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Cooling of Electronic Systems

Cooling of Electronic Systems PDF Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953

Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Cooling of Electronic Systems

Cooling of Electronic Systems PDF Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953

Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Heat Transfer and Fluid Flow in Minichannels and Microchannels

Heat Transfer and Fluid Flow in Minichannels and Microchannels PDF Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492

Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.

Handbook of Thermal Science and Engineering

Handbook of Thermal Science and Engineering PDF Author:
Publisher: Springer
ISBN: 9783319266947
Category : Science
Languages : en
Pages : 0

Book Description
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Integrated Interconnect Technologies for 3D Nanoelectronic Systems PDF Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551

Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Advanced Flip Chip Packaging

Advanced Flip Chip Packaging PDF Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562

Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Modeling Single-Phase and Boiling Liquid Jet Impingement Cooling in Power Electronics

Modeling Single-Phase and Boiling Liquid Jet Impingement Cooling in Power Electronics PDF Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 60

Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.

Computational Techniques for Multiphase Flows

Computational Techniques for Multiphase Flows PDF Author: Guan Heng Yeoh
Publisher: Elsevier
ISBN: 0080914896
Category : Computers
Languages : en
Pages : 658

Book Description
Mixed or multiphase flows of solid/liquid or solid/gas are commonly found in many industrial fields, and their behavior is complex and difficult to predict in many cases. The use of computational fluid dynamics (CFD) has emerged as a powerful tool for the understanding of fluid mechanics in multiphase reactors, which are widely used in the chemical, petroleum, mining, food, beverage and pharmaceutical industries. Computational Techniques for Multiphase Flows enables scientists and engineers to the undertand the basis and application of CFD in muliphase flow, explains how to use the technique, when to use it and how to interpret the results and apply them to improving aplications in process enginering and other multiphase application areas including the pumping, automotive and energy sectors. - Understandable guide to a complex subject - Important in many industries - Ideal for potential users of CFD

Advances in Heat Transfer

Advances in Heat Transfer PDF Author:
Publisher: Academic Press
ISBN: 0080575846
Category : Technology & Engineering
Languages : en
Pages : 467

Book Description
Advances in Heat Transfer

Compact Heat Exchangers

Compact Heat Exchangers PDF Author: Alexander Louis London
Publisher: CRC Press
ISBN: 9781560320128
Category : Heat exchangers
Languages : en
Pages : 798

Book Description
Heat exchangers are a crucial part of aerospace, marine, cryogenic and refrigeration technology. These essays cover such topics as complicated flow arrangements, complex extended surfaces, two-phase flow and irreversibility in heat exchangers, and single-phase heat transfer.

Fundamentals of Electric Propulsion

Fundamentals of Electric Propulsion PDF Author: Dan M. Goebel
Publisher: John Wiley & Sons
ISBN: 0470436263
Category : Technology & Engineering
Languages : en
Pages : 528

Book Description
Throughout most of the twentieth century, electric propulsion was considered the technology of the future. Now, the future has arrived. This important new book explains the fundamentals of electric propulsion for spacecraft and describes in detail the physics and characteristics of the two major electric thrusters in use today, ion and Hall thrusters. The authors provide an introduction to plasma physics in order to allow readers to understand the models and derivations used in determining electric thruster performance. They then go on to present detailed explanations of: Thruster principles Ion thruster plasma generators and accelerator grids Hollow cathodes Hall thrusters Ion and Hall thruster plumes Flight ion and Hall thrusters Based largely on research and development performed at the Jet Propulsion Laboratory (JPL) and complemented with scores of tables, figures, homework problems, and references, Fundamentals of Electric Propulsion: Ion and Hall Thrusters is an indispensable textbook for advanced undergraduate and graduate students who are preparing to enter the aerospace industry. It also serves as an equally valuable resource for professional engineers already at work in the field.