Author: Kevin Allan ShawPublisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 300
Book Description
Methods of Integrating Scream Micromachined Devices with Integrated Circuits
Author: Kevin Allan ShawPublisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 300
Book Description
Issues in Integration of Scream Micro-mechanical Structures with Integrated Circuits
Author: Madanagopal Vinjimur KunnavakkamPublisher:
ISBN:
Category :
Languages : en
Pages : 104
Book Description
Micromachined Devices and Components
Author: MEMS: A Practical Guide of Design, Analysis, and Applications
Author: Jan KorvinkPublisher: Springer Science & Business Media
ISBN: 3540336559
Category : Technology & Engineering
Languages : en
Pages : 981
Book Description
A new generation of MEMS books has emerged with this cohesive guide on the design and analysis of micro-electro-mechanical systems (MEMS). Leading experts contribute to its eighteen chapters that encompass a wide range of innovative and varied applications. This publication goes beyond fabrication techniques covered by earlier books and fills a void created by a lack of industry standards. Subjects such as transducer operations and free-space microsystems are contained in its chapters. Satisfying a demand for literature on analysis and design of microsystems the book deals with a broad array of industrial applications. This will interest engineering and research scientists in industry and academia.
MEMS and MOEMS Technology and Applications
Author: P. Rai-ChoudhuryPublisher: SPIE Press
ISBN: 9780819437167
Category : Technology & Engineering
Languages : en
Pages : 544
Book Description
The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Microsystems and Nanotechnology
Author: Zhaoying ZhouPublisher: Springer Science & Business Media
ISBN: 3642182933
Category : Technology & Engineering
Languages : en
Pages : 1011
Book Description
“Microsystems and Nanotechnology” presents the latest science and engineering research and achievements in the fields of microsystems and nanotechnology, bringing together contributions by authoritative experts from the United States, Germany, Great Britain, Japan and China to discuss the latest advances in microelectromechanical systems (MEMS) technology and micro/nanotechnology. The book is divided into five parts – the fundamentals of microsystems and nanotechnology, microsystems technology, nanotechnology, application issues, and the developments and prospects – and is a valuable reference for students, teachers and engineers working with the involved technologies. Professor Zhaoying Zhou is a professor at the Department of Precision Instruments & Mechanology , Tsinghua University , and the Chairman of the MEMS & NEMS Society of China. Dr. Zhonglin Wang is the Director of the Center for Nanostructure Characterization, Georgia Tech, USA. Dr. Liwei Lin is a Professor at the Department of Mechanical Engineering, University of California at Berkeley, USA.
3D and Circuit Integration of MEMS
Author: Masayoshi EsashiPublisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Sensors and Their Applications XII
Author: S. J. ProsserPublisher: CRC Press
ISBN: 148228961X
Category : Science
Languages : en
Pages : 657
Book Description
Sensors and Their Applications XII discusses novel research in the areas of sensors and transducers and provides insight into new and topical applications of this technology. It covers the underlying physics, fabrication technologies, and commercial applications of sensors. Some of the topics discussed include optical sensing, sensing materials, no
Proceedings of the International Conference on Smart Materials, Structures and Systems
Author: Publisher: Allied Publishers
ISBN: 9788170239581
Category :
Languages : en
Pages : 762
Book Description
Microsystem Technology
Author: Wolfgang MenzPublisher: John Wiley & Sons
ISBN: 3527613013
Category : Technology & Engineering
Languages : en
Pages : 512
Book Description
This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.