Mechanical design for electronics product-preliminary thermal PDF Download

Author: Jerry Wang
Publisher: Jerry Wang
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 10

View

Book Description
Preliminary thermal design guide for electronics product.

Author: Jerry Wang
Publisher: Jerry Wang
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 137

View

Book Description
This is a summary of my over 15 years work as a mechanical design engineer in electronics industry. The contents include: · The task, design considerations, developing steps of mechanical design for electronics product. · The frequent using mechanical components design guideline. · Specific function design, such as seal, EMC, screw torque definition and calculation. · Tolerance analysis. · Preliminary thermal distribution design. · Other topics such as DFM, failure root cause analysis, etc. Components design guideline is the major part of this book. The components are categorized according manufacturing method, such as sheet metal, plastic injection, die casting, Aluminium extrusion, over mold, rubber keypad and standards components selection. In each individual guideline, the typical structure is used to include the main items of: · Characters about advantages and disadvantages. · Brief description of typical manufacturing process and related equipment. · Frequent using material. · Structure design considerations. · Typical features. · Tolerance. · Frequent defects and analysis. The aim of this book is to provide guide and support to the junior mechanical design engineers in electronics industry, and I assume the readers have mechanical knowledge and reasonable design practise. So I excluded the massive basics that can be found from popular manuals or standards to make the book brief and wish could bring the readers practical help.

Author: Jerry Wang
Publisher: Jerry Wang
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 15

View

Book Description
General design considerations and steps

Author: James W. Dally
Publisher: College House Enterprises
ISBN: 9780976241331
Category : Electronic packaging
Languages : en
Pages : 648

View

Book Description

Author: Vinay Divakar
Publisher: GRIN Verlag
ISBN: 365673089X
Category : Technology & Engineering
Languages : en
Pages : 37

View

Book Description
Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.

Author: O. James Magrini
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 20

View

Book Description

Author: Cheryl Tulkoff
Publisher: John Wiley & Sons
ISBN: 1119109388
Category : Technology & Engineering
Languages : en
Pages : 400

View

Book Description
An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.

Author: American Society of Mechanical Engineers. Winter Annual Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 118

View

Book Description

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 518

View

Book Description

Author: American Society of Mechanical Engineers. Winter Meeting
Publisher:
ISBN: 9780791805862
Category : Electronic apparatus and appliances
Languages : en
Pages : 101

View

Book Description