Author: P. Rai-Choudhury Publisher: SPIE Press ISBN: 9780819437167 Category : Technology & Engineering Languages : en Pages : 544
Book Description
The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Author: M. Edward Motamedi Publisher: SPIE Press ISBN: 9780819450210 Category : Technology & Engineering Languages : en Pages : 640
Book Description
This book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.
Author: Prosenjit Rai-Choudhury Publisher: ISBN: 9780819495983 Category : Languages : en Pages : 528
Book Description
Cost, size, speed, weight, and precision are driving the miniaturization of mechanical systems. This book presents a detailed look at two micromachining technologies that have evolved from the integrated circuits industry: MEMS (micro-electromechanical systems) and MOEMS (micro systems with a strong optical component). It is useful as a professional reference, technology user's guide, and as a textbook.
Author: Richard A. Crocombe Publisher: John Wiley & Sons ISBN: 1119636434 Category : Science Languages : en Pages : 608
Book Description
The most comprehensive resource available on the many applications of portable spectrometers, including material not found in any other published work Portable Spectroscopy and Spectrometry: Volume Two is an authoritative and up-to-date compendium of the diverse applications for portable spectrometers across numerous disciplines. Whereas Volume One focuses on the specific technologies of the portable spectrometers themselves, Volume Two explores the use of portable instruments in wide range of fields, including pharmaceutical development, clinical research, food analysis, forensic science, geology, astrobiology, cultural heritage and archaeology. Volume Two features contributions by a multidisciplinary team of experts with hands-on experience using portable instruments in their respective areas of expertise. Organized both by instrumentation type and by scientific or technical discipline, 21 detailed chapters cover various applications of portable ion mobility spectrometry (IMS), infrared and near-infrared (NIR) spectroscopy, Raman and x-ray fluorescence (XRF) spectroscopy, smartphone spectroscopy, and many others. Filling a significant gap in literature on the subject, the second volume of Portable Spectroscopy and Spectrometry: Features a significant amount of content published for the first time, or not available in existing literature Brings together work by authors with assorted backgrounds and fields of study Discusses the central role of applications in portable instrument development Covers the algorithms, calibrations, and libraries that are of critical importance to successful applications of portable instruments Includes chapters on portable spectroscopy applications in areas such as the military, agriculture and feed, hazardous materials (HazMat), art conservation, and environmental science Portable Spectroscopy and Spectrometry: Volume Two is an indispensable resource for developers of portable instruments in universities, research institutes, instrument companies, civilian and government purchasers, trainers, operators of portable instruments, and educators and students in portable spectroscopy courses.
Author: Masayoshi Esashi Publisher: John Wiley & Sons ISBN: 3527823255 Category : Technology & Engineering Languages : en Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Cornelius T. Leondes Publisher: Springer Science & Business Media ISBN: 0387257861 Category : Technology & Engineering Languages : en Pages : 2142
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Author: Zhuoqing Yang Publisher: Springer Nature ISBN: 303079749X Category : Technology & Engineering Languages : en Pages : 312
Book Description
This book begins by introducing new and unique fabrication, micromachining, and integration manufacturing methods for MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) devices, as well as novel nanomaterials for sensor fabrications. The second section focuses on novel sensors based on these emerging MEMS/NEMS fabrication methods, and their related applications in industrial, biomedical, and environmental monitoring fields, which makes up the sensing layer (or perception layer) in IoT architecture. This authoritative guide offers graduate students, postgraduates, researchers, and practicing engineers with state-of-the-art processes and cutting-edge technologies on MEMS /NEMS, micro- and nanomachining, and microsensors, addressing progress in the field and prospects for future development. Presents latest international research on MEMS/NEMS fabrication technologies and novel micro/nano sensors; Covers a broad spectrum of sensor applications; Written by leading experts in the field.
Author: P. Rai-Choudhury
Author: 
Author: M. Edward Motamedi
Author: Prosenjit Rai-Choudhury
Author: 
Author: Richard A. Crocombe
Author: Masayoshi Esashi
Author: Cornelius T. Leondes
Author: Hakan Urey
Author: Zhuoqing Yang