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Author: Ed Doyle Publisher: ISBN: Category : Microelectronics Languages : en Pages : 700
Book Description
The objective of this procedural guide was not to present an expose of device failure modes/mechanisms and applicable techniques for detection, identification and measurement but rather to provide a treatise on proven failure analysis techniques, equipment, procedures and expected analytical results. The guide thus represents a compilation and description of practical semiconductor failure analysis techniques rather than failure analysis flow sequences for verifying specific device failure mechanisms. (Author).
Author: Ed Doyle Publisher: ISBN: Category : Microelectronics Languages : en Pages : 700
Book Description
The objective of this procedural guide was not to present an expose of device failure modes/mechanisms and applicable techniques for detection, identification and measurement but rather to provide a treatise on proven failure analysis techniques, equipment, procedures and expected analytical results. The guide thus represents a compilation and description of practical semiconductor failure analysis techniques rather than failure analysis flow sequences for verifying specific device failure mechanisms. (Author).
Author: Publisher: ASM International ISBN: 0871708043 Category : Technology & Engineering Languages : en Pages : 813
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author: Tejinder Gandhi Publisher: ASM International ISBN: 1627082468 Category : Technology & Engineering Languages : en Pages : 750
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author: Publisher: ASM International ISBN: 0871707691 Category : Technology & Engineering Languages : en Pages : 160
Book Description
Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Author: Perry L. Martin Publisher: McGraw Hill Professional ISBN: 9780070410442 Category : Technology & Engineering Languages : en Pages : 770
Book Description
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author: Perry L. Martin Publisher: McGraw-Hill Professional Publishing ISBN: Category : Technology & Engineering Languages : en Pages : 776
Book Description
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author: Richard J. Ross Publisher: ASM International(OH) ISBN: Category : Education Languages : en Pages : 664
Book Description
Forty-seven papers on electronics failure analysis provide an overview for newcomers to the field and a reference tool for the experienced analyst. Topics include electron/ion bean-based techniques, deprocessing and sample preparation, and physical/chemical defect characterization. For the fourth ed
Author: Friedrich Beck Publisher: John Wiley & Sons ISBN: 9780471974017 Category : Technology & Engineering Languages : en Pages : 198
Book Description
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Author: Ed Doyle
Author: Ed Doyle
Author: 
Author: Tejinder Gandhi
Author: EDFAS Desk Reference Committee
Author: Ed Doyle (Jr.)
Author: 
Author: Perry L. Martin
Author: Perry L. Martin
Author: Richard J. Ross
Author: Friedrich Beck