Author: W. H. Shafer
Publisher: Springer Science & Business Media
ISBN: 1475757859
Category : Science
Languages : en
Pages : 307
Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and dis seminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the ac tivity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volume were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 24 (thesis year 1979) a total of 10,033 theses titles from 26 Canadian and 215 United States universities. We are sure that this broader base for theses titles reported will greatly enhance the value of this important annual reference work. While Volume 24 reports these submitted in 1979, on occasion, certain universities do report theses submitted in previous years but not reported at the time.
Masters Theses in the Pure and Applied Sciences
Author: W. H. Shafer
Publisher: Springer Science & Business Media
ISBN: 1475757859
Category : Science
Languages : en
Pages : 307
Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and dis seminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the ac tivity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volume were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 24 (thesis year 1979) a total of 10,033 theses titles from 26 Canadian and 215 United States universities. We are sure that this broader base for theses titles reported will greatly enhance the value of this important annual reference work. While Volume 24 reports these submitted in 1979, on occasion, certain universities do report theses submitted in previous years but not reported at the time.
Publisher: Springer Science & Business Media
ISBN: 1475757859
Category : Science
Languages : en
Pages : 307
Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and dis seminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the ac tivity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volume were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 24 (thesis year 1979) a total of 10,033 theses titles from 26 Canadian and 215 United States universities. We are sure that this broader base for theses titles reported will greatly enhance the value of this important annual reference work. While Volume 24 reports these submitted in 1979, on occasion, certain universities do report theses submitted in previous years but not reported at the time.
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 994
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 994
Book Description
Scientific and Technical Aerospace Reports
Proceedings
Low-Frequency Noise in Advanced MOS Devices
Author: Martin Haartman
Publisher: Springer Science & Business Media
ISBN: 1402059108
Category : Technology & Engineering
Languages : en
Pages : 224
Book Description
This is an introduction to noise, describing fundamental noise sources and basic circuit analysis, discussing characterization of low-frequency noise and offering practical advice that bridges concepts of noise theory and modelling, characterization, CMOS technology and circuits. The text offers the latest research, reviewing the most recent publications and conference presentations. The book concludes with an introduction to noise in analog/RF circuits and describes how low-frequency noise can affect these circuits.
Publisher: Springer Science & Business Media
ISBN: 1402059108
Category : Technology & Engineering
Languages : en
Pages : 224
Book Description
This is an introduction to noise, describing fundamental noise sources and basic circuit analysis, discussing characterization of low-frequency noise and offering practical advice that bridges concepts of noise theory and modelling, characterization, CMOS technology and circuits. The text offers the latest research, reviewing the most recent publications and conference presentations. The book concludes with an introduction to noise in analog/RF circuits and describes how low-frequency noise can affect these circuits.
Analysis and Simulation of Noise in Nonlinear Electronic Circuits and Systems
Author: Alper Demir
Publisher: Springer Science & Business Media
ISBN: 1461560632
Category : Technology & Engineering
Languages : en
Pages : 278
Book Description
In electronic circuit and system design, the word noise is used to refer to any undesired excitation on the system. In other contexts, noise is also used to refer to signals or excitations which exhibit chaotic or random behavior. The source of noise can be either internal or external to the system. For instance, the thermal and shot noise generated within integrated circuit devices are in ternal noise sources, and the noise picked up from the environment through electromagnetic interference is an external one. Electromagnetic interference can also occur between different components of the same system. In integrated circuits (Ies), signals in one part of the system can propagate to the other parts of the same system through electromagnetic coupling, power supply lines and the Ie substrate. For instance, in a mixed-signal Ie, the switching activity in the digital parts of the circuit can adversely affect the performance of the analog section of the circuit by traveling through the power supply lines and the substrate. Prediction of the effect of these noise sources on the performance of an electronic system is called noise analysis or noise simulation. A methodology for the noise analysis or simulation of an electronic system usually has the following four components: 2 NOISE IN NONLINEAR ELECTRONIC CIRCUITS • Mathematical representations or models for the noise sources. • Mathematical model or representation for the system that is under the in fluence of the noise sources.
Publisher: Springer Science & Business Media
ISBN: 1461560632
Category : Technology & Engineering
Languages : en
Pages : 278
Book Description
In electronic circuit and system design, the word noise is used to refer to any undesired excitation on the system. In other contexts, noise is also used to refer to signals or excitations which exhibit chaotic or random behavior. The source of noise can be either internal or external to the system. For instance, the thermal and shot noise generated within integrated circuit devices are in ternal noise sources, and the noise picked up from the environment through electromagnetic interference is an external one. Electromagnetic interference can also occur between different components of the same system. In integrated circuits (Ies), signals in one part of the system can propagate to the other parts of the same system through electromagnetic coupling, power supply lines and the Ie substrate. For instance, in a mixed-signal Ie, the switching activity in the digital parts of the circuit can adversely affect the performance of the analog section of the circuit by traveling through the power supply lines and the substrate. Prediction of the effect of these noise sources on the performance of an electronic system is called noise analysis or noise simulation. A methodology for the noise analysis or simulation of an electronic system usually has the following four components: 2 NOISE IN NONLINEAR ELECTRONIC CIRCUITS • Mathematical representations or models for the noise sources. • Mathematical model or representation for the system that is under the in fluence of the noise sources.
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1948
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1948
Book Description
Substrate Noise Coupling in Mixed-Signal ASICs
Author: Stéphane Donnay
Publisher: Springer Science & Business Media
ISBN: 0306481707
Category : Technology & Engineering
Languages : en
Pages : 311
Book Description
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Publisher: Springer Science & Business Media
ISBN: 0306481707
Category : Technology & Engineering
Languages : en
Pages : 311
Book Description
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
CMBEBIH 2017
Author: Almir Badnjevic
Publisher: Springer
ISBN: 9811041660
Category : Technology & Engineering
Languages : en
Pages : 806
Book Description
This volume presents the proceedings of the International Conference on Medical and Biological Engineering held from 16 to 18 March 2017 in Sarajevo, Bosnia and Herzegovina. Focusing on the theme of ‘Pursuing innovation. Shaping the future’, it highlights the latest advancements in Biomedical Engineering and also presents the latest findings, innovative solutions and emerging challenges in this field. Topics include: - Biomedical Signal Processing - Biomedical Imaging and Image Processing - Biosensors and Bioinstrumentation - Bio-Micro/Nano Technologies - Biomaterials - Biomechanics, Robotics and Minimally Invasive Surgery - Cardiovascular, Respiratory and Endocrine Systems Engineering - Neural and Rehabilitation Engineering - Molecular, Cellular and Tissue Engineering - Bioinformatics and Computational Biology - Clinical Engineering and Health Technology Assessment - Health Informatics, E-Health and Telemedicine - Biomedical Engineering Education - Pharmaceutical Engineering
Publisher: Springer
ISBN: 9811041660
Category : Technology & Engineering
Languages : en
Pages : 806
Book Description
This volume presents the proceedings of the International Conference on Medical and Biological Engineering held from 16 to 18 March 2017 in Sarajevo, Bosnia and Herzegovina. Focusing on the theme of ‘Pursuing innovation. Shaping the future’, it highlights the latest advancements in Biomedical Engineering and also presents the latest findings, innovative solutions and emerging challenges in this field. Topics include: - Biomedical Signal Processing - Biomedical Imaging and Image Processing - Biosensors and Bioinstrumentation - Bio-Micro/Nano Technologies - Biomaterials - Biomechanics, Robotics and Minimally Invasive Surgery - Cardiovascular, Respiratory and Endocrine Systems Engineering - Neural and Rehabilitation Engineering - Molecular, Cellular and Tissue Engineering - Bioinformatics and Computational Biology - Clinical Engineering and Health Technology Assessment - Health Informatics, E-Health and Telemedicine - Biomedical Engineering Education - Pharmaceutical Engineering