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Author: R. G. Kelly Publisher: ISBN: Category : Concrete Languages : en Pages : 46
Book Description
The aim of this program was the development of a small and completely embeddable microinstrument for corrosivity measurement in concrete. It should contain all the electronics for the electrochemical measurements, the means for data transfer between engineer and device, and sensors sensitive to the different corrosivity parameters. The goals of the work reported here were to develop and test the required sensors and electronics in a laboratory setting. Sensors for the measurement of corrosion rate, corrosion potential, chloride concentration, and concrete conductivity were developed and tested in laboratory-scale concrete slabs. The tests included electrochemical chloride driving as a method for test acceleration and wet/dry cycling. The corrosion sensor consists of a piece of reinforcing steel as working electrode, another rebar piece or a platinized Nb-mesh as counterelectrode, and an Ag/AgCI electrode as reference electrode. The conductivity sensor is based on a modified Wenner four-pin method and made of four parallel Au wires. Both sensors work very well. Chloride introduced into the concrete electrochemically induced corrosion on the corrosion sensor, as seen by a decrease in potential and in the polarization resistance. The potentials recovered after more than 1000 h of electrochemical chloride removal, but the corrosion resistance did not regain its original value. The change in chloride content was monitored by a silver/silver chloride chloride sensor. The only present drawback of the microinstrument is the construction of a long-term reliable reference electrode. The best candidates seem to be Ni/W galvanic couple and lead. A micropotentiostat coupled to a zero-resistance ammeter and a microgalvanostat based on operational amplifiers were designed: and heart of a complete measurement system, which includes on two double surface mount boards the ASIC, a microprocessor, control circuitry, and connections to the external corrosivity sensors, as well as RF transceiver circuitry for the wireless communication with the instrument.
Author: R. G. Kelly Publisher: ISBN: Category : Concrete Languages : en Pages : 46
Book Description
The aim of this program was the development of a small and completely embeddable microinstrument for corrosivity measurement in concrete. It should contain all the electronics for the electrochemical measurements, the means for data transfer between engineer and device, and sensors sensitive to the different corrosivity parameters. The goals of the work reported here were to develop and test the required sensors and electronics in a laboratory setting. Sensors for the measurement of corrosion rate, corrosion potential, chloride concentration, and concrete conductivity were developed and tested in laboratory-scale concrete slabs. The tests included electrochemical chloride driving as a method for test acceleration and wet/dry cycling. The corrosion sensor consists of a piece of reinforcing steel as working electrode, another rebar piece or a platinized Nb-mesh as counterelectrode, and an Ag/AgCI electrode as reference electrode. The conductivity sensor is based on a modified Wenner four-pin method and made of four parallel Au wires. Both sensors work very well. Chloride introduced into the concrete electrochemically induced corrosion on the corrosion sensor, as seen by a decrease in potential and in the polarization resistance. The potentials recovered after more than 1000 h of electrochemical chloride removal, but the corrosion resistance did not regain its original value. The change in chloride content was monitored by a silver/silver chloride chloride sensor. The only present drawback of the microinstrument is the construction of a long-term reliable reference electrode. The best candidates seem to be Ni/W galvanic couple and lead. A micropotentiostat coupled to a zero-resistance ammeter and a microgalvanostat based on operational amplifiers were designed: and heart of a complete measurement system, which includes on two double surface mount boards the ASIC, a microprocessor, control circuitry, and connections to the external corrosivity sensors, as well as RF transceiver circuitry for the wireless communication with the instrument.
Author: John G. Webster Publisher: CRC Press ISBN: 1439863261 Category : Medical Languages : en Pages : 1639
Book Description
This new edition of the bestselling Measurement, Instrumentation, and Sensors Handbook brings together all aspects of the design and implementation of measurement, instrumentation, and sensors. Reflecting the current state of the art, it describes the use of instruments and techniques for performing practical measurements in engineering, physics, chemistry, and the life sciences; explains sensors and the associated hardware and software; and discusses processing systems, automatic data acquisition, reduction and analysis, operation characteristics, accuracy, errors, calibrations, and the incorporation of standards for control purposes. Organized according to measurement problem, the Second Edition: Consists of 2 volumes Features contributions from 240+ field experts Contains 53 new chapters, plus updates to all 194 existing chapters Addresses different ways of making measurements for given variables Emphasizes modern intelligent instruments and techniques, human factors, modern display methods, instrument networks, and virtual instruments Explains modern wireless techniques, sensors, measurements, and applications A concise and useful reference for engineers, scientists, academic faculty, students, designers, managers, and industry professionals involved in instrumentation and measurement research and development, Measurement, Instrumentation, and Sensors Handbook, Second Edition provides readers with a greater understanding of advanced applications.
Author: John G. Webster Publisher: CRC Press ISBN: 1439848882 Category : Medical Languages : en Pages : 1641
Book Description
The Second Edition of the bestselling Measurement, Instrumentation, and Sensors Handbook brings together all aspects of the design and implementation of measurement, instrumentation, and sensors. Reflecting the current state of the art, it describes the use of instruments and techniques for performing practical measurements in engineering, physics, chemistry, and the life sciences and discusses processing systems, automatic data acquisition, reduction and analysis, operation characteristics, accuracy, errors, calibrations, and the incorporation of standards for control purposes. Organized according to measurement problem, the Spatial, Mechanical, Thermal, and Radiation Measurement volume of the Second Edition: Contains contributions from field experts, new chapters, and updates to all 96 existing chapters Covers instrumentation and measurement concepts, spatial and mechanical variables, displacement, acoustics, flow and spot velocity, radiation, wireless sensors and instrumentation, and control and human factors A concise and useful reference for engineers, scientists, academic faculty, students, designers, managers, and industry professionals involved in instrumentation and measurement research and development, Measurement, Instrumentation, and Sensors Handbook, Second Edition: Spatial, Mechanical, Thermal, and Radiation Measurement provides readers with a greater understanding of advanced applications.
Author: Rao Tummala Publisher: McGraw Hill Professional ISBN: 0071500596 Category : Technology & Engineering Languages : en Pages : 979
Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Jan Korvink Publisher: William Andrew ISBN: 0815518285 Category : Technology & Engineering Languages : en Pages : 993
Book Description
Does MEMS technology offer advantages to your company's products? Will miniature machines on a chip solve your application objectives for ôsmaller, better, cheaper, and faster'ö If you are a product development engineer or manager, the decision to design a MEMS device implies having an application and market. This book offers you a practical guide to making this important business decision. Here, both veterans and newcomers to MEMS device design will get advice on evaluating MEMS for their business, followed by guidance on selecting solutions, technologies and design support tools. You will see how experts from around the world have explored MEMS possibilities and achieved new breakthrough devices such as RF-MEMS for mobile telecommunications, micro-optics for internet hardware, catheter-based minimal-invasive operating theatre tools, and in vivo monitoring of exact dosage of medication in ailing patients. This handbook offers a wealth of analytical techniques treating problematic areas such as alternative designs reliability, packaging, and cost effectiveness.
Author: Marc J. Madou Publisher: CRC Press ISBN: 1482274663 Category : Technology & Engineering Languages : en Pages : 1983
Book Description
Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences, and includes sections on solid-state physics, quantum mechanics, crystallography, and fluidics. The second volume presents a very large set of manufacturing techniques for micro- and nanofabrication and covers different forms of lithography, material removal processes, and additive technologies. The third volume focuses on manufacturing techniques and applications of Bio-MEMS and Bio-NEMS. Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems. The author characterizes and defines major research areas and illustrates them with examples pulled from the most recent literature and from his own work.
Author: Ampere A. Tseng Publisher: World Scientific ISBN: 9812790896 Category : Technology & Engineering Languages : en Pages : 583
Book Description
Many of the devices and systems used in modern industry are becoming progressively smaller and have reached the nanoscale domain. Nanofabrication aims at building nanoscale structures, which can act as components, devices, or systems, in large quantities at potentially low cost. Nanofabrication is vital to all nanotechnology fields, especially for the realization of nanotechnology that involves the traditional areas across engineering and science. This is the first book solely dedicated to the manufacturing technology in nanoscale structures, devices, and systems and is designed to satisfy the growing demands of researchers, professionals, and graduate students. Both conventional and non-conventional fabrication technologies are introduced with emphasis on multidisciplinary principles, methodologies, and practical applications. While conventional technologies consider the emerging techniques developed for next generation lithography, non-conventional techniques include scanning probe microscopy lithography, self-assembly, and imprint lithography, as well as techniques specifically developed for making carbon tubes and molecular circuits and devices. Sample Chapter(s). Chapter 1: Atom, Molecule, and Nanocluster Manipulations for Nanostructure Fabrication Using Scanning Probe Microscopy (3,320 KB). Contents: Atomic Force Microscope Lithography (N Kawasegi et al.); Nanowire Assembly and Integration (Z Gu & D H Gracias); Extreme Ultraviolet Lithography (H Kinoshita); Electron Projection Lithography (T Miura et al.); Electron Beam Direct Writing (K Yamazaki); Electron Beam Induced Deposition (K Mitsuishi); Focused Ion Beams and Interaction with Solids (T Ishitani et al.); Nanofabrication of Nanoelectromechanical Systems (NEMS): Emerging Techniques (K L Ekinci & J Brugger); and other papers. Readership: Researchers, professionals, and graduate students in the fields of nanoengineering and nanoscience.
Author: R. G. Kelly
Author: R. G. Kelly
Author: John G. Webster
Author: John G. Webster
Author: 
Author: 
Author: 
Author: Rao Tummala
Author: Jan Korvink
Author: Marc J. Madou
Author: Ampere A. Tseng