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Author: Dirk Ortloff Publisher: Springer Science & Business Media ISBN: 3709107067 Category : Technology & Engineering Languages : en Pages : 216
Book Description
This book provides the methodological background to directing cooperative product engineering projects in a micro and nanotechnology setting. The methodology is based on well-established methods like PRINCE2 and StageGate, which are supplemented by best practices that can be individually tailored to the actual nature and size of the project at hand. This book is intended for everyone who takes an active role in either practical product engineering or in teaching it. This includes project and product management staff and program management offices in companies working on innovation projects, those active in innovation, as well as professors and students in engineering and management.
Author: Dirk Ortloff Publisher: Springer Science & Business Media ISBN: 3709107067 Category : Technology & Engineering Languages : en Pages : 216
Book Description
This book provides the methodological background to directing cooperative product engineering projects in a micro and nanotechnology setting. The methodology is based on well-established methods like PRINCE2 and StageGate, which are supplemented by best practices that can be individually tailored to the actual nature and size of the project at hand. This book is intended for everyone who takes an active role in either practical product engineering or in teaching it. This includes project and product management staff and program management offices in companies working on innovation projects, those active in innovation, as well as professors and students in engineering and management.
Author: Alissa M. Fitzgerald Publisher: Springer Nature ISBN: 3030617092 Category : Technology & Engineering Languages : en Pages : 282
Book Description
Drawing on their experiences in successfully executing hundreds of MEMS development projects, the authors present the first practical guide to navigating the technical and business challenges of MEMS product development, from the initial concept stage all the way to commercialization. The strategies and tactics presented, when practiced diligently, can shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially when resources are limited. MEMS Product Development illuminates what it really takes to develop a novel MEMS product so that innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.
Author: Stepan Lucyszyn Publisher: Cambridge University Press ISBN: 1139491660 Category : Technology & Engineering Languages : en Pages : 441
Book Description
An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
Author: Nadim Maluf Publisher: Artech House ISBN: 9781580535915 Category : Technology & Engineering Languages : en Pages : 312
Book Description
Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Author: Gabriel M. Rebeiz Publisher: John Wiley & Sons ISBN: 0471462888 Category : Technology & Engineering Languages : en Pages : 512
Book Description
Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.
Author: Allyson L. Hartzell Publisher: Springer Science & Business Media ISBN: 144196018X Category : Technology & Engineering Languages : en Pages : 300
Book Description
The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Author: Eun Sok Kim Publisher: McGraw Hill Professional ISBN: 1264257597 Category : Technology & Engineering Languages : en Pages : 415
Book Description
A complete guide to MEMS engineering, fabrication, and applications This comprehensive engineering guide shows, step by step, how to incorporate cutting-edge microelectromechanical (MEMS) technology to enable internet-of-things (IoT) and artificial intelligence (AI) functionality in your designs. Written by an experienced educator and microelectronics expert, Fundamentals of Microelectromechanical Systems (MEMS) clearly explains the latest technologies and methods. Real-world examples, illustrations, and in-depth questions and problems reinforce key topics throughout. Readers will also take a look at the future of MEMS in the workforce and explore MEMS research and development. Coverage includes: Basic microfabrication Micromachining Transduction principles RF and optical MEMS Mechanics and inertial sensors Thin film properties and SAW/BAW sensors Pressure sensors and microphones Piezoelectric films Material properties expressed as tensor Microfluidic systems and BioMEMS Power MEMS Electronic noises, interface circuits, and oscillators
Author: John A. Pelesko Publisher: CRC Press ISBN: 1420035290 Category : Mathematics Languages : en Pages : 382
Book Description
Designing small structures necessitates an a priori understanding of various device behaviors. The way to gain such understanding is to construct, analyze, and interpret the proper mathematical model. Through such models, Modeling MEMS and NEMS illuminates microscale and nanoscale phenomena, thereby facilitating the design and optimization o
Author: Jan Korvink Publisher: William Andrew ISBN: 0815518285 Category : Technology & Engineering Languages : en Pages : 993
Book Description
Does MEMS technology offer advantages to your company's products? Will miniature machines on a chip solve your application objectives for ôsmaller, better, cheaper, and faster'ö If you are a product development engineer or manager, the decision to design a MEMS device implies having an application and market. This book offers you a practical guide to making this important business decision. Here, both veterans and newcomers to MEMS device design will get advice on evaluating MEMS for their business, followed by guidance on selecting solutions, technologies and design support tools. You will see how experts from around the world have explored MEMS possibilities and achieved new breakthrough devices such as RF-MEMS for mobile telecommunications, micro-optics for internet hardware, catheter-based minimal-invasive operating theatre tools, and in vivo monitoring of exact dosage of medication in ailing patients. This handbook offers a wealth of analytical techniques treating problematic areas such as alternative designs reliability, packaging, and cost effectiveness.
Author: John H. Lau Publisher: McGraw Hill Professional ISBN: 0071627928 Category : Technology & Engineering Languages : en Pages : 577
Book Description
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
Author: Dirk Ortloff
Author: Dirk Ortloff
Author: Alissa M. Fitzgerald
Author: Stepan Lucyszyn
Author: Nadim Maluf
Author: Gabriel M. Rebeiz
Author: Allyson L. Hartzell
Author: Eun Sok Kim
Author: John A. Pelesko
Author: Jan Korvink
Author: John H. Lau