in each application area to highlight the scope for next steps within the industry Chemically Modified Carbon Nanotubes for Commercial Applications is a valuable reference for material scientists, chemists (especially those focused on environmental concerns), and chemical and materials engineering scientists working in R&D and academia who want to learn more about chemically modified carbon nanotubes for various scalable commercial applications. It is also a useful resource for a broad audience: anyone interested in the fields of nanomaterials, nanoadsorbents, nanomedicine, bioinspired nanomaterials, nanotechnology, nanodevices, nanocomposites, biomedical application of nanomaterials, nano-engineering, and high energy applications.

Handbook of Carbon Nanotubes

Handbook of Carbon Nanotubes PDF Author: Jiji Abraham
Publisher: Springer Nature
ISBN: 3030913465
Category : Technology & Engineering
Languages : en
Pages : 2099

Book Description
This Handbook covers the fundamentals of carbon nanotubes (CNT), their composites with different polymeric materials (both natural and synthetic) and their potential advanced applications. Three different parts dedicated to each of these aspects are provided, with chapters written by worldwide experts in the field. It provides in-depth information about this material serving as a reference book for a broad range of scientists, industrial practitioners, graduate and undergraduate students, and other professionals in the fields of polymer science and engineering, materials science, surface science, bioengineering and chemical engineering. Part 1 comprises 22 chapters covering early stages of the development of CNT, synthesis techniques, growth mechanism, the physics and chemistry of CNT, various innovative characterization techniques, the need of functionalization and different types of functionalization methods as well as the different properties of CNT. A full chapter is devoted to theory and simulation aspects. Moreover, it pursues a significant amount of work on life cycle analysis of CNT and toxicity aspects. Part 2 covers CNT-based polymer nanocomposites in approximately 23 chapters. It starts with a short introduction about polymer nanocomposites with special emphasis on CNT-based polymer nanocomposites, different manufacturing techniques as well as critical issues concerning CNT-based polymer nanocomposites. The text deeply reviews various classes of polymers like thermoset, elastomer, latex, amorphous thermoplastic, crystalline thermoplastic and polymer fibers used to prepare CNT based polymer composites. It provides detailed awareness about the characterization of polymer composites. The morphological, rheological, mechanical, viscoelastic, thermal, electrical, electromagnetic shielding properties are discussed in detail. A chapter dedicated to the simulation and multiscale modelling of polymer nanocomposites is an additional attraction of this part of the Handbook. Part 3 covers various potential applications of CNT in approximately 27 chapters. It focuses on individual applications of CNT including mechanical applications, energy conversion and storage applications, fuel cells and water splitting, solar cells and photovoltaics, sensing applications, nanofluidics, nanoelectronics and microelectronic devices, nano-optics, nanophotonics and nano-optoelectronics, non-linear optical applications, piezo electric applications, agriculture applications, biomedical applications, thermal materials, environmental remediation applications, anti-microbial and antibacterial properties and other miscellaneous applications and multi-functional applications of CNT based polymer nanocomposites. One chapter is fully focussed on carbon nanotube research developments: published papers and patents. Risks associated with carbon nanotubes and competitive analysis of carbon nanotubes with other carbon allotropes are also addressed in this Handbook.

Thermal Management Materials for Electronic Packaging

Thermal Management Materials for Electronic Packaging PDF Author: Xingyou Tian
Publisher: John Wiley & Sons
ISBN: 3527843108
Category : Technology & Engineering
Languages : en
Pages : 373

Book Description
Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

Processing of Vertically Aligned Carbon Nanotubes for Heat Transfer Applications

Processing of Vertically Aligned Carbon Nanotubes for Heat Transfer Applications PDF Author: Robert Cross
Publisher:
ISBN:
Category : Heat
Languages : en
Pages :

Book Description
The development of wide band gap semiconductors for power and RF electronics as well as high power silicon microelectronics has pushed the need for advanced thermal management techniques to ensure device reliability. While many techniques to remove large heat fluxes from devices have been developed, fewer advancements have been made in the development of new materials which can be integrated into the packaging architecture. This is especially true in the development of thermal interface materials. Conventional solders are currently being used for interface materials in the most demanding applications, but have issues of high cost, long term reliability and inducing negative thermomechanical effects in active die. Carbon nanotubes have been suggested as a possible thermal interface material which can challenge solders because of their good thermal properties and 1-D structure which can enhance mechanical compliance between surfaces. In this work, we have developed a novel growth and transfer printing method to manufacture vertically aligned CNTs for thermal interface applications. This method follows the nanomaterial transfer printing methods pioneered at Georgia Tech over the past several years. This process is attractive as it separates the high growth synthesis temperatures from the lower temperatures needed during device integration. For this thesis, CNTs were grown on oxidized Si substrates which allowed us to produce high quality vertically aligned CNTs with specific lengths. Through the development of a water vapor assisted etch process, which takes place immediately after CNT synthesis, control over the adhesion of the nanotubes to the growth surface was achieved. By controlling the adhesion we demonstrated the capability to transfer arrays of vertically aligned CNTs to polyimide tape. The CNTs were then printed onto substrates like Si and Cu using a unique gold bonding process. The thermal resistances of the CNTs and the bonded interfaces were measured using the photoacoustic method, and the strength of the CNT interface was measured through tensile tests. Finally, the heat dissipation capabilities of the vertically aligned CNTs were demonstrated through incorporation with high brightness LEDs. A comparison of LED junction temperatures for devices using a CNT and lead free solder thermal interface was made.