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Author: L. B. Freund Publisher: Cambridge University Press ISBN: 9781139449823 Category : Technology & Engineering Languages : en Pages : 772
Book Description
Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
Author: L. B. Freund Publisher: Cambridge University Press ISBN: 9781139449823 Category : Technology & Engineering Languages : en Pages : 772
Book Description
Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
Author: Yangyuan Wang Publisher: Springer Nature ISBN: 9819928362 Category : Technology & Engineering Languages : en Pages : 2006
Book Description
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Author: Robert Leon Opila Publisher: The Electrochemical Society ISBN: 9781566772600 Category : Technology & Engineering Languages : en Pages : 664
Book Description
This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Author: William Greig Publisher: Springer Science & Business Media ISBN: 0387339132 Category : Technology & Engineering Languages : en Pages : 312
Book Description
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author: Michael Reisch Publisher: Springer Science & Business Media ISBN: 364255900X Category : Technology & Engineering Languages : en Pages : 671
Book Description
This modern book-length treatment gives a detailed presentation of high-frequency bipolar transistors in silicon or silicon-germanium technology, with particular emphasis placed on today's advanced compact models and their physical foundations.
Author: Mac E. Van Valkenburg Publisher: Elsevier ISBN: 0080515967 Category : Technology & Engineering Languages : en Pages : 1689
Book Description
Reference Data for Engineers is the most respected, reliable, and indispensable reference tool for technical professionals around the globe. Written by professionals for professionals, this book is a complete reference for engineers, covering a broad range of topics. It is the combined effort of 96 engineers, scientists, educators, and other recognized specialists in the fields of electronics, radio, computer, and communications technology. By providing an abundance of information on essential, need-to-know topics without heavy emphasis on complicated mathematics, Reference Data for Engineers is an absolute "must-have" for every engineer who requires comprehensive electrical, electronics, and communications data at his or her fingertips. Featured in the Ninth Edition is updated coverage on intellectual property and patents, probability and design, antennas, power electronics, rectifiers, power supplies, and properties of materials. Useful information on units, constants and conversion factors, active filter design, antennas, integrated circuits, surface acoustic wave design, and digital signal processing is also included. The Ninth Edition also offers new knowledge in the fields of satellite technology, space communication, microwave science, telecommunication, global positioning systems, frequency data, and radar.* Widely acclaimed as the most practical reference ever published for a wide range of electronics and computer professionals, from technicians through post-graduate engineers.* Provides a great way to learn or review the basics of various technologies, with a minimum of tables, equations, and other heavy math.
Author: L. B. Freund
Author: L. B. Freund
Author: Yangyuan Wang
Author: Robert Leon Opila
Author: William Greig
Author: Gennady Sh Gildenblat
Author: Michael Reisch
Author: 
Author: United States. Patent and Trademark Office
Author: 
Author: Mac E. Van Valkenburg