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Author: Wonhee Lee Publisher: Springer ISBN: 3319441396 Category : Technology & Engineering Languages : en Pages : 287
Book Description
This book delves into the recent developments in the microscale and microfluidic technologies that allow manipulation at the single and cell aggregate level. Expert authors review the dominant mechanisms that manipulate and sort biological structures, making this a state-of-the-art overview of conventional cell sorting techniques, the principles of microfluidics, and of microfluidic devices. All chapters highlight the benefits and drawbacks of each technique they discuss, which include magnetic, electrical, optical, acoustic, gravity/sedimentation, inertial, deformability, and aqueous two-phase systems as the dominant mechanisms utilized by microfluidic devices to handle biological samples. Each chapter explains the physics of the mechanism at work, and reviews common geometries and devices to help readers decide the type of style of device required for various applications. This book is appropriate for graduate-level biomedical engineering and analytical chemistry students, as well as engineers and scientists working in the biotechnology industry.
Author: Simeon M. Metev Publisher: Springer Science & Business Media ISBN: 3642973272 Category : Technology & Engineering Languages : en Pages : 283
Book Description
Laser-Assisted Microtechnology deals with laser applications to a wide variety of problems in microelectronic design and fabrication. It covers micromachining of thin films, microprocessing of materials, maskless laser micropatterning and laser-assisted synthesis of thin-film systems. The monograph describes fundamental aspects and practical details of the technological processes as well as the optimum conditions for their realization.
Author: Wonhee Lee Publisher: Springer ISBN: 3319441396 Category : Technology & Engineering Languages : en Pages : 287
Book Description
This book delves into the recent developments in the microscale and microfluidic technologies that allow manipulation at the single and cell aggregate level. Expert authors review the dominant mechanisms that manipulate and sort biological structures, making this a state-of-the-art overview of conventional cell sorting techniques, the principles of microfluidics, and of microfluidic devices. All chapters highlight the benefits and drawbacks of each technique they discuss, which include magnetic, electrical, optical, acoustic, gravity/sedimentation, inertial, deformability, and aqueous two-phase systems as the dominant mechanisms utilized by microfluidic devices to handle biological samples. Each chapter explains the physics of the mechanism at work, and reviews common geometries and devices to help readers decide the type of style of device required for various applications. This book is appropriate for graduate-level biomedical engineering and analytical chemistry students, as well as engineers and scientists working in the biotechnology industry.
Author: Arno Lenk Publisher: Springer Science & Business Media ISBN: 3642108067 Category : Technology & Engineering Languages : en Pages : 483
Book Description
Electromechanical systems consisting of electrical, mechanical and acoustic subsystems are of special importance in various technical fields, e.g. precision device engineering, sensor and actuator technology, electroacoustics and medical engineering. Based on a circuit-oriented representation, providing readers with a descriptive engineering design method for these systems is the goal of this textbook. It offers an easy and fast introduction to mechanical, acoustic, fluid, thermal and hydraulic problems through the application of circuit-oriented basic knowledge. The network description methodology, presented in detail, is extended to finite network elements and combined with the finite element method (FEM): the combination of the advantages of both description methods results in novel approaches, especially in the higher frequency range. The book offers numerous current examples of both the design of sensors and actuators and that of direct coupled sensor-actuator systems. The appendix provides more extensive fundamentals for signal description, as well as a compilation of important material characteristics. The textbook is suitable both for graduate students and for engineers working in the fields of electrical engineering, information technology, mechatronics, microtechnology, and mechanical and medical engineering.
Author: Johan Liu Publisher: Springer Science & Business Media ISBN: 144195760X Category : Technology & Engineering Languages : en Pages : 216
Book Description
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
Author: Jürg Schwizer Publisher: Springer Science & Business Media ISBN: 3540269452 Category : Technology & Engineering Languages : en Pages : 184
Book Description
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Author: M. Elwenspoek Publisher: Springer Science & Business Media ISBN: 3662043211 Category : Technology & Engineering Languages : en Pages : 306
Book Description
This book on mechanical microsensors is based on a course organized by the Swiss Foundation for Research in Microtechnology (FSRM) in Neuchatel, Swit zerland, and developed and taught by the authors. Support by FSRM is herewith gratefully acknowledged. This book attempts to serve two purposes. First it gives an overview on me chanical microsensors (sensors for pressure, force, acceleration, angular rate and fluid flow, realized by silicon micromachining). Second, it serves as a textbook for engineers to give them a comprehensive introduction on the basic design issues of these sensors. Engineers active in sensor design are usually educated either in electrical engineering or mechanical engineering. These classical educa tional pro grams do not prepare the engineer for the challenging task of sensor design since sensors are instruments typically bridging the disciplines: one needs a rather deep understanding of both mechanics and electronics. Accordingly, the book contains discussion of the basic engineering sciences relevant to mechanical sensors, hopefully in a way that it is accessible for all colours of engineers. Engi rd th neering students in their 3 or 4 year should have enough knowledge to be able to follow the arguments presented in this book. In this sense, this book should be useful as textbook for students in courses on mechanical microsensors (as is CUf rently being done at the University ofTwente).
Author: Howard F. Didsbury, Jr. Publisher: World Future Society ISBN: 9780930242596 Category : Literary Collections Languages : en Pages : 372
Book Description
This outstanding collection of essays offers thought-provoking insights on a range of future-shaping issues, such as harnessing the powers of a coming "digital transformation," creating more livable cities, dealing with the impacts of immigration, transforming school systems to meet the needs of the future economy, solving the drug-abuse problem through systems thinking, and overcoming traps in thinking about the future.
Author: Pierre Lambert Publisher: Springer Science & Business Media ISBN: 3642375529 Category : Technology & Engineering Languages : en Pages : 338
Book Description
This book describes how surface tension effects can be used by engineers to provide mechanical functions in miniaturized products (1 mm). Even if precursors of this field such as Jurin or Laplace already date back to the 18th century, describing surface tension effects from a mechanical perspective is very recent.brThe originality of this book is to consider the effects of capillary bridges on solids, including forces and torques exerted both statically and dynamically by the liquid along the 6 degrees-of-freedom.brIt provides a comprehensive approach to various applications, such as capillary adhesion (axial force), centering force in packaging and micro-assembly (lateral force) and recent developments such as a capillary motor (torque).
Author: Zhong Lin Wang Publisher: Springer Science & Business Media ISBN: 364234237X Category : Technology & Engineering Languages : en Pages : 254
Book Description
The fundamental principle of piezotronics and piezo-phototronics were introduced by Wang in 2007 and 2010, respectively. Due to the polarization of ions in a crystal that has non-central symmetry in materials, such as the wurtzite structured ZnO, GaN and InN, a piezoelectric potential (piezopotential) is created in the crystal by applying a stress. Owing to the simultaneous possession of piezoelectricity and semiconductor properties, the piezopotential created in the crystal has a strong effect on the carrier transport at the interface/junction. Piezotronics is for devices fabricated using the piezopotential as a “gate” voltage to control charge carrier transport at a contact or junction. The piezo-phototronic effect uses the piezopotential to control the carrier generation, transport, separation and/or recombination for improving the performance of optoelectronic devices, such as photon detector, solar cell and LED. The functionality offered by piezotroics and piezo-phototronics are complimentary to CMOS technology. There is an effective integration of piezotronic and piezo-phototronic devices with silicon based CMOS technology. Unique applications can be found in areas such as human-computer interfacing, sensing and actuating in nanorobotics, smart and personalized electronic signatures, smart MEMS/NEMS, nanorobotics and energy sciences. This book introduces the fundamentals of piezotronics and piezo-phototronics and advanced applications. It gives guidance to researchers, engineers and graduate students.
Author: Wonhee Lee
Author: Susan Attenborough
Author: Simeon M. Metev
Author: Wonhee Lee
Author: Arno Lenk
Author: Johan Liu
Author: Jürg Schwizer
Author: M. Elwenspoek
Author: Howard F. Didsbury, Jr.
Author: Pierre Lambert
Author: Zhong Lin Wang