Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Optical pressure sensor based on the principle of Fabry Perot interferometry have been developed and fabricated using the technique of silicon-to-silicon anodic bonding. This MEMS based Fabry Perot pressure sensor is then integrated onto an optical fiber by a novel technique of anodic bonding. In this novel technique of anodic bonding we use ultra6thin silicon of thickness 10æm to bond the optical fiber to the sensor. Tensile bond strength measurements are performed to characterize the fiber to silicon bond as a function of bonding temperature. The ultra-thin silicon plays the role of a stress reducing layer which helps bonding an optical fiber to silicon having conventional thickness. The pressure sensing membrane is formed by 8æm thick ultra-thin silicon which allows having membrane with uniform thickness over the entire wafer and eliminates the need for bulk etching. The pressure sensor integrated onto an optical fiber is tested for static response and for response with change in ambient temperature. The sensor response changes with the temperature due to change in the physical dimension of the sensor. Also, the effect of multimode fiber on the fringe visibility of the interferometer is studied. The fringe visibility of the sensor is lower than the theoretical fringe visibility due to the fact that one of the mirrors of the Fabry Perot interferometer formed by silicon membrane is not flat but a curved surface.
MEMS Based Fabry Perot Pressure Sensor and Non-adhesive Integration on Optical Fiber by Anodic Bonding
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Optical pressure sensor based on the principle of Fabry Perot interferometry have been developed and fabricated using the technique of silicon-to-silicon anodic bonding. This MEMS based Fabry Perot pressure sensor is then integrated onto an optical fiber by a novel technique of anodic bonding. In this novel technique of anodic bonding we use ultra6thin silicon of thickness 10æm to bond the optical fiber to the sensor. Tensile bond strength measurements are performed to characterize the fiber to silicon bond as a function of bonding temperature. The ultra-thin silicon plays the role of a stress reducing layer which helps bonding an optical fiber to silicon having conventional thickness. The pressure sensing membrane is formed by 8æm thick ultra-thin silicon which allows having membrane with uniform thickness over the entire wafer and eliminates the need for bulk etching. The pressure sensor integrated onto an optical fiber is tested for static response and for response with change in ambient temperature. The sensor response changes with the temperature due to change in the physical dimension of the sensor. Also, the effect of multimode fiber on the fringe visibility of the interferometer is studied. The fringe visibility of the sensor is lower than the theoretical fringe visibility due to the fact that one of the mirrors of the Fabry Perot interferometer formed by silicon membrane is not flat but a curved surface.
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Optical pressure sensor based on the principle of Fabry Perot interferometry have been developed and fabricated using the technique of silicon-to-silicon anodic bonding. This MEMS based Fabry Perot pressure sensor is then integrated onto an optical fiber by a novel technique of anodic bonding. In this novel technique of anodic bonding we use ultra6thin silicon of thickness 10æm to bond the optical fiber to the sensor. Tensile bond strength measurements are performed to characterize the fiber to silicon bond as a function of bonding temperature. The ultra-thin silicon plays the role of a stress reducing layer which helps bonding an optical fiber to silicon having conventional thickness. The pressure sensing membrane is formed by 8æm thick ultra-thin silicon which allows having membrane with uniform thickness over the entire wafer and eliminates the need for bulk etching. The pressure sensor integrated onto an optical fiber is tested for static response and for response with change in ambient temperature. The sensor response changes with the temperature due to change in the physical dimension of the sensor. Also, the effect of multimode fiber on the fringe visibility of the interferometer is studied. The fringe visibility of the sensor is lower than the theoretical fringe visibility due to the fact that one of the mirrors of the Fabry Perot interferometer formed by silicon membrane is not flat but a curved surface.
Mems/Nems
Author: Cornelius T. Leondes
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Publisher: Springer Science & Business Media
ISBN: 0387257861
Category : Technology & Engineering
Languages : en
Pages : 2142
Book Description
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Digest of Technical Papers
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 796
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 796
Book Description
Wafer Bonding
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524
Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524
Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Understanding Smart Sensors
Author: Randy Frank
Publisher: Artech House Publishers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 296
Book Description
"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology". -- I&CS
Publisher: Artech House Publishers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 296
Book Description
"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology". -- I&CS
MEMS
Author: Mohamed Gad-el-Hak
Publisher: CRC Press
ISBN: 1420036556
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection
Publisher: CRC Press
ISBN: 1420036556
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection
MEMS Materials and Processes Handbook
Author: Reza Ghodssi
Publisher: Springer Science & Business Media
ISBN: 0387473181
Category : Technology & Engineering
Languages : en
Pages : 1211
Book Description
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Publisher: Springer Science & Business Media
ISBN: 0387473181
Category : Technology & Engineering
Languages : en
Pages : 1211
Book Description
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Integrated Ring Resonators
Author: Dominik G. Rabus
Publisher: Springer
ISBN: 3540687882
Category : Science
Languages : en
Pages : 270
Book Description
The optical filter is resonator based. The required passband shape of ring resonator-filters can be custom designed by the use of configurations of various ring coupled resonators. This book describes the current state-of-the-art on these devices. It provides an in-depth knowledge of the simulation, fabrication and characterization of ring resonators for use as example filters, lasers, sensors.
Publisher: Springer
ISBN: 3540687882
Category : Science
Languages : en
Pages : 270
Book Description
The optical filter is resonator based. The required passband shape of ring resonator-filters can be custom designed by the use of configurations of various ring coupled resonators. This book describes the current state-of-the-art on these devices. It provides an in-depth knowledge of the simulation, fabrication and characterization of ring resonators for use as example filters, lasers, sensors.
Nanotechnology-Enabled Sensors
Author: Kourosh Kalantar-zadeh
Publisher: Springer Science & Business Media
ISBN: 0387680233
Category : Technology & Engineering
Languages : en
Pages : 502
Book Description
Nanotechnology provides tools for creating functional materials, devices, and systems by controlling materials at the atomic and molecular scales and making use of novel properties and phenomena. Nanotechnology-enabled sensors find applications in several fields such as health and safety, medicine, process control and diagnostics. This book provides the reader with information on how nanotechnology enabled sensors are currently being used and how they will be used in the future in such diverse fields as communications, building and facilities, medicine, safety, and security, including both homeland defense and military operations.
Publisher: Springer Science & Business Media
ISBN: 0387680233
Category : Technology & Engineering
Languages : en
Pages : 502
Book Description
Nanotechnology provides tools for creating functional materials, devices, and systems by controlling materials at the atomic and molecular scales and making use of novel properties and phenomena. Nanotechnology-enabled sensors find applications in several fields such as health and safety, medicine, process control and diagnostics. This book provides the reader with information on how nanotechnology enabled sensors are currently being used and how they will be used in the future in such diverse fields as communications, building and facilities, medicine, safety, and security, including both homeland defense and military operations.