MECL System Design Handbook PDF Download

Author: William R. Blood
Publisher:
ISBN:
Category : Digital integrated circuits
Languages : en
Pages : 264

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Author: William R. Blood
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 284

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Author: John Black
Publisher: Elsevier
ISBN: 0080519024
Category : Computers
Languages : en
Pages : 1113

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Book Description
The System Engineer's Handbook, written by the developer of the VME bus system and some of the most knowledgeable experts in the computer industry, is the most comprehensive guide available for the VME bus standard. It is the system engineer's guide to building high performance multiprocessor systems. This book contains complete copies of VME bus and VXI bus specifications and applications information, enabling a system engineer to purchase state-of-the-art board components from specialized manufacturers and assemble them into a fully-functional system.

Author: Kenneth L. Kaiser
Publisher: CRC Press
ISBN: 9780849320873
Category : Technology & Engineering
Languages : en
Pages : 2714

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Book Description
As the number of electrical devices in use continues to grow, so do the challenges of ensuring the electromagnetic compatibility (EMC) of products and systems. Fortunately, engineers have at their disposal an array of approximations, models, and rules-of-thumb to help them meet those challenges. Unfortunately, the number of these tools and guidelines is overwhelming, and worse still is the thought of investigating their origins and confirming their results. The Electromagnetic Compatibility Handbook is an unprecedented compilation of the many approximations, guidelines, models, and rules-of-thumb used in EMC analyses, complete with their sources and their limitations. The book presents these in an efficient question-and-answer format and incorporates an extremely comprehensive set of tables and figures. The author has either derived from basic principles or obtained and verified from their original sources all of the expressions in the tables. Mathcad was used to generate most of the plots and solve many of the equations, and the author includes the Mathcad programs for many of these so users can clearly see the variable assignments, assumptions, and equations. Designed to be of long-lasting value to engineers, researchers, and students, the Electromagnetic Compatibility Handbook is ideal both for quick reference and as a textbook for upper-level and graduate electrical engineering courses.

Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 1351835548
Category : Technology & Engineering
Languages : en
Pages : 937

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Book Description
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author: N. Edward Walker
Publisher: Elsevier
ISBN: 0080503926
Category : Technology & Engineering
Languages : en
Pages : 265

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Book Description
"...A book that should be on the shelf of every digital or analog electronic-system designer." - Frank Goodenough, Electronic Design This Handbook offers design engineers and managers immediately useful, meat-and-potatoes techniques for achieving design validation by analysis in an easy-to-read style. The book contains numerous useful and interesting tips for electronics circuit designers. Examples of rectifier circuits, power supplies, digital timing, thermal analysis, grounding and layout, and EMI/noise control are examined in detail with fully worked-out numerical examples. If you need to create reliable, cost-effective, optimized designs, The Design Analysis Handbook provides a practical framework for integrating quality into the design process from start to finish. The methodology used is called Worst Case Analysis Plus (WCA+), a design-validation tool that demands thoroughness and analytical thinking by the user. A guide to assessing and validating circuit design, The Design Analysis Handbook presents processes and mathematical tools in a straightforward, real-world manner. Unique features of the approach include chapters on safety, bad science, and surviving high-pressure design projects. N. Edward Walker is the president of Design/Analysis Consultants, Inc., based in Tampa, Florida. The Handbook is based on DACI's extensive experience in the design and analysis of highly-reliable electronic systems.Straightforward guide to practical design validationShows how to avoid design hazardsProvides framework for integrating quality with the design process

Author: John H. Moore
Publisher: Cambridge University Press
ISBN: 1139478656
Category : Science
Languages : en
Pages : 649

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Book Description
Unrivalled in its coverage and unique in its hands-on approach, this guide to the design and construction of scientific apparatus is essential reading for every scientist and student of engineering, and physical, chemical, and biological sciences. Covering the physical principles governing the operation of the mechanical, optical and electronic parts of an instrument, new sections on detectors, low-temperature measurements, high-pressure apparatus, and updated engineering specifications, as well as 400 figures and tables, have been added to this edition. Data on the properties of materials and components used by manufacturers are included. Mechanical, optical, and electronic construction techniques carried out in the lab, as well as those let out to specialized shops, are also described. Step-by-step instruction supported by many detailed figures, is given for laboratory skills such as soldering electrical components, glassblowing, brazing, and polishing.

Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 456

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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 9780442012366
Category : Computers
Languages : en
Pages : 920

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Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Author: Peter A. Sandborn
Publisher: Springer Science & Business Media
ISBN: 9780792393955
Category : Technology & Engineering
Languages : en
Pages : 290

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Book Description
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.