Microelectronics Manufacturing Diagnostics Handbook PDF Download
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Author: Abraham Landzberg Publisher: Springer Science & Business Media ISBN: 1461520290 Category : Technology & Engineering Languages : en Pages : 663
Book Description
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author: Abraham Landzberg Publisher: Springer Science & Business Media ISBN: 1461520290 Category : Technology & Engineering Languages : en Pages : 663
Book Description
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author: E. Beyne Publisher: Springer Science & Business Media ISBN: 9401155062 Category : Technology & Engineering Languages : en Pages : 358
Book Description
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Author: P. Singh Publisher: Springer Science & Business Media ISBN: 9780412105913 Category : Technology & Engineering Languages : en Pages : 398
Book Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author: D.S. Campbell Publisher: CRC Press ISBN: 9782881249990 Category : Technology & Engineering Languages : en Pages : 404
Book Description
This text, though primarily concerned with the properties and structure of resistors and capacitors, also provides a comprehensive general introduction to the electronic properties of materials used in the manufacture of electronic components. Coverage includes the band theory of materials and the conduction mechanisms in metals, dielectrics and other structures. The manufacture, structure and properties of fixed and variable resistors and capacitors are discussed in detail. Also included are non-linear components such as NTC and PTC thermistors, strain gauges, pressure transducers, varistors and sensors. The text concludes with a chapter on the quality and reliability of electronic devices with practical values of field reliability performance quoted.
Author: United States. National Bureau of Standards. Technical Information and Publications Division Publisher: ISBN: Category : Government publications Languages : en Pages : 844
Author: Edward B. Hakim Publisher: Artech House Publishers ISBN: Category : Technology & Engineering Languages : en Pages : 400
Book Description
Text/reference spaning the theoretical concepts of reliability models and failure distributions, to GaAs microcircuit processing and test. Provides background on the development of quality assurance and verification procedures. Some of the new changes under development to cope with pressures brought
Author: Willem Dirk van Driel Publisher: Springer Nature ISBN: 3030815765 Category : Technology & Engineering Languages : en Pages : 552
Book Description
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Author: Abraham Landzberg
Author: Abraham Landzberg
Author: Edward B. Hakim
Author: E. Beyne
Author: Willem Dirk van Driel
Author: P. Singh
Author: D.S. Campbell
Author: United States. National Bureau of Standards. Technical Information and Publications Division
Author: Edward B. Hakim
Author: Willem Dirk van Driel
Author: United States. National Aeronautics and Space Administration