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Author: Hengyun Zhang Publisher: Woodhead Publishing ISBN: 0081025335 Category : Technology & Engineering Languages : en Pages : 436
Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Author: Hengyun Zhang Publisher: Woodhead Publishing ISBN: 0081025335 Category : Technology & Engineering Languages : en Pages : 436
Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Author: Xiaobing Luo Publisher: John Wiley & Sons ISBN: 1119179297 Category : Technology & Engineering Languages : en Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author: Jacques Richalet Publisher: Springer Science & Business Media ISBN: 1848824939 Category : Technology & Engineering Languages : en Pages : 236
Book Description
first industrial application of MPC was in 1973. A key motivation was to provide better performance than could be obtained with the widely-used PID controller whilst making it easy to replace the PID controller unit or module with his new algorithm. It was the advent of digital control technology and the use of software control algorithms that made this replacement easier and more acceptable to process engineers. A decade of industrial practice with PFC was reported in the archival literature by Jacques Richalet et al. in 1978 in an important seminal Automatica paper. Around this time, Cutler and Ramaker published the dynamic matrix control algorithm that also used knowledge of future reference signals to determine a sequence of control signal adjustment. Thus, the theoretical and practical development of predictive control methods was underway and subsequent developments included those of generalized predictive control, and the whole armoury of MPC methods. Jacques Richalet’s approach to PFC was to seek an algorithm that was: • easy to understand; • easy to install; • easy to tune and optimise. He sought a new modular control algorithm that could be readily used by the control-technician engineer or the control-instrument engineer. It goes without saying that this objective also forms a good market strategy.
Author: Somnath Bhattacharyya Publisher: Springer Nature ISBN: 9811536155 Category : Mathematics Languages : en Pages : 497
Book Description
This book features original research papers presented at the International Conference on Computational and Applied Mathematics, held at the Indian Institute of Technology Kharagpur, India during November 23–25, 2018. This book covers various topics under applied mathematics, ranging from modeling of fluid flow, numerical techniques to physical problems, electrokinetic transport phenomenon, graph theory and optimization, stochastic modelling and machine learning. It introduces the mathematical modeling of complicated scientific problems, discusses micro- and nanoscale transport phenomena, recent development in sophisticated numerical algorithms with applications, and gives an in-depth analysis of complicated real-world problems. With contributions from internationally acclaimed academic researchers and experienced practitioners and covering interdisciplinary applications, this book is a valuable resource for researchers and students in fields of mathematics, statistics, engineering, and health care.
Author: S. M. Sohel Murshed Publisher: BoD – Books on Demand ISBN: 9535124056 Category : Computers Languages : en Pages : 184
Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: National Academies of Sciences, Engineering, and Medicine Publisher: National Academies Press ISBN: 0309377870 Category : Political Science Languages : en Pages : 379
Book Description
The Small Business Innovation Research (SBIR) program is one of the largest examples of U.S. public-private partnerships, and was established in 1982 to encourage small businesses to develop new processes and products and to provide quality research in support of the U.S. government's many missions. The U.S. Congress tasked the National Research Council with undertaking a comprehensive study of how the SBIR program has stimulated technological innovation and used small businesses to meet federal research and development needs, and with recommending further improvements to the program. In the first round of this study, an ad hoc committee prepared a series of reports from 2004 to 2009 on the SBIR program at the five agencies responsible for 96 percent of the program's operations-including NASA. In a follow-up to the first round, NASA requested from the Academies an assessment focused on operational questions in order to identify further improvements to the program. Public-private partnerships like SBIR are particularly important since today's knowledge economy is driven in large part by the nation's capacity to innovate. One of the defining features of the U.S. economy is a high level of entrepreneurial activity. Entrepreneurs in the United States see opportunities and are willing and able to assume risk to bring new welfare-enhancing, wealth-generating technologies to the market. Yet, although discoveries in various fields present new opportunities, converting these discoveries into innovations for the market involves substantial challenges. The American capacity for innovation can be strengthened by addressing the challenges faced by entrepreneurs.
Author: Ercan M. Dede Publisher: Springer ISBN: 1447156404 Category : Computers Languages : en Pages : 225
Book Description
This book highlights a unique combination of numerical tools and strategies for handling the challenges of multiphysics simulation, with a specific focus on electromechanical systems as the target application. Features: introduces the concept of design via simulation, along with the role of multiphysics simulation in today’s engineering environment; discusses the importance of structural optimization techniques in the design and development of electromechanical systems; provides an overview of the physics commonly involved with electromechanical systems for applications such as electronics, magnetic components, RF components, actuators, and motors; reviews the governing equations for the simulation of related multiphysics problems; outlines relevant (topology and parametric size) optimization methods for electromechanical systems; describes in detail several multiphysics simulation and optimization example studies in both two and three dimensions, with sample numerical code.
Author: Madhusudan Iyengar Publisher: World Scientific ISBN: 9811279381 Category : Technology & Engineering Languages : en Pages : 479
Book Description
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Author: Suvanjan Bhattacharyya Publisher: Springer Nature ISBN: 9811970556 Category : Technology & Engineering Languages : en Pages : 479
Book Description
This book presents the select proceedings of the 48th National Conference on Fluid Mechanics and Fluid Power (FMFP 2021) held at BITS Pilani in December 2021. It covers the topics such as fluid mechanics, measurement techniques in fluid flows, computational fluid dynamics, instability, transition and turbulence, fluid‐structure interaction, multiphase flows, micro- and nanoscale transport, bio-fluid mechanics, aerodynamics, turbomachinery, propulsion and power. The book will be useful for researchers and professionals interested in the broad field of mechanics.
Author: Peter Wellmann Publisher: John Wiley & Sons ISBN: 3527346716 Category : Technology & Engineering Languages : en Pages : 743
Book Description
Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.
Author: Hengyun Zhang
Author: Hengyun Zhang
Author: Xiaobing Luo
Author: Jacques Richalet
Author: Somnath Bhattacharyya
Author: S. M. Sohel Murshed
Author: National Academies of Sciences, Engineering, and Medicine
Author: Ercan M. Dede
Author: Madhusudan Iyengar
Author: Suvanjan Bhattacharyya
Author: Peter Wellmann