Modeling Single-Phase and Boiling Liquid Jet Impingement Cooling in Power Electronics PDF Download
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Author: Publisher: ISBN: Category : Heat Languages : en Pages : 60
Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.
Author: Publisher: ISBN: Category : Heat Languages : en Pages : 60
Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.
Author: National Renewable Energy Laboratory (Nr Publisher: Scholar's Choice ISBN: 9781297043895 Category : Languages : en Pages : 74
Book Description
This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work. This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work.As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.
Author: Publisher: ISBN: Category : Languages : en Pages : 0
Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.
Author: Kaveh Azar Publisher: Advanced Thermal Solutions ISBN: 0984627928 Category : Science Languages : en Pages : 182
Book Description
The complete editorial contents of Qpedia Thermal 4, Issues 1 - 12 features 48 in-depth articles that discuss critical case studies, calculations and analysis for thermal engineering professionals and academia.
Author: Frank P. Incropera Publisher: Wiley-Interscience ISBN: Category : Technology & Engineering Languages : en Pages : 312
Book Description
Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
Author: Xin Feng Publisher: ISBN: Category : Electronic dissertations Languages : en Pages :
Book Description
Among the thermal management solutions for power electronics, two-phase jet or spray impingement cooling are two promising candidates. In this study, electrohydrodynamic atomization (EHDA) method is used to generate spray and jet from the same capillary. This approach enables us to compare the heat transfer coefficient and critical heat flux (CHF) in consistent conditions. Two nondimensional parameters are first developed to lay out the various EHDA modes of ethanol. The experimental results show that the EHDA cooling could enhance the heat transfer coefficient in most conditions, while it could not benefit CHF because the electric repulsive force causes a wide spray angle and less impinging mass flux on the surface. Single and multi micro jet impingement cooling (MJIC) are investigated. Based on the experimental observation and analytical works, a semi-theoretical CHF correlation is proposed based on force and energy balance. The experimental data of water and ethanol are predicted very well by the new model. It also shows the potential to explain the unique feature on the CHF curves of saturated HFE7000 and subcooled ethanol. By using multi MJIC, heat transfer coefficient and CHF might be improved, which mainly depend on fluids and testing conditions.
Author: Xiaobing Luo Publisher: John Wiley & Sons ISBN: 1119179270 Category : Technology & Engineering Languages : en Pages : 373
Book Description
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author: Hengyun Zhang Publisher: Woodhead Publishing ISBN: 0081025335 Category : Technology & Engineering Languages : en Pages : 436
Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
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Author: National Renewable Energy Laboratory (Nr
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Author: Kaveh Azar
Author: Douglas DeVoto
Author: V. Hassani
Author: Frank P. Incropera
Author: Xin Feng
Author: Xiaobing Luo
Author: Hengyun Zhang