MEMS Aluminum Nitride Technology for Inertial Sensors PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download MEMS Aluminum Nitride Technology for Inertial Sensors PDF full book. Access full book title MEMS Aluminum Nitride Technology for Inertial Sensors by Gabriele Vigevani. Download full books in PDF and EPUB format.
Author: Gabriele Vigevani Publisher: ISBN: Category : Languages : en Pages : 390
Book Description
The design and fabrication of MEMS Inertial Sensors (both accelerometers and gyroscopes) made of Aluminum Nitride (AlN) is described in this dissertation. The goal of this work is to design and fabricate inertial sensors based on c-axis oriented AlN polycrystalline thin films. AlN is a post-CMOS compatible piezoelectric material widely used for acoustic resonators, such Bulk Acoustic Wave (BAW) and Lamb Wave Resonators (LWR). In this work we develop the design techniques necessary to obtain inertial sensors with AlN thin film technology. Being able to use AlN as structural material for both acoustic wave resonator and sensing elements is key to achieve the three level integration of RF-MEMS components, sensing elements and CMOS in the same chip. Using AlN as integration platform is particularly suitable for large consumer emerging markets where production costs are the major factor that determine a product success. In order to achieve a platform integration, the first part of this work focuses on the fabrication process: starting from the fabrication technology used for LWR devices, this work shows that by slightly modifying some of the fabrication steps it is possible to obtain MEMS accelerometers and gyroscopes with the same structural layers used for LWR. In the second part of this work, an extensive analysis, performed with analytical and Finite Element Models (FEM), is developed for beam and ring based structures. These models are of great importance as they provide tools to understand the physics of lateral piezoelectric beam actuation and the major limitations of this technology. Based on the models developed for beam based resonators, we propose two designs for Double Ended Tuning Fork (DETF) based accelerometers. In the last part of the dissertation, we show the experimental results and the measurements performed on actual devices. As this work shows analytically and experimentally, there are some fundamental constraints that limit the ultimate sensitivity of piezoelectric sensors based on resonating beam structures. Although the limitations of the structures here considered cannot achieve tactical grade sensitivities, this research proves that it is possible to achieve performances close to those required by large consumer electronics. This work proves that AlN based platforms can be a great opportunity for future developments in IMU and in general for MEMS integrated solutions.
Author: Gabriele Vigevani Publisher: ISBN: Category : Languages : en Pages : 390
Book Description
The design and fabrication of MEMS Inertial Sensors (both accelerometers and gyroscopes) made of Aluminum Nitride (AlN) is described in this dissertation. The goal of this work is to design and fabricate inertial sensors based on c-axis oriented AlN polycrystalline thin films. AlN is a post-CMOS compatible piezoelectric material widely used for acoustic resonators, such Bulk Acoustic Wave (BAW) and Lamb Wave Resonators (LWR). In this work we develop the design techniques necessary to obtain inertial sensors with AlN thin film technology. Being able to use AlN as structural material for both acoustic wave resonator and sensing elements is key to achieve the three level integration of RF-MEMS components, sensing elements and CMOS in the same chip. Using AlN as integration platform is particularly suitable for large consumer emerging markets where production costs are the major factor that determine a product success. In order to achieve a platform integration, the first part of this work focuses on the fabrication process: starting from the fabrication technology used for LWR devices, this work shows that by slightly modifying some of the fabrication steps it is possible to obtain MEMS accelerometers and gyroscopes with the same structural layers used for LWR. In the second part of this work, an extensive analysis, performed with analytical and Finite Element Models (FEM), is developed for beam and ring based structures. These models are of great importance as they provide tools to understand the physics of lateral piezoelectric beam actuation and the major limitations of this technology. Based on the models developed for beam based resonators, we propose two designs for Double Ended Tuning Fork (DETF) based accelerometers. In the last part of the dissertation, we show the experimental results and the measurements performed on actual devices. As this work shows analytically and experimentally, there are some fundamental constraints that limit the ultimate sensitivity of piezoelectric sensors based on resonating beam structures. Although the limitations of the structures here considered cannot achieve tactical grade sensitivities, this research proves that it is possible to achieve performances close to those required by large consumer electronics. This work proves that AlN based platforms can be a great opportunity for future developments in IMU and in general for MEMS integrated solutions.
Author: Md Sajeeb Rayhan Publisher: ISBN: Category : Microelectromechanical systems Languages : en Pages : 145
Book Description
Microelectromechanical systems (MEMS) sensors using ultrathin aluminum nitride (AlN) film were developed and fabricated using conventional photolithography techniques in the class 100 clean room with a view to integrate them in flexible substrates along with flexible electronics. The MEMS sensors were designed, analytically modeled, fabricated and characterized. Some of the MEMS sensors were only designed and simulated using finite element method (FEM) for the scope of the dissertation. These MEMS sensors can be applied to many applications such as automobile, robotics, biomedical, biometrics, health condition monitoring, GPS tracking devices, smartphones and aircrafts. MEMS pressure sensors using AlN based piezoelectric film were designed, fabricated and characterized in the form of array of cantilever based structures. A 300 nm thick ultrathin and flexible AlN film with a feature size of ~12 [micron] which was deposited using DC reactive magnetron sputtering system and sandwiched between two electrodes to induce cantilever shaped structures acted as the sensing element of the cantilever sensors. After fabrication, several cantilevers were chosen for electrical characterization. The pressure sensors were characterized in a probe station system to measure the piezoelectric voltage signals and power spectral densities. With the help of simulation results, numerical modeling was also carried out to find the theoretical output voltage ranges and sensitivity of the cantilevers. The simple and flexible cantilevers form the basis for future piezoelectric energy harvesters, pressure sensors, fingerprint sensors and accelerometers using ultrathin AlN film those can be integrated on a system-on-chip (SoC) circuit. Initially, the ultrathin AlN films were developed by changing the deposition temperature and Ar/N2 gas flow ratio and characterized using SEM, XRD and EDX to analyze the quality of the film. Stress analyses were taken into consideration to check the mechanical strength and reliability of the pressure sensors. In addition, bending performance was also analyzed by calculating the radius of curvature (ROC) of the cantilevers. Finally, noise performance was also analyzed. Ultra-thin AlN based novel flexible MEMS fingerprint sensors were designed using finite element method i.e., CoventorWare® with a view to improve the pixel resolution and, hence, the quality of scanned fingerprint image. Two different sized pixel dimensions were used for the design of three fingerprint sensors; they are: a) FPS725A b) FPS725B, and c) FPS1016. The pixel dimension for FPS725A and FPS725B was 35 [micron] by 35 [micron]. The pixel feature was equivalent to an imaging resolution of 725 dot-perinch (dpi). The other sensor had a pixel size of 25 [micron] by 25 [micron] and was equivalent to an imaging resolution of 1016 dpi. In both type of sensors, 200 nm thick, ultrathin AlN film was used as the sensing element. The difference between FPS725A and FPS725B was the location of the sensing element. In FPS725A, AlN film was deposited on top of Al2O3 diaphragm while in FPS725B, AlN was located inside the diaphragm. The fabrications process flow will be discussed in details in the fingerprint sensor chapter. In brief, the fingerprint sensors were comprised of array of pixels and each pixel was made of a cavity like structure which was basically an aluminum oxide (Al2O3) based structure. Underneath the cavity like structure, there was an adjacent piezoelectric plate or film which was sandwiched between two metal electrodes. The total area of the sensors is identical and considered to be 15 mm by 15 mm for practical use. Piezoelectric output voltage with respect to various applied finger pressure were calculated using the stress contour found from the simulation results. Finally, piezoelectric response for each sensor for different finger pressure was found from the slope of the piezoelectric voltage versus applied force plot. The average piezoelectric responses are found to be 225.74 V/N, 115.58 V/N, and 125.52 V/N for FPS725A, FPS725B, and FPS1016, respectively. Stress analysis and noise performance of the sensors were studied. For practical use, the CMOS readouts will be taken from the Silicon substrate through the electrical metallization of pure metal electrodes which will be covered in the chapter. An AlN based piezoelectric z-axis MEMS accelerometer was designed and simulated using CoventorWare®. Modal harmonic analysis was carried out and the simulated resonant frequency was found to be 2.26 kHz. Various loads were applied on top proof mass of the accelerometer ranging from 1g to 10g. Piezoelectric output voltages due to applied loads were calculated. The voltages ranged from 0.00082 V to 0.000082 V. The piezoelectric response or sensitivity was also calculated and found to be 0.000082 V/N. Noise performances was also analyzed and noise equivalent acceleration (NEA) was calculated. Noise equivalent acceleration was found to be 0.253 g/[square root]Hz.
Author: Markku Tilli Publisher: Elsevier ISBN: 012817787X Category : Technology & Engineering Languages : en Pages : 1028
Book Description
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author: Reza Mahmoudi Publisher: CRC Press ISBN: 1351832409 Category : Technology & Engineering Languages : en Pages : 391
Book Description
Advanced concepts for wireless communications offer a vision of technology that is embedded in our surroundings and practically invisible, but present whenever required. Although the use of deep submicron CMOS processes allows for an unprecedented degree of scaling in digital circuitry, it complicates the implementation and integration of traditional RF circuits. The requirement for long operating life under limited energy supply also poses severe design constraints, particularly in critical applications in commerce, healthcare, and security. These challenges call for innovative design solutions at the circuit and system levels. Low Power Emerging Wireless Technologies addresses the crucial scientific and technological challenges for the realization of fully integrated, highly efficient, and cost-effective solutions for emerging wireless applications. Get Insights from the Experts on Wireless Circuit Design The book features contributions by top international experts in wireless circuit design representing both industry and academia. They explore the state of the art in wireless communication for 3G and 4G cellular networks, millimeter-wave applications, wireless sensor networks, and wireless medical technologies. The emphasis is on low-power wireless applications, RF building blocks for wireless applications, and short-distance and beam steering. Topics covered include new opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. Exploit the Potential behind Emerging Green Wireless Technologies A must for anyone serious about future wireless technologies, this multidisciplinary book discusses the challenges of emerging power-efficient applications. Written for practicing engineers in the wireless communication field who have some experience in integrated circuits, it is also a valuable resource for graduate students.
Author: Robert Osiander Publisher: CRC Press ISBN: 1420027743 Category : Technology & Engineering Languages : en Pages : 400
Book Description
The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.
Author: Harmeet Bhugra Publisher: Springer ISBN: 3319286889 Category : Technology & Engineering Languages : en Pages : 423
Book Description
This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.
Author: Vanni Lughi Publisher: ISBN: 9780542681318 Category : Languages : en Pages : 530
Book Description
High quality aluminum nitride films, meeting all the requirements for the fabrication of the resonators, were deposited at low temperature (
Author: Moussa Karama Publisher: Trans Tech Publications Ltd ISBN: 303813502X Category : Technology & Engineering Languages : en Pages : 110
Book Description
Volume is indexed by Thomson Reuters BCI (WoS). With energy costs increasing, the gains to be made from weight-saving are most significant in the aerospace domain, but such gains are clearly also advantageous for road transport and this is even beginning to be recognised in shipbuilding. Consequently, improved reliability and resistance to degradation and durability in severe environments are always important requirements. Thus the development of composites, nano-composites and refractory alloys having specific properties has become a key factor in industrial and technological progress. Another challenge is the recyclability of advanced materials, as reflected by the emergence of projects involving thermoplastic-matrix composite fuselages. Moreover, the incorporation of biopolymers extracted from diverse raw materials can be an interesting alternative route to attaining the objective of 100% biodegradability. The purpose of these topics is to bring together researchers and specialists from universities and industry who are working on new composites and nano-composites, titanium alloys, etc., as well as structural characterisation using destructive or non-destructive testing, numerical analysis and composite processes.
Author: Gabriele Vigevani
Author: Gabriele Vigevani
Author: Md Sajeeb Rayhan
Author: Ulrich Schmid
Author: CMOS Emerging Technologies Research
Author: Markku Tilli
Author: Reza Mahmoudi
Author: Robert Osiander
Author: Harmeet Bhugra
Author: Vanni Lughi
Author: Moussa Karama