Author: Darwin E. Kroll
Publisher:
ISBN: 9781423580324
Category :
Languages : en
Pages : 65
Book Description
The high thermal conductivity of chemically vapor deposited CVD diamond (up to 2000 W/m/K) and its low dielectric constant (approx. 5.6) makes it highly desirable for use as an electronics packaging substrate material. To make CVD diamond amenable to thick film metallization via standard industrial processes, a thin gamma-alumina layer (approx. 1500A) was grown on diamond by reactive evaporation of Al in oxygen over a very thin Cr intermediate-layer (approx. 700A). Commercially available silver and gold thick films were applied to CVD diamond both with and without the metal-oxide inter-layer. The interfaces were characterized by scanning electron microscopy, energy dispersive x-ray spectroscopy, Auger electron spectroscopy and transmission electron microscopy. The intermediate oxide layer was found to result in well-adherent, chemically bonded interfaces between the metallization and the CVD diamond substrates for both Ag and Au pastes. Without the oxide layer, the Ag paste was found to have very poor adhesion to the substrate. The Au paste, developed for non-oxide substrates, was found to be nominally adherent to the CVDD substrate, although quantitative adhesion comparisons between the metallization with and without the oxide inter-layer was not obtained. Microstructural and chemical characterization studies of the interface suggest that the alumina layer enhances adhesion by producing chemically-reacted/solid-solution species across all interfaces and is therefore a very versatile approach for thick film metallization of CVDD.
Metallization of CVD Diamond Using Metal Oxide Intermediate Layers for Electronics Packaging
Electronic Packaging and Interconnection Handbook 4/E
Author: Charles A. Harper
Publisher: McGraw Hill Professional
ISBN: 9780071430487
Category : Technology & Engineering
Languages : en
Pages : 1002
Book Description
Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?
Publisher: McGraw Hill Professional
ISBN: 9780071430487
Category : Technology & Engineering
Languages : en
Pages : 1002
Book Description
Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?
Atomic Layer Deposition for Semiconductors
Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Science Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1360
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1360
Book Description
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2240
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2240
Book Description
Journal of the Electrochemical Society
Metallurgical Coatings and Thin Films 1994
Author:
Publisher:
ISBN:
Category : Corrosion and anti-corrosives
Languages : en
Pages : 564
Book Description
Publisher:
ISBN:
Category : Corrosion and anti-corrosives
Languages : en
Pages : 564
Book Description
Metals Abstracts
Ceramic Abstracts
Author: American Ceramic Society
Publisher:
ISBN:
Category : Ceramics
Languages : en
Pages : 1150
Book Description
Publisher:
ISBN:
Category : Ceramics
Languages : en
Pages : 1150
Book Description